Ultra-thin Al2O3 films grown by atomic layer deposition for corrosion protection of copper
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Ultra-thin Al2O3 films with thickness in the range of 4.5–29.4 nm were prepared on a copper substrate by atomic layer deposition (ALD) at the temperature of 150 °C to protect the substrate from corrosion.
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2019 ◽
Vol 37
(5)
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pp. 050903
2019 ◽
Vol 16
(6)
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pp. 1751-1756
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2019 ◽
Vol 37
(6)
◽
pp. 060902
◽
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2006 ◽
Vol 46
(5-6)
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pp. 743-755
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