Ultra-thin Al2O3 films grown by atomic layer deposition for corrosion protection of copper

RSC Advances ◽  
2014 ◽  
Vol 4 (92) ◽  
pp. 50503-50509 ◽  
Author(s):  
Zhimin Chai ◽  
Yuhong Liu ◽  
Jing Li ◽  
Xinchun Lu ◽  
Dannong He

Ultra-thin Al2O3 films with thickness in the range of 4.5–29.4 nm were prepared on a copper substrate by atomic layer deposition (ALD) at the temperature of 150 °C to protect the substrate from corrosion.

1997 ◽  
Vol 71 (25) ◽  
pp. 3604-3606 ◽  
Author(s):  
Y. Kim ◽  
S. M. Lee ◽  
C. S. Park ◽  
S. I. Lee ◽  
M. Y. Lee

2019 ◽  
Vol 34 (10) ◽  
pp. 105004
Author(s):  
Pengfei Ma ◽  
Wenhao Guo ◽  
Jiamin Sun ◽  
Jiacheng Gao ◽  
Guanqun Zhang ◽  
...  

2019 ◽  
Vol 37 (6) ◽  
pp. 060902 ◽  
Author(s):  
Véronique Cremers ◽  
Geert Rampelberg ◽  
Kitty Baert ◽  
Shoshan Abrahami ◽  
Nathalie Claes ◽  
...  

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