Modeling of thermal conductivity of nanofluids considering aggregation and interfacial thermal resistance

RSC Advances ◽  
2016 ◽  
Vol 6 (5) ◽  
pp. 3571-3577 ◽  
Author(s):  
Meng Liu ◽  
Chen Ding ◽  
Jun Wang
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Thermal Resistance ◽  
Interfacial Thermal Resistance

Interfacial thermal resistance was modeled and found to have a relationship to the equivalent particle size, in terms of keeping thermal resistance constant.

scholarly journals Thermal Conductivity of Unidirectionally Aligned SiC Whisker Reinforced Al Alloy Matrix Composite with Interfacial Thermal Resistance

2005 ◽  
Vol 46 (2) ◽  
pp. 148-151 ◽  
Author(s):  
Yibin Xu ◽  
Yoshihisa Tanaka ◽  
Masaharu Murata ◽  
Kazushige Kamihira ◽  
Yukihiro Isoda ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Matrix Composite ◽  
Interfacial Thermal Resistance ◽  
Al Alloy ◽  
Alloy Matrix

Enhanced Thermal Conductivity of Composite Materials by Filling Sheet and Fiber Under Effect of Filler Contact

2021 ◽  
Author(s):  
Xiao-jian Wang ◽  
Liang-Bi Wang
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Composite Materials ◽  
Thermal Resistance ◽  
Percolation Threshold ◽  
Filler Content ◽  
Interfacial Thermal Resistance ◽  
Combined Effects ◽  
Enhanced Thermal Conductivity ◽  
The Ideal

Abstract The most common non-granular fillers are sheet and fiber. When they are distributed along the heat flux direction, the thermal conductivity of composite increases greatly. Meanwhile, the filler contact also has large effect on the thermal conductivity. However, the effect of filler contact on the thermal conductivity of composite with directional fillers has not been investigated. In this paper, the combined effects of filler contact, content and orientation are investigated. The results show that the effect of filler orientation on the thermal conductivity is greater than filler contact in low filler content, and exact opposite in high filler content. The effect of filler contact on fibrous and sheet fillers is far greater than cube and sphere fillers. This rule is affected by the filler contact. The filler content of 8% is the ideal percolation threshold of composite with fibrous and sheet filler. It is lower than cube filler and previous reports. The space for thermal conductivity growth of composite with directional filler is still very large. The effect of interfacial thermal resistance should be considered in predicting the thermal conductivity of composite under high Rc (>10-4).

Effective Thermal Conductivity of Functionally Graded Particulate Nanocomposites With Interfacial Thermal Resistance

2008 ◽  
Vol 75 (5) ◽  
Author(s):  
H. M. Yin ◽  
G. H. Paulino ◽  
W. G. Buttlar ◽  
L. Z. Sun
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Effective Thermal Conductivity ◽  
Functionally Graded ◽  
Interfacial Thermal Resistance ◽  
Conductivity Distribution ◽  
Consistent Model ◽  
The Matrix ◽  
Graded Material ◽  
Perfect Interface

By means of a fundamental solution for a single inhomogeneity embedded in a functionally graded material matrix, a self-consistent model is proposed to investigate the effective thermal conductivity distribution in a functionally graded particulate nanocomposite. The “Kapitza thermal resistance” along the interface between a particle and the matrix is simulated with a perfect interface but a lower thermal conductivity of the particle. The results indicate that the effective thermal conductivity distribution greatly depends on Kapitza thermal resistance, particle size, and degree of material gradient.

Thermal conductivity and interfacial Thermal Resistance Behavior for the Polyaniline (C3N)– boron carbide (BC3) Heterostructure

2021 ◽  
Author(s):  
Arian Mayelifartash ◽  
Mohammad Ali Abdol ◽  
Sadegh Sadeghzadeh
Keyword(s):  
Thermal Conductivity ◽  
Molecular Dynamics ◽  
Thermal Resistance ◽  
Boron Carbide ◽  
Molecular Dynamics Simulations ◽  
Thermal Conductance ◽  
Interfacial Thermal Resistance ◽  
Non Equilibrium Molecular Dynamics ◽  
Dynamics Simulations ◽  
Non Equilibrium

In this paper, by employing non-equilibrium molecular dynamics simulations (NEMD), the thermal conductance of hybrid formed by polyaniline (C3N) and boron carbide (BC3) in both armchair and zigzag configurations has...

Thermal Resistance of Bond-Lines Formed With Composite Thermal Interface Materials

2005 ◽  
Author(s):  
Gary Lehmann ◽  
Hao Zhang ◽  
Arun Gowda ◽  
David Esler
Keyword(s):  
Thermal Conductivity ◽  
Particle Size ◽  
Thermal Resistance ◽  
Bond Line ◽  
Surface Conductance ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bond Line Thickness ◽  
Matrix Surface ◽  
Interface Materials

Measurements and modeling of the thermal resistance of thin (< 100 microns) bond-lines are reported for composite thermal interface materials (TIMs). The composite TIMs consist of alumina particles dispersed in a polymer matrix to form six different adhesive materials. These model TIMs have a common matrix material and are distinguished by their particle size distributions. Bond-lines are formed in a three-layer assembly consisting of a substrate-TIM-substrate structure. The thermal resistance of the bond-line is measured, as a function of bond-line thickness, using the laser flash-technique. A linear variation of resistance with bond-line thickness is observed; Rbl = β · Lbl + Ro. A model is presented that predicts the effective thermal conductivity of the composite as a function of the particle and matrix conductivity, the particle-matrix surface conductance, the particle volume fraction and the particle size distribution. Specifically a method is introduced to account for a broad, continuous size distribution. A particle-matrix surface conductance value of ∼10W/mm2K is found to give good agreement between the measured and predicted effective thermal conductivity values of the composite TIMs.

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