Erosion properties of mud beds deposited in laboratory settling columns

Author(s):  
D.G. Lintern ◽  
G.C. Sills ◽  
N. Feates ◽  
W. Roberts
Keyword(s):  
Coatings ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1448
Author(s):  
Xuan Zhang ◽  
Yuandong Chen ◽  
Wenqiao Zhang ◽  
Yanli Zhong ◽  
Pei Lei ◽  
...  

Transparent conductive films (TCFs) have received much research attention in the area of aeronautical canopies. However, bad wear, corrosion resistance and weak erosion performance of TCFs dramatically limit their scalable application in the next-generation aeronautical and optoelectronic devices. To address these drawbacks, three types of optically transparent coatings, including acrylic, silicone and polyurethane (PU) coatings were developed and comparatively investigated ex situ in terms of Taber abrasion, nanoindentation and sand erosion tests to improve the wear-resistance and sand erosion abilities of ITO-coated PMMA substrates. To elucidate the sand erosion failure of the coatings, the nanoindentation technique was employed for quantitative assessment of the shape recovery abilities under probe indentation. Results show that the PU topcoats can greatly enhance the sand erosion properties, which were superior to those of acrylic and silicone topcoats. This result can be attributed to the good toughness and self-healing properties of PU topcoats. Additionally, high hardness and good Taber abrasion properties of the ITO films and silicone topcoats did not have an obvious or affirmatory effect on the sand erosion abilities, based on their brittleness and irreparable properties under sand erosion.


2019 ◽  
Vol 6 (10) ◽  
pp. 106578
Author(s):  
Yue Ding ◽  
Yi Feng ◽  
Hao Zhao ◽  
Gang Qian ◽  
Xuebing Zhang ◽  
...  

2019 ◽  
Vol 39 (6) ◽  
pp. 521-521
Author(s):  
Hieu M. Nguyen ◽  
Karin R. Bryan ◽  
Conrad A. Pilditch ◽  
Vicki G. Moon

2002 ◽  
Vol 732 ◽  
Author(s):  
Jin Amanokura ◽  
Yasuo Kamigata ◽  
Masanobu Habiro ◽  
Hiroshi Suzuki ◽  
Masanobu Hanazono

AbstractAbrasive-free Cu CMP solutions have been developed to reduce micro-scratches and obtain minimized dishing and erosion properties. During the development of the solutions, some electrochemical examinations were performed. One of the most instructive knowledge was obtained through the Tafel plot. Other attractive data were obtained through Cu complex film analysis. On the basis of these studies were developed and released newly formulated abrasive-free Cu CMP solutions with a high Cu removal rate and excellent topography performance. Mechanism of polishing by applying abrasive-free Cu CMP solutions is also discussed in this paper.


2017 ◽  
Vol 32 (12) ◽  
pp. 2381-2388 ◽  
Author(s):  
Guangzhu Liu ◽  
Jiandong Xing ◽  
Shengqiang Ma ◽  
Yong Wang ◽  
Wenqian Guan

Abstract


2008 ◽  
Vol 24 (8) ◽  
pp. 1160-1174 ◽  
Author(s):  
Ryosuke Akahori ◽  
Mark W. Schmeeckle ◽  
David J. Topping ◽  
Theodore S. Melis

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