Preparation of Fluorinated Graphene Oxide/Polyimide Composites with Low Dielectric Constant and Moisture Resistance

Fluorinated graphene oxide (FGO) was successfully prepared in this paper, and the chemical structure of FGO was characterized. A series of polyimide (PI) composite films with different content of FGO was prepared by in situ polymerization. Because of the homogeneous dispersion of FGO and the strong interfacial interaction between FGO and the PI matrix, the resulting composite films that contained FGO exhibited effects of mechanical properties, thermal properties and dielectric properties that were even better than the pure PI. Furthermore, due to the hydrophobic properties of FGO, the water absorption of the composite films were reduced. The result showed when the 0.6[Formula: see text]wt.% FGO was filled into the PI, the tensile strength was increased about 66.3%, the decomposition temperature was increased from 540∘C to 570∘C, and the dielectric constant (Dk) decreased with the increasing content of FGO, and a Dk value of 2.28 was achieved when the content of FGO was 1.0[Formula: see text]wt.%.