Hybrid Systems-in-Foil

Mapping Intimacies ◽

10.1017/9781108985116 ◽

2021 ◽

Author(s):

Mourad Elsobky ◽

Joachim N. Burghartz

Keyword(s):

Hybrid Systems ◽

Flexible Electronics ◽

Printed Electronics ◽

Electronic Systems ◽

Electronic Components ◽

Polymeric Substrate ◽

Silicon Chips ◽

Flexible Packaging ◽

Minimum Number ◽

Chip Fabrication

Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.

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Exothermic and Recursive Reaction of Self-Sinterable Silver Ink for Flexible Electronics

MRS Proceedings ◽

10.1557/opl.2013.680 ◽

2013 ◽

Vol 1567 ◽

Cited By ~ 1

Author(s):

Dong-Youn Shin ◽

Sangki Chun

Keyword(s):

Silver Nanoparticles ◽

Low Temperature ◽

Flexible Electronics ◽

Printed Electronics ◽

Exothermic Reaction ◽

Conductive Ink ◽

Crucial Issue ◽

Polymeric Substrate ◽

Silver Ink ◽

Silver Carboxylate

ABSTRACTFor the construction of highly conductive printed electrodes on a polymeric substrate with a low glass transition temperature, the development of a low temperature sinterable conductive ink has been a crucial issue in printed electronics and display applications. In this work, we introduce a novel type of self-sinterable silver ink, whose sintering is triggered at a low temperature and completed with the aid of its own exothermic reaction, and propose its exothermic reaction mechanism. Although individual components of this self-sinterable silver ink, Ag2O and silver carboxylate, exhibit endothermic behaviors, their mixture form shows a strong exothermic reaction when heated at 150 °C. It is found that the dissociated form of the used silver carboxylate contributes to the reduction of Ag2O to Ag through its recursive reaction and produces silver nanoparticles. The major source of an exothermic reaction results from the nucleation and fusion of silver nanoparticles.

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Toward Manufacturing Low-Cost, Large-Area Electronics

MRS Bulletin ◽

10.1557/mrs2006.121 ◽

2006 ◽

Vol 31 (6) ◽

pp. 471-475 ◽

Cited By ~ 12

Author(s):

Marc Chason ◽

Daniel R. Gamota ◽

Paul W. Brazis ◽

Krishna Kalyanasundaram ◽

Jie Zhang ◽

...

Keyword(s):

Printed Electronics ◽

Low Cost ◽

Consumer Products ◽

Electronic Systems ◽

Printed Wiring Board ◽

Large Area ◽

Active Devices ◽

Materials Research ◽

Wiring Board ◽

Large Area Electronics

AbstractDevelopments originally targeted toward economical manufacturing of telecommunications products have planted the seeds for new opportunities such as low-cost, large-area electronics based on printing technologies. Organic-based materials systems for printed wiring board (PWB) construction have opened up unique opportunities for materials research in the fabrication of modular electronic systems.The realization of successful consumer products has been driven by materials developments that expand PWB functionality through embedded passive components, novel MEMS structures (e.g., meso-MEMS, in which the PWB-based structures are at the milliscale instead of the microscale), and microfluidics within the PWB. Furthermore, materials research is opening up a new world of printed electronics technology, where active devices are being realized through the convergence of printing technologies and microelectronics.

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Preparation of Conductive Nanosilver Ink and its Application on RFID Tags

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.904.121 ◽

2014 ◽

Vol 904 ◽

pp. 121-125 ◽

Cited By ~ 1

Author(s):

Ji Lan Fu ◽

Ya Ling Li ◽

Li Xin Mo ◽

Yu Wang ◽

Jun Ran ◽

...

Keyword(s):

Flexible Electronics ◽

Screen Printing ◽

Surface Resistance ◽

Large Scale ◽

Printed Electronics ◽

Silver Content ◽

Rfid Tags ◽

Rheological Characteristics ◽

Conductive Ink ◽

New Type

The recent dramatic progress in the printed electronics and flexible electronics, due to the universality of the substrates including the foldable and stretchable substrates, has opened a new prospect in the field of future electronics. In this paper, silver nanospheres in large-scale are synthesized, the nanosilver ink with 63.88% silver content are prepared and a new type of highly conductive and far identify distance RFID tags are manufactured. Especially there are no resin and other additives containing in our conductive ink which satisfy the rheological characteristics and process of screen printing. The tags exhibit the best radiation performance own to there is no high temperature sintering in need. The surface resistance of the tags could be 80 mΩ/, and the identify distance reach to 6.0m. Keywords:silver nanoparticles, conductive ink, RFID tags

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Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

ASME 2009 InterPACK Conference, Volume 1 ◽

10.1115/interpack2009-89247 ◽

2009 ◽

Cited By ~ 5

Author(s):

Khalid Alzoubi ◽

Susan Lu ◽

Bahgat Sammakia ◽

Mark Poliks

Keyword(s):

Thin Film ◽

Thin Films ◽

Polyethylene Terephthalate ◽

Flexible Electronics ◽

Electrical Resistance ◽

Thermal Stresses ◽

Electronic Systems ◽

Total Width ◽

Flexible Substrates ◽

Polyethylene Naphthalate

Flexible electronics represent an emerging area in the electronics packaging and systems integration industry with the potential for new product development and commercialization in the near future. Manufacturing electronics on flexible substrates will produce low cost devices that are rugged, light, and flexible. However, electronic systems are vulnerable to failures caused by mechanical and thermal stresses. For electronic systems on flexible substrates repeated stresses below the ultimate tensile strength or even below the yield strength will cause failures in the thin films. It is known that mechanical properties of thin films are different from those of bulk materials; so, it is difficult to extrapolate bulk material properties on thin film materials. The objective of this work is to study the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated flexible substrates were studied, including thin film thickness, temperature, and humidity. A series of experiments for sputter-deposited copper on PET substrates were performed. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. High magnification images were obtained to observe the crack initiation and propagation in the metal film. Statistical analysis based on design of experiments concepts was performed to identify the main factors and factor’s interaction that affect the life of a thin-film coated substrate. The results of the experiments showed that the crack starts in the middle of the sample and slowly grows toward the edges. Electrical resistance increases slightly during the test until the crack length covers about 90% of the total width of the sample where a dramatic increase in the resistance takes place.

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Stochastic hybrid systems models for performance and reliability analysis of power electronic systems

Reliability of Power Electronic Converter Systems ◽

10.1049/pbpo080e_ch11 ◽

2016 ◽

pp. 287-302

Author(s):

Dhople ◽

Dominguez-Garcia ◽

Krein

Keyword(s):

Reliability Analysis ◽

Hybrid Systems ◽

Electronic Systems ◽

Power Electronic ◽

Stochastic Hybrid Systems ◽

Systems Models

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Printed electronics for low-cost electronic systems: Technology status and application development

ESSCIRC 2008 - 34th European Solid-State Circuits Conference ◽

10.1109/esscirc.2008.4681785 ◽

2008 ◽

Cited By ~ 16

Author(s):

Vivek Subramanian ◽

Josephine B. Chang ◽

Alejandro de la Fuente Vornbrock ◽

Daniel C. Huang ◽

Lakshmi Jagannathan ◽

...

Keyword(s):

Printed Electronics ◽

Low Cost ◽

Electronic Systems ◽

Application Development

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Co-Firing Technology for Buried Resistors

2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2 ◽

10.1115/ipack2003-35336 ◽

2003 ◽

Author(s):

G. Yadagiri ◽

K. K. Goswami ◽

K. S. Gurumurthy ◽

Satyam ◽

K. N. Shankara

Keyword(s):

Thick Film ◽

Firing Process ◽

Electronic Systems ◽

Electronic Components ◽

Sequential Processing ◽

Intermediate Layers ◽

Firing Technology ◽

And Performance ◽

Embedded Resistors ◽

Made In

The complexity and performance of the electronic components and systems is increasing and placing greater demands on compact packaging and interconnection technologies. Multilayer thick film technology is one of the important technologies adopted in the miniaturization of electronic systems. Normally only interconnections are made in the intermediate layers. The possibility of fabricating resistors along with interconnections in the intermediate layers using conventional thick film materials using co-firing process has been examined in this paper. Normally multilayer structures are fabricated by printing / drying / firing of each layer separately starting from the bottom most layer (sequential processing). In this process the bottom layers undergo sintering many times. To avoid many firing cycles and to save power and processing time, a study is taken up to examine the effects of co-firing on the multilayer structure with embedded resistors. The results of the study are presented in this paper.

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Development of Real-Time Measurement Platform for Stretchable and Rollable Functions of Flexible Electronics under Multiple Dynamic Loads

Micromachines ◽

10.3390/mi11010106 ◽

2020 ◽

Vol 11 (1) ◽

pp. 106

Author(s):

Chang-Chun Lee ◽

Jui-Chang Chuang ◽

Ruei-Ci Shih ◽

Chi-Wei Wang

Keyword(s):

Flexible Electronics ◽

Electronic Devices ◽

Sine Wave ◽

Wearable Devices ◽

Dynamic Loads ◽

Inspection System ◽

Mechanical Reliability ◽

Electronic Components ◽

Real Time Measurement ◽

Applied Fields

Mainstream next generation electronic devices with miniaturized structures and high levels of performance are needed to meet the characteristic requirements of electronics with flexible and stretchable capabilities. Accordingly, several applied fields of innovative electronic component techniques, such as wearable devices, foldable curtain-like displays, and flexible hybrid electronic (FHE) biosensors, are considered. This study presents a novel inspection system with multifunctions of stressing tensile and bending mechanical loads to acquire the stretchable and rollable characteristics of soft specimens. The performance of the proposed measurement platform using samples of three different geometric types is evaluated in terms of its stretchability. The results show a remarkable enhancement of mechanical reliability when the sine wave geometric structure is used. A symmetrical sine wave-shaped sample is designed to measure performance under cyclic rolling. The proposed measurement platform of flexible electronics meets the testing requirements of mechanical reliability for the development of future flexible electronic components and FHE products.

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