TEM characterization of dislocation reduction processes in GaAs/Si

1989 ◽  
Vol 47 ◽  
pp. 590-591
Author(s):  
R.A. Herring ◽  
P.N. Uppal ◽  
S.P. Svensson ◽  
J.S. Ahearn
Keyword(s):  
Lattice Mismatch ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Growth Interface ◽  
Dislocation Reduction ◽  
Dislocation Densities ◽  
Threading Dislocation Density ◽  
Interfacial Dislocations ◽  
Strained Layer Superlattices

A high density of interfacial dislocations are needed at the GaAs/Si interface to alleviate the 4% lattice mismatch between GaAs and Si. Some remnant dislocations thread through the epilayer and follow the growth interface. Current growth methods are not able to obtain acceptable threading dislocation densities (104 – 105) for devices. Many methods can be used to reduce the number of threading dislocations which include misorienting the substrate to enhance the slip of dislocations on specific [110]{111} planes, annealing during and after growth, and adding strained layer superlattices (SLS's) to block dislocations. Conventional TEM (CTEM), performed using a JEM 100c, has been used to characterize threading dislocations in the epilayer of a GaAs/Si material where in situ thermal annealing and SLS's force dislocation reactions and thereby reduce the threading dislocation density. Using TEM we have viewed dislocations under many two-beam diffraction conditions and with the help of a stereogram have determined their Burgers vectors (b), line directions (u) and habit planes (R).

Nucleation of misfit and threading dislocations in GaSb/GaAs(001) heterostructure

1996 ◽  
Vol 54 ◽  
pp. 946-947
Author(s):  
W. Qian ◽  
M. Skowronski ◽  
R. Kaspi ◽  
M. De Graef
Keyword(s):  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Misfit Dislocations ◽  
Extended Defects ◽  
Large Lattice ◽  
Threading Dislocation Density ◽  
Small Lattice ◽  
Large Lattice Mismatch

GaSb thin film grown on GaAs is a promising substrate for fabrication of electronic and optical devices such as infrared photodetectors. However, these two materials exhibit a 7.8% lattice constant mismatch which raises concerns about the amount of extended defects introduced during strain relaxation. It was found that, unlike small lattice mismatched systems such as InxGa1-xAs/GaAs or GexSi1-x/Si(100), the GaSb/GaAs interface consists of a quasi-periodic array of 90° misfit dislocations, and the threading dislocation density is low despite its large lattice mismatch. This paper reports on the initial stages of GaSb growth on GaAs(001) substrates by molecular beam epitaxy (MBE). In particular, we discuss the possible formation mechanism of misfit dislocations at the GaSb/GaAs(001) interface and the origin of threading dislocations in the GaSb epilayer.GaSb thin films with nominal thicknesses of 5 to 100 nm were grown on GaAs(001) by MBE at a growth rate of about 0.8 monolayers per second.

X-Ray Topography Characterization of Large Diameter AlN Single Crystal Substrates

2020 ◽  
Vol 1004 ◽  
pp. 63-68
Author(s):  
Rafael Dalmau ◽  
Jeffrey Britt ◽  
Hao Yang Fang ◽  
Balaji Raghothamachar ◽  
Michael Dudley ◽  
...  
Keyword(s):  
Single Crystal ◽  
Large Diameter ◽  
Grazing Incidence ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
X Ray ◽  
Dislocation Densities ◽  
Transmission Geometry ◽  
Threading Dislocation Density

Large diameter aluminum nitride (AlN) substrates, up to 50 mm, were manufactured from single crystal boules grown by physical vapor transport (PVT). Synchrotron-based x-ray topography (XRT) was used to characterize the density, distribution, and type of dislocations. White beam topography images acquired in transmission geometry were used to analyze basal plane dislocations (BPDs) and low angle grain boundaries (LAGBs), while monochromatic beam, grazing incidence images were used to analyze threading dislocations. Boule diameter expansion, without the introduction of LAGBs around the periphery, was shown. A 48 mm substrate with a uniform threading dislocation density below 7.0 x 102 cm-2 and a BPD of 0 cm-2, the lowest dislocation densities reported to date for an AlN single crystal this size, was demonstrated.

Comparison of Buffer Layer Grading Approaches in InGaAs/GaAs (001)

2020 ◽  
Vol 29 (01n04) ◽  
pp. 2040002
Author(s):  
Johanna Raphael ◽  
Tedi Kujofsa ◽  
J. E. Ayers
Keyword(s):  
Lattice Mismatch ◽  
Strain Relaxation ◽  
Lower Surface ◽  
Dislocation Dynamics ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Dislocation Densities ◽  
Threading Dislocation Density ◽  
Dislocations Density ◽  
Graded Structures

Metamorphic semiconductor devices often utilize compositionally-graded buffer layers for the accommodation of the lattice mismatch with controlled threading dislocation density and residual strain. Linear or step-graded buffers have been used extensively in these applications, but there are indications that sublinear, superlinear, S-graded, or overshoot graded structures could offer advantages in the control of defect densities. In this work we compare linear, step-graded, and nonlinear grading approaches in terms of the resulting strain and dislocations density profiles using a state-of-the-art model for strain relaxation and dislocation dynamics. We find that sublinear grading results in lower surface dislocation densities than either linear or superlinear grading approaches.

Dislocation Density Reduction in GaAs Epilayers on Si Using Strained Layer Superlattices

1989 ◽  
Vol 160 ◽  
Author(s):  
S. Sharan ◽  
J. Narayan ◽  
J. C. C. Fan
Keyword(s):  
Dislocation Density ◽  
Defect Density ◽  
Full Potential ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Strained Layer ◽  
Density Reduction ◽  
Threading Dislocation Density ◽  
Superlattice Structures ◽  
Strained Layer Superlattices

AbstractDefects such as dislocations and interfaces play a crucial role in the performance of heterostracture devices. The full potential of GaAs on Si heterostructures can only be realized by controlling the defect density. The reduction of threading dislocations by the use of strained layer superlattices has been studied in these heterostructures. Several superlattice structures have been used to reduce the density of threading dislocations in the GaAs epilayer. The use of strained layer superlattices in conjunction with rapid thermal annealing was most effective in reducing threading dislocation density. Transmission electron microscopy has been used to study the dislocation density reduction and the interaction of threading dislocations with the strained layers. A model has been developed based on energy considerations to determine the critical thickness required for the bending of threading dislocations.

Defect Reduction in Mocvd Grown Si/GaAs

1988 ◽  
Vol 116 ◽  
Author(s):  
M.M. Al-Jassim ◽  
Takashi Nishioka ◽  
Yoshio Itoh ◽  
Akio Yamamoto ◽  
Masafumi Yamaguchi
Keyword(s):  
Layer Thickness ◽  
Threading Dislocations ◽  
Defect Reduction ◽  
Closed Loops ◽  
Si Substrates ◽  
Dislocation Densities ◽  
Low Pressure Mocvd ◽  
Strained Layer Superlattices ◽  
Lattice Matched

AbstractThe effectiveness of thermal annealing and strained layer superlattices (SLS's) in defect reduction in Si/GaAs structures was studied. The GaAs layers were grown on (100) Si substrates by low pressure MOCVD. They were evaluated by TEM, HREM, EBIC and PL. As-grown layers contained dislocation densities in the 108-109 cm−2 range, depending on the layer thickness. Post-growth and in situ annealing were performed on a wide variety of these structures. TEM examination showed that in situ annealing was more effective as it resulted in confining a large portion of the threading dislocations to the interface region. Furthermore, the interaction of threading dislocations to form closed loops was evident. Additionally, the effect of GaAs/GaInAs and GaInAs/GaAsP SLS's on dislocation bending was investigated. The former SLS, although not lattice matched to GaAs, proved more effective.

Defect-Engineered Graded GexSi1-x Buffers on Si (001) with Extreme Low Threading Dislocation Density

1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Threading Dislocation Density

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.

Residual Strain and Defect Analysis in as Grown and Annealed SiGe Layers

1991 ◽  
Vol 220 ◽  
Author(s):  
A. R. Powell ◽  
R. A. Kubiak ◽  
T. E. Whall ◽  
E. H. C. Parker ◽  
D. K. Bowen
Keyword(s):  
Residual Strain ◽  
Buffer Layers ◽  
Limited Area ◽  
Threading Dislocation ◽  
Misfit Dislocations ◽  
High Temperature Anneal ◽  
Dislocation Densities ◽  
Acceptable Quality ◽  
Strained Sige

ABSTRACTIn this paper we address the problem of producing SiGe buffer layers of acceptable quality for the growth of symmetrically strained SiGe structures. Initially we consider SiGe layers grown to well beyond the metastable critical thickness and examine the degree of residual strain both as - grown and post anneal. The defect levels in metastable SiGe layers following high temperature anneal were also studied. A buffer layer was grown consisting of stacked metastable SiGe layers each of which is annealed in situ prior to the growth of the next layer and terminating with a 0.45 SiGe alloy. This produces nearly fully relaxed 1.15pim thick structures with threading dislocation densities of 4 × 106cm−2. Limited area growth on Si suggests that elastically relaxed material free of both threading and misfit dislocations can be produced.

Improved Structural Quality and Carrier Decay Times in GaN Epitaxy on SiN and TiN Porous Network Templates

2006 ◽  
Vol 527-529 ◽  
pp. 1505-1508
Author(s):  
Ümit Özgür ◽  
Y. Fu ◽  
Cole W. Litton ◽  
Y.T. Moon ◽  
F. Yun ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Structural Quality ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
Porous Network ◽  
X Ray ◽  
Radiative Efficiency ◽  
Decay Times ◽  
Threading Dislocation Density

Improved structural quality and radiative efficiency were observed in GaN thin films grown by metalorganic chemical vapor deposition on in situ-formed SiN and TiN porous network templates. The room temperature carrier decay time of 1.86 ns measured for a TiN network sample is slightly longer than that for a 200 μm-thick high quality freestanding GaN (1.73 ns). The linewidth of the asymmetric X-Ray diffraction (XRD) (1012) peak decreases considerably with the use of SiN and TiN layers, indicating the reduction in threading dislocation density. However, no direct correlation is yet found between the decay times and the XRD linewidths, suggesting that point defect and impurity related nonradiative centers are the main parameters affecting the lifetime.

SiH4 exposure of GaN surfaces: A useful tool for highlighting dislocations

2005 ◽  
Vol 892 ◽  
Author(s):  
Rachel Oliver ◽  
Menno J. Kappers ◽  
Joy Sumner ◽  
Ranjan Datta ◽  
Colin J. Humphreys
Keyword(s):  
Atomic Force Microscopy ◽  
Vapour Phase ◽  
Threading Dislocation ◽  
Vapour Phase Epitaxy ◽  
Force Microscopy ◽  
Atomic Force ◽  
Dislocation Densities ◽  
Metal Organic ◽  
Organic Vapour

AbstractFast-turnaround, accurate methods for the assessment of threading dislocation densities in GaN are an essential research tool. Here, we present an in-situ surface treatment for use in MOVPE (metal-organic vapour phase epitaxy) growth, in which GaN is exposed to a SiH4 flux at 860 °C in the presence of NH3. Subsequent characterisation by atomic force microscopy shows that the treatment is effective in increasing edge and mixed/screw dislocation pit sizes on both n- and p-type material, and on partially coalesced GaN layers.

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