Microvoid formation in the grain boundary phase of a sintered Si-Al-O-N ceramic after static fatigue testing
Sintered silicon nitride materials are currently being considered for use in hot flow-path components of gas turbine engines because of their good thermal shock and oxidation resistance as well as strength at high temperatures. These materials, however, have been shown to be susceptible to slow crack growth (SCG) and creep at elevated temperatures. The high-temperature properties are largely determined by the intergranular phase which is composed of the sintering aid residue and may be either amorphous or crystalline depending on sintering and annealing parameters. The silicon nitride examined in this study had reportedly been sintered with Y2O3 (5.86%) and Al2O3 (2.2%) to produce a composite of β'Si3N4 crystals in an amorphous Y-Si-Al-O-N matrix. Static fatique tests performed on test bars of this material resulted in failures originating, via SCG and creep within the intergranular phase, above certain stress loads at 1000°C. These sites and other areas through the cross section of the test bars were examined by SEM and AEM to determine the microstructure and chemistry related to these failure phenomena.