Systematic Regeneration of Waste Sulfuric Acid in Semiconductor Manufacturing Using Batch Vacuum Distillation

2014 ◽  
Vol 53 (20) ◽  
pp. 8543-8552 ◽  
Author(s):  
Seongho Park ◽  
Jaeheum Jung ◽  
Kiwook Song ◽  
Krishnadash S. Kshetrimayum ◽  
Changhyun Jeong ◽  
...  
Keyword(s):  
Sulfuric Acid ◽  
Semiconductor Manufacturing ◽  
Vacuum Distillation ◽  
Batch Vacuum

Optimal operation strategy of batch vacuum distillation for sulfuric acid recycling process

2014 ◽  
Vol 71 ◽  
pp. 104-115 ◽  
Author(s):  
Jaeheum Jung ◽  
Kiwook Song ◽  
Seongho Park ◽  
Jonggeol Na ◽  
Chonghun Han
Keyword(s):  
Sulfuric Acid ◽  
Vacuum Distillation ◽  
Optimal Operation ◽  
Operation Strategy ◽  
Recycling Process ◽  
Batch Vacuum

Selective Nitride Etching with Phosphoric and Sulfuric Acid Mixtures Using a Single-Wafer Wet Processor

2014 ◽  
Vol 219 ◽  
pp. 93-96
Author(s):  
Vincent Sih ◽  
Berthold Reimer ◽  
Anthony S. Ratkovich ◽  
Jeffrey M. Lauerhaas ◽  
Jeffery W. Butterbaugh
Keyword(s):  
Sulfuric Acid ◽  
Silicon Nitride ◽  
Semiconductor Manufacturing ◽  
Orthophosphoric Acid ◽  
Silicon Oxide ◽  
The Past ◽  
Wet Processing

Selective nitride etching in semiconductor manufacturing is currently performed in wet benches using hot orthophosphoric acid at 160-180C. This process requires silica seasoning to achieve the desired selectivity to silicon oxide. Silica seasoning in wet benches is achieved by etching blanket silicon nitride wafers prior to running productions runs. While, this method of selective silicon nitride etching has been successful in the past, particle requirements at advanced nodes [1] are driving the need for a new solution. Single wafer wet processing is proposed as a way to meet these challenging new particle specifications.

scholarly journals Optimization of Bioethanol Synthesis from Durian Seeds Using Saccharomyces Cerevisiae in Fermentation Process

2020 ◽  
Vol 9 (1) ◽  
pp. 36-46
Author(s):  
Masturi Masturi ◽  
Dante Alighiri ◽  
Pratiwi Dwijananti ◽  
Rahmat Doni Widodo ◽  
Saraswati Putri Budiyanto ◽  
...  
Keyword(s):  
Saccharomyces Cerevisiae ◽  
Vacuum Distillation ◽  
Alternative Energy ◽  
Fermentation Process ◽  
Agricultural Crops ◽  
Bioethanol Production ◽  
Seed Flour ◽  
Fibrous Cellulose ◽  
Durian Seed ◽  
Batch Vacuum

Bioethanol is an alternative energy of environmentally friendly as a substitute for petroleum. Sucrose, starch, and fibrous cellulose (lignocellulose) are the main ingredients for bioethanol production. The material is very easy and abundant to get from the waste of agricultural crops. One of these agricultural wastes in Indonesia that have not been used optimally is durian seeds. Durian seeds only become waste and are not commercially useful, even though they contain high carbohydrates, which is possible as a potential new source for bioethanol production. In this work, an experimental study was conducted on bioethanol synthesis from durian seeds through fermentation by Saccharomyces cerevisiae yeast in aerobic fermenter. The process for the production of starch-based bioethanol includes milling, hydrolysis, detoxification, fermentation, and distillation. At the stage of fermentation, variations in the duration of fermentation were applied for 1-11 days. Carbohydrates contained in durian seed flour are 11.541%, which is the largest content. The highest result of ethanol content is 14.72 % (v/v) in 9 day fermentation periods by using Saccharomyces cerevisiae in aerobic conditions. Distillation to enrich bioethanol was carried out by batch vacuum distillation at 68°C for ± 180 minutes and produced bioethanol with a purity of 95%.

Fractionation of citronella (Cymbopogon winterianus) essential oil and concentrated orange oil phase by batch vacuum distillation

2011 ◽  
Vol 102 (4) ◽  
pp. 348-354 ◽  
Author(s):  
Stephani C. Beneti ◽  
Eline Rosset ◽  
Marcos L. Corazza ◽  
Caren D. Frizzo ◽  
Marco Di Luccio ◽  
...  
Keyword(s):  
Essential Oil ◽  
Vacuum Distillation ◽  
Orange Oil ◽  
Cymbopogon Winterianus ◽  
Batch Vacuum

Pt Etching Method at Low Temperature Using Electrolyzed Sulfuric Acid Solution

2014 ◽  
Vol 219 ◽  
pp. 101-104 ◽  
Author(s):  
Yuichi Ogawa ◽  
Minoru Uchida ◽  
Toru Otsu ◽  
Tatsuo Nagai ◽  
Hiroshi Morita
Keyword(s):  
Sulfuric Acid ◽  
Semiconductor Manufacturing ◽  
Manufacturing Industry ◽  
Metal Gate ◽  
Aqua Regia ◽  
Long Period ◽  
Etching Method ◽  
Long Time ◽  
One Step ◽  
Lower Temperature

Recently, in the semiconductor manufacturing industry, NiPt silicide with high conductivity is adopted. However, when removing the NiPt residues in NiPt silicide processing, there is a possibility to damage other metals and silicide. Removal of residual substances must be done with special care. As a conventional method, processing by SPM has been reported by Chur [1]. However, when Pt content is 10% or more, in this method, the wafers must be processed at 150°C for a long period of time. Then, this method may damage a metal gate and silicide. As another method, aqua regia can be used. However, in this method, it takes long time to dissolve NiPt. This paper reports, newly develped Pt etching method using one-step processing of ESA (Electrolyzed Sulfuric Acid) and HCl, and two-step processing using ESA and HCl mixture after HNO3 and H2O2 mixture. This method can treat NiPt silicide at lower temperature within a shorter time than in conventional methods.

Photoresist Stripping using Ozone/Deionized Water Chemistry

1997 ◽  
Vol 477 ◽  
Author(s):  
I. Kashkoush ◽  
R. Matthews ◽  
R. Novak ◽  
E. Brause ◽  
F. Carrillo ◽  
...  
Keyword(s):  
Hydrogen Peroxide ◽  
Sulfuric Acid ◽  
High Temperature ◽  
Water Chemistry ◽  
Semiconductor Manufacturing ◽  
Silicon Wafers ◽  
Deionized Water ◽  
Environmental Concerns ◽  
Patterned Wafers

ABSTRACTThe use of sulfuric acid to strip photoresist from silicon wafers is a widely employed technique in the semiconductor manufacturing community. In most cases, the acid is combined with hydrogen peroxide to oxidize stripped photoresist material, though the use of sparged ozone in sulfuric solution is also used to remove resist residues on wafers following the ashing process. Although they have been used for many years, sulfuric acid processes also have proven to be costly. This is due to the need for frequent bath change-outs and the use of high temperature which impose safety and environmental concerns. As a result of these and other considerations, the use of mixtures of ozone and de-ionized water for photoresist stripping has been investigated. Results show that the technique effectively removes hard-baked resist (ashed and un-ashed) from bare silicon and patterned wafers and produces cleaner surfaces (i.e. particles and metals), compared to outcomes from SPM processes.

Preparation of Thin Cadmium Telluride Samples for Electron Microscope Studies

1974 ◽  
Vol 32 ◽  
pp. 548-549
Author(s):  
T. J. Magee ◽  
J. Peng ◽  
J. Bean
Keyword(s):  
Electron Microscope ◽  
Sulfuric Acid ◽  
Solid State ◽  
Sample Preparation ◽  
Cadmium Telluride ◽  
Potassium Dichromate ◽  
Optical Components ◽  
The Past ◽  
Solid State Devices

Cadmium telluride has become increasingly important in a number of technological applications, particularly in the area of laser-optical components and solid state devices, Microstructural characterizations of the material have in the past been somewhat limited because of the lack of suitable sample preparation and thinning techniques. Utilizing a modified jet thinning apparatus and a potassium dichromate-sulfuric acid thinning solution, a procedure has now been developed for obtaining thin contamination-free samples for TEM examination.

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