scholarly journals Using EBSD to Map Domain Structures in Ferroelectrics

2008 ◽  
Vol 16 (5) ◽  
pp. 18-19
Author(s):  
Ian MacLaren ◽  
Muhammad Umar Farooq ◽  
Rafael Villaurrutia

Electron backscatter diffraction (EBSD) has undergone a rapid transformation in the past 15 years from a curiosity and a minority interest into an important part of our arsenal of microstructure characterisation techniques. In this time, it has been very widely applied in metallurgy, especially in understanding the influence of processing on local crystallographic textures and on boundary populations. More recently, it has been used in a diverse range of different fields including semiconductors, ceramics, geological materials and even palaeontology. In this article we will show how EBSD can yield invaluable information about domain structures in ferroelectrics.

2008 ◽  
Vol 104 (2) ◽  
pp. 024111 ◽  
Author(s):  
M. U. Farooq ◽  
R. Villaurrutia ◽  
I. MacLaren ◽  
T. L. Burnett ◽  
T. P. Comyn ◽  
...  

Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


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