Heterogeneous solid-state reactions between MgO(00l) and iron oxide

1996 ◽  
Vol 54 ◽  
pp. 642-643
Author(s):  
Matthew T. Johnson ◽  
Hermann B. Schmalzried ◽  
C. Barry Carter
Keyword(s):  
Electron Microscopy ◽  
Iron Oxide ◽  
Solid State ◽  
Electric Fields ◽  
Stress Fields ◽  
Solid State Reactions ◽  
Concentration Gradients ◽  
Transmission Electron ◽  
Microscopy Techniques ◽  
Heterogeneous Solid

The transport properties of the diffusing species in heterogeneous solid-state reactions are affected by concentration gradients, temperature gradients, stress fields and electric fields. In the present study, interfacial reactions between thin films of iron oxide and bulk monocrystalline MgO{001}, resulting in the formation of the spinel product MgFe2O4, were carried out separately as a function of time and temperature, applied external electric field and partial pressure of oxygen. Electron microscopy techniques have been utilized to investigate the reaction kinetics and interface morphology.The reaction couples were produced by means of pulsed-laser deposition (PLD). The setup for PLD has been described elsewhere. By depositing high-quality oxide films on bulk substrates, a well controlled geometry can be fabricated which is conducive to the study of fundamental processes in solid-state reactions. In producing the reaction couples, 600nm of iron oxide was deposited on monocrystalline MgO{001}. The reaction couples were then reacted under varying conditions and analyzed, using both scanning (SEM) and transmission electron microscopy (TEM).

Solid-State Reactions in Fe/Si Multilayer Nanofilms

2014 ◽  
Vol 215 ◽  
pp. 144-149 ◽  
Author(s):  
Sergey M. Zharkov ◽  
Roman R. Altunin ◽  
Evgeny T. Moiseenko ◽  
Galina M. Zeer ◽  
Sergey N. Varnakov ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Electron Diffraction ◽  
Solid State Reaction ◽  
Room Temperature ◽  
Solid State Reactions ◽  
Transmission Electron ◽  
Reaction Processes

Solid-state reaction processes in Fe/Si multilayer nanofilms have been studied in situ by the methods of transmission electron microscopy and electron diffraction in the process of heating from room temperature up to 900ºС at a heating rate of 8-10ºС/min. The solid-state reaction between the nanolayers of iron and silicon has been established to begin at 350-450ºС increasing with the thickness of the iron layer.

Distinctive characteristics of solid-state reactions in mechanically alloyed Ti–Al–Si–C powder mixtures

2005 ◽  
Vol 20 (2) ◽  
pp. 375-385 ◽  
Author(s):  
J.B. Zhou ◽  
K.P. Rao
Keyword(s):  
Electron Microscopy ◽  
Solid State ◽  
Powder Mixture ◽  
Energy Dispersive Spectrometry ◽  
Solid State Reactions ◽  
X Ray Diffraction ◽  
Mechanically Alloyed ◽  
Powder Mixtures ◽  
Transmission Electron ◽  
Submicron Scale

Ti–Al–Si–C powder mixtures of two different compositions, namely, 58Ti–30Al–6Si–6C (at.%) and 50Ti–15Al–20Si–15C (at.%), were mechanically alloyed to investigate the solid-state reactions during such a process. The mechanically alloyed powders were characterized as a function of milling time by x-ray diffraction (XRD), scanning electron microscopy, energy-dispersive spectrometry, and transmission electron microscopy (TEM). XRD results showed that solid solutions of Ti were formed for a powder mixture of 58Ti–30Al–6Si–6C in about 20 h of milling, whereas Ti5(Al,Si)3 and Ti(Al,Si)C compounds started to form in the powder mixture of 50Ti–15Al–20Si–15C within just 5 h of milling. TEM observations demonstrated that the particle sizes were of nano and submicron scale in both cases. This investigation indicated that in mechanically alloyed Ti–Al–Si–C powder mixtures, the main solid-state reactions are due to interdiffusion and mechanically induced self-propagating reaction.

Non-Alloyed Ohmic Contacts to n-GaAs Using Epitaxial Ge Layers

1985 ◽  
Vol 54 ◽  
Author(s):  
T. Sawada ◽  
W. X. Chen ◽  
E. D. Marshall ◽  
K. L. Kavanagh ◽  
T. F. Kuech ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Ohmic Contacts ◽  
Solid Phase ◽  
Solid State Reactions ◽  
Solid Phase Epitaxy ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Shallow Junctions

ABSTRACTAlloyed ohmic contacts (i.e. Au-Ge-Ni) to n-GaAs lead to non-planar interfaces which are unsuitable for devices with shallow junctions and small dimensions. In this study, the fabrication of non-alloyed ohmic contacts (via solid state reactions) is investigated. A layered structure involving the solid phase epitaxy of Ge using a transport medium (PdGe) is shown to produce low (1 — 5 × 10∼6Ω cm2) and reproducible values of contact resistivity. The resultant interface is shown to be abrupt by cross-sectional transmission electron microscopy.

Wafer Bonding for Hybrid Circuit Technology Using Solid-State Reactions

1993 ◽  
Vol 314 ◽  
Author(s):  
Z. Ma ◽  
G. L. Zhou ◽  
T. C. Shen ◽  
M. E. Lin ◽  
K. C. Hsieh ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Solid State ◽  
Low Temperature ◽  
Wafer Bonding ◽  
Solid Phase ◽  
Solid State Reactions ◽  
Transmission Electron ◽  
Hybrid Circuit ◽  
Circuit Technology ◽  
As Solid Phase

AbstractIn this study, we report a new wafer bonding technique for the integration of GaAs- and InP-based optical devices with prefabricated Si electronic devices in hybrid circuit technology. This technique uses a Au-Ge eutectic alloy as the bonding materials between GaAs and Si wafers, and between InP and Si wafers. This process takes advantage of the low temperature solid-state reactions at GaAs/Au-Ge, InP/Au-Ge, and Si/Au-Ge interfaces. The bonding was carried out by annealing the samples at 280–300°C in an alloying furnace. The reliability of the joined wafers was evaluated by both cleavage test and standard thermal cycling test. The joining interfaces were characterized by scanning electron microscopy and transmission electron microscopy. The results reveal that the bonding is achieved by low temperature reactions at the GaAs/Au-Ge and InP/Au-Ge interfaces as well as solid-phase epitaxial regrowth at the Si interfaces. The joined structure has very good integrity.

In-Situ Annealing Transmission Electron Microscopy Study of Pd/Ge/Pd/GaAs Interfacial Reactions

1999 ◽  
Vol 589 ◽  
Author(s):  
F. Radulescu ◽  
J.M. Mccarthy ◽  
E. A. Stach
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Epitaxial Growth ◽  
Ohmic Contact ◽  
Ion Beam ◽  
Solid State Reactions ◽  
Cross Sectional ◽  
Transmission Electron

AbstractIn-situ TEM annealing experiments on the Pd (20 nm) / a-Ge (150 nm) / Pd (50 nm) GaAs ohmic contact system have permitted real time determination of the evolution of contact microstructure. As-deposited cross-sectional samples of equal thickness were prepared using a focused ion beam (FIB) method and then subjected to in-situ annealing at temperatures between 130-400 °C. Excluding Pd-GaAs interactions, four sequential solid state reactions were observed during annealing of the Pd:Ge thin films. First, interdiffusion of the Pd and Ge layers occurred, followed by formation of the hexagonal Pd2Ge phase. This hexagonal phase then transformed into orthorhombic PdGe, followed by solid state epitaxial growth of Ge at the contact / GaAs interface. The kinetics of the solid state reactions, which occur during ohmic contact formation, were determined by measuring the grain growth rates associated with each phase from the videotape observations. These data agreed with a previous study that measured the activation energies through a differential scanning calorimetry (DSC) method. We established that the Ge transport to the GaAs interface was dependent upon the grain size of the PdGe phase. The nucleation and growth of this phase was demonstrated to have a significant effect on the solid phase epitaxial growth of Ge on GaAs. These findings allowed us to engineer an improved two step annealing procedure that would control the shape and size of the PdGe grains. Based on these results, we have established the suitability of combining FIB sample preparation with in-situ cross-sectional transmission electron microscopy (TEM) annealing for studying thin film solid-state reactions.

Kinetics of Metallic Glass Formation by Solid State Reactions

1985 ◽  
Vol 57 ◽  
Author(s):  
K. Samwer ◽  
H Schröder ◽  
M. Moske
Keyword(s):  
Electron Microscopy ◽  
Solid State ◽  
Metallic Glass ◽  
Glass Formation ◽  
Amorphous Layer ◽  
Solid State Reactions ◽  
Diffusion Couples ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Kinetics Of

AbstractMetallic glass formation by solid state reactions has been observed in multilayer Zr-Co diffusion couples. The kinetics of the reaction are limited by the diffusion of the Co-atoms in the growing amorphous layer, at least for longer times, as shown by cross-sectional transmission electron microscopy and resistance measurements. The latter one provides the interdiffusion constant and the activation energy of about 1.1 eV. Deposition of the crystalline layers at 77 K results in an enhanced amorphization process in the first stage of the reaction and gives preliminary answers about the nucleation of the amorphous phase.

Current Status of Solid-State X-Ray Systems

1985 ◽  
Vol 43 ◽  
pp. 158-161
Author(s):  
Martin Peckerar ◽  
Anastasios Tousimis
Keyword(s):  
Solid State ◽  
Electric Fields ◽  
Spectral Lines ◽  
Current Status ◽  
Mobile Charge ◽  
Electron Hole ◽  
X Ray ◽  
Sensing Systems ◽  
Transmission Electron ◽  
Electron Microscopes

Solid state x-ray sensing systems have been used for many years in conjunction with scanning and transmission electron microscopes. Such systems conveniently provide users with elemental area maps and quantitative chemical analyses of samples. Improvements on these tools are currently sought in the following areas: sensitivity at longer and shorter x-ray wavelengths and minimization of noise-broadening of spectral lines. In this paper, we review basic limitations and recent advances in each of these areas. Throughout the review, we emphasize the systems nature of the problem. That is. limitations exist not only in the sensor elements but also in the preamplifier/amplifier chain and in the interfaces between these components.Solid state x-ray sensors usually function by way of incident photons creating electron-hole pairs in semiconductor material. This radiation-produced mobile charge is swept into external circuitry by electric fields in the semiconductor bulk.

Transmission Electron Microscopy of an Aluminum-Silver-Stainless Steel Solid State Bond

1985 ◽  
Vol 43 ◽  
pp. 172-173
Author(s):  
M. J. Carr ◽  
J. F. Shewbridge ◽  
T. O. Wilford
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Solid State ◽  
Specimen Preparation ◽  
Dimensional Control ◽  
Tem Analysis ◽  
Metal Parts ◽  
Dissimilar Metal ◽  
Transmission Electron ◽  
Short Time

Strong solid state bonds are routinely produced between physical vapor deposited (PVD) silver coatings deposited on sputter cleaned surfaces of two dissimilar metal parts. The low temperature (200°C) and short time (10 min) used in the bonding cycle are advantageous from the standpoint of productivity and dimensional control. These conditions unfortunately produce no microstructural changes at or near the interface that are detectable by optical, SEM, or microprobe examination. Microstructural problems arising at these interfaces could therefore easily go undetected by these techniques. TEM analysis has not been previously applied to this problem because of the difficulty in specimen preparation. The purpose of this paper is to describe our technique for preparing specimens from solid state bonds and to present our initial observations of the microstructural details of such bonds.

Observation of solid-state reaction between a thin yttria film and a (0001) α-alumina substrate

1994 ◽  
Vol 52 ◽  
pp. 644-645
Author(s):  
J. R. Heffelfinger ◽  
C. B. Carter
Keyword(s):  
Electron Microscopy ◽  
Solid State ◽  
Solid State Reaction ◽  
Yttrium Aluminum Garnet ◽  
Secondary Phase ◽  
Ceramic Composites ◽  
Alumina Substrate ◽  
Transmission Electron ◽  
Alumina Fibers ◽  
Optical Applications

Transmission-electron microscopy (TEM), scanning-electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDS) were used to investigate the solid-state reaction between a thin yttria film and a (0001) α-alumina substrate. Systems containing Y2O3 (yttria) and Al2O3 (alumina) are seen in many technologically relevant applications. For example, yttria is being explored as a coating material for alumina fibers for metal-ceramic composites. The coating serves as a diffusion barrier and protects the alumina fiber from reacting with the metal matrix. With sufficient time and temperature, yttria in contact with alumina will react to form one or a combination of phases shown by the phase diagram in Figure l. Of the reaction phases, yttrium aluminum garnet (YAG) is used as a material for lasers and other optical applications. In a different application, YAG is formed as a secondary phase in the sintering of AIN. Yttria is added to AIN as a sintering aid and acts as an oxygen getter by reacting with the alumina in AIN to form YAG.

Electric-Field Effects on Reactions Between Oxides

1997 ◽  
Vol 481 ◽  
Author(s):  
Matthew T. Johnson ◽  
Shelley R. Gilliss ◽  
C. Barry Carter
Keyword(s):  
Solid State ◽  
Electric Field ◽  
Elevated Temperatures ◽  
Ionic Current ◽  
Reaction Rates ◽  
Solid State Reactions ◽  
Interfacial Stability ◽  
Electric Field Effects ◽  
Thin Film Diffusion ◽  
Microscopy Techniques

ABSTRACTThin films of In2O3 and Fe2O3 have been deposited on (001) MgO using pulsed-laser deposition (PLD). These thin-film diffusion couples were then reacted in an applied electric field at elevated temperatures. In this type of solid-state reaction, both the reaction rate and the interfacial stability are affected by the transport properties of the reacting ions. The electric field provides a very large external driving force that influences the diffusion of the cations in the constitutive layers. This induced ionic current causes changes in the reaction rates, interfacial stability and distribution of the phases. Through the use of electron microscopy techniques the reaction kinetics and interface morphology have been investigated in these spinel-forming systems, to gain a better understanding of the influence of an electric field on solid-state reactions.

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