Effect of few-layer graphene films as electrodes on the electrical properties of ferroelectric capacitors

RSC Advances ◽  
2016 ◽  
Vol 6 (70) ◽  
pp. 66011-66017
Author(s):  
Hong Jing Han ◽  
Yan Na Chen ◽  
Zhan Jie Wang
Keyword(s):  
Electrical Properties ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Van Der Waals ◽  
Layer Graphene ◽  
Graphene Films ◽  
Few Layer Graphene ◽  
Ferroelectric Capacitors

An FLG/PZT/Pt capacitor exhibits comparable polarization compared with a Pt/PZT/Pt capacitor but the magnitude of leakage current density for the FLG/PZT/Pt capacitor is largely decreased due to the van der Waals gap at the FLG/PZT interface.

Preparation and Characterization of (Sr1−xTix)O3 and (Ba1−xSrx)TiO3 Thin Films using ECR Plasma Assisted MOCVD

1996 ◽  
Vol 433 ◽  
Author(s):  
Kwangsoo No ◽  
Joon Sung Lee ◽  
Han Wook Song ◽  
Won Jong Lee ◽  
Byoung Gon Yu ◽  
...  
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Electrical Properties ◽  
Dielectric Loss ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Breakdown Field ◽  
Carrier Gas ◽  
Ecr Plasma

AbstractBa(TMHD)2, Sr(TMHD)2 and Ti-isopropoxide were used to fabricate the (SrxTi1 x)O3 and (Ba1 x Srx)TiO3 thin films. The decomposition and degradation characteristics of Ba(TMHD)2 and Sr(TMHD)2 with storage time were analyzed using a differential scanning calorimeter (DSC). The thin films were fabricated on Si(p-type 100) and Pt/SiO2/Si substrates with Ar carrier gas using ECR plasma (or without ECR plasma) assisted MOCVD. Experimental results showed that the ECR oxygen plasma increased the deposition rate, the ratio of Sr/Ti, the dielectric constant and the leakage current density of the film. The dependency of the crystallinity and the electrical properties on the Sr/Ti ratio of films were investigated. However, almost of the films deposited with Ar carrier gas had slightly high dielectric loss and high leakage current density and showed non-uniform compositional depth profiles. NH3 gas was also used to decrease the degradation of the MO-sources. Mass spectra in-situ monitoring of source vapors in ECR-PAMOCVD system were obtained. By introducing NH3 as a carrier gas, a significant improvement was achieved in the volatility and the thermal stability of the precursors, and the vaporization temperatures of the precursors were reduced compared to Ar carrier gas. The uniform compositional depth profile, less hydrogen and carbon content and the good electrical properties of (SrxTi1−x)O3 thin films were obtained with NH3 carrier gas. The (Ba1−xSrx)TiO3 thin film were fabricated to have very fine and uniform microstructure, the dielectric constant of 456, the dielectric loss of 0.0128, the leakage current density of 5.01 × 10−8A/cm2 at 1V and the breakdown field of 3.65MV/cm.

Influence of Ta2O5, TiO2, and ZrO2 Interfacial Layers on Structural and Electrical Properties of Laser Ablated Ba0.5Sr0.5TiO3 Thin Films

2002 ◽  
Vol 748 ◽  
Author(s):  
Suprem R. Das ◽  
Rasmi R. Das ◽  
P. Bhattacharya ◽  
Ram S. Katiyar
Keyword(s):  
Thin Films ◽  
Electrical Properties ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Buffer Layers ◽  
Bst Thin Films ◽  
Interfacial Layers ◽  
Average Grain Size ◽  
Structural And Electrical Properties

ABSTRACTPulsed laser deposition technique was used to fabricate Ba0.5Sr0.5TiO 3 (BST) thin-films on Pt/TiO 2/SiO2/Si substrates. The influence of thin interfacial layers of Ta2O5, TiO2, and ZrO2, on the structural and electrical properties of BST thin films was investigated. Insertion of interfacial layers does not affect the perovskite phase formation of BST thin films. Buffer layers helped to make uniform distribution of grains and resulted in a relative increase in the average grain size. The dielectric tunability of BST thin films was reduced with the presence of buffer layers. A BST thin film having a dielectric permitivity of 470 reduced to 337, 235 and 233 in the presence of Ta2O5, TiO2, and ZrO2 layers, respectively. The reduction of the relative dielectric permittivity of BST films with the insertion of interfacial layers was explained in terms of a series capacitance effect, due to the low dielectric constant of interfacial layers. The TiO2 layer did not show any appreciable change in the leakage current density. Deposition of thin Ta2O5 and ZrO2 interfacial layer on top of Pt reduced the leakage current density by an order of magnitude.

Microstructure Control of (Ba, Sr)TiO3 Films for Gigabit Dram

1997 ◽  
Vol 493 ◽  
Author(s):  
H. Shen ◽  
D. E. Kotecki ◽  
R. J. Murphy ◽  
M. Zaitz ◽  
R. B. Laibowitz ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Nucleation And Growth ◽  
Process Conditions ◽  
Charge Storage ◽  
Storage Density ◽  
Final Microstructure ◽  
A Charge

ABSTRACT(Ba, Sr)TiO3 films were deposited on Pt-coated SiO2/Si wafers by the MOCVD method. Experiments were conducted to investigate the mechanisms of nucleation and growth. It was observed that the diameter of the (Ba, Sr)TiO3 grains is established in the early stages of nucleation and does not increase substantially during the growth of the film. By controlling the process conditions, it is possible to control the final microstructure and improve the electrical properties of (Ba, Sr)TiO3 films. I-V and C-V measurements show that (Ba, Sr)TiO3 films with a thickness of approximately 15nm can produce a charge storage density of >120 fF/μm2 with a leakage current density of < 10 nA/cm2 at IV, making them suitable for Gigabit-scale DRAM applications.

Enhancement of the Electrical Properties of BaTiO3 Films on GaAs Using Double Layer Structures

1994 ◽  
Vol 361 ◽  
Author(s):  
L.H. Chang ◽  
W.A. Anderson
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Electrical Properties ◽  
Charge Density ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Double Layer ◽  
Current Density ◽  
Dielectric Constants ◽  
Oxide Charge

ABSTRACTFerroelectric BaTiO3 thin films have been directly deposited on n-GaAs with carrier concentration of 5.3–8.2×1017/cm2. The BaTiO3 thin films with a thickness in the range of 80–120 nm were prepared by RF magnetron sputtering with a substrate temperature of 300°C. The as-deposited BaTiO3 films appeared to be amorphous with relative dielectric constants of around 15 and gave flat capacitance-voltage (C-V) curves, indicating poor interface properties and very high oxide charge density. After rapid thermal annealing (RTA) at 800°C for 60 sec, the relative dielectric constant of the BaTiO3 film increased to 82 and a sharp C-V curve was observed with oxide charge density of about 7×1012/cm2. However, the leakage current density increased from 4×10'11 A/cm2 for as-deposited BaTiO3 to 2×105 A/cm2 for RTA(800°C)-BaTiO3 at a field of 4×105 V/cm. By taking advantage of the best properties from both as-deposited amorphous BaTiO3 films (low leakage current density) and RTA(800°C)-BaTiO3 (high dielectric constant) the double layer structure was designed to enhance the electrical properties of the BaTiO3 films on GaAs. The most promising results in regards to the dielectric property and leakage current density are 76.5 and 9.7×109 A/cm2, respectively, for the double layer RTA(500°C)-BaTiO3 on RTA(800°C)-BaTiO3 structures.

Leakage Current Behavior in CaZrO3 Thin Films for High-k Applications

2004 ◽  
Vol 811 ◽  
Author(s):  
Ting Yu ◽  
Weiguang Zhu ◽  
Xiaofeng Chen ◽  
Yuekang Lu
Keyword(s):  
Thin Films ◽  
Dielectric Constant ◽  
Electrical Properties ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Electric Fields ◽  
Current Density ◽  
Breakdown Strength ◽  
Sol Gel ◽  
High K

ABSTRACTElectrical properties and leakage current mechanisms of perovskite CaZrO3 dielectric thin films have been studied in this paper. CaZrO3 thin films were deposited on Pt/SiO2/n-Si substrate by the sol-gel wet chemical technology, and then annealed at temperatures ranging from 550 to 700 °C for 1h in O2. The films with platinum (Pt) top and bottom electrodes were characterized with respect to the leakage current as a function of temperature and applied voltage. The CaZrO3 film annealed at 600 °C was amorphous and showed good electrical properties with a dielectric constant of about 15 and leakage current density of 10−8 A/cm2 at high applied electrical field of 2.5 MV/cm. The data can be interpreted via a Schottky barrier model. The conduction mechanism at low electric fields is due to Ohmic conduction. On the other hand Schottky mechanism dominates at the intermediate fields. The high dielectric constant, low leakage current density and high breakdown strength suggest that the CaZrO3 thin film is a promising candidate for high-k applications.

Influence of Different Types of Silanes on the Properties of Nanocomposite PMMA: TiO2 Thin Films

2013 ◽  
Vol 667 ◽  
pp. 255-259
Author(s):  
Ismail Lyly Nyl ◽  
Zulkefle Habibah ◽  
Herman Sukreen Hana ◽  
Mohamad Rusop
Keyword(s):  
Thin Films ◽  
Titanium Dioxide ◽  
Electrical Properties ◽  
Methyl Methacrylate ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Poly Methyl Methacrylate ◽  
Different Types

This paper reported the effect of silane on the electrical properties of the nanocomposite poly(methyl methacrylate): titanium dioxide (PMMA:TiO2) films. Different types of silane were added directly into the nanocomposite PMMA:TiO2 solution. Electrical properties result shows that when different silane were use in the nanocomposite solution give different electrical properties. Sample 1 (without silane) and 4 (trimethoxymethylsilane) shows the highest resistivity and lowest leakage current density. Meanwhile sample 3 (triethoxyvinylsilane) indicate that are not a suitable silane to be added into the nanocomposite PMMA:TiO2 solution because it produce poor insulator behavior.

Electrical Properties of Atomic-Layer-Deposited La2O3/Thermal-Nitrided SiO2 Stacking Dielectric on 4H-SiC(0001)

2007 ◽  
Vol 556-557 ◽  
pp. 643-646 ◽  
Author(s):  
Jeong Hyun Moon ◽  
Kuan Yew Cheong ◽  
Da Il Eom ◽  
Ho Keun Song ◽  
Jeong Hyuk Yim ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Metal Oxide ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Atomic Layer ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Mos Capacitors

We have investigated the electrical properties of metal-oxide-semiconductor (MOS) capacitors with atomic-layer-deposited La2O3, thermal-nitrided SiO2, and atomic-layer-deposited La2O3/thermal-nitrided SiO2 on n-type 4H-SiC. A significant reduction in leakage current density has been observed in La2O3 structure when a 6-nm thick thermal nitrided SiO2 has been sandwiched between the La2O3 and SiC. However, this reduction is still considered high if compared to sample having thermal-nitrided SiO2 alone. The reasons for this have been explained in this paper.

scholarly journals Structure and Electrical Properties of Na0.5Bi0.5TiO3 Epitaxial Films with (110) Orientation

Crystals ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 558 ◽  
Author(s):  
Jianmin Song ◽  
Jie Gao ◽  
Suwei Zhang ◽  
Laihui Luo ◽  
Xiuhong Dai ◽  
...  
Keyword(s):  
Leakage Current ◽  
Ultraviolet Light ◽  
Leakage Current Density ◽  
Electric Fields ◽  
Current Density ◽  
Ferroelectric Properties ◽  
Srtio3 Substrate ◽  
Conduction Behavior ◽  
Effective Polarization ◽  
Ferroelectric Capacitors

Pt/Na0.5Bi0.5TiO3/La0.5Sr0.5CoO3 (Pt/NBT/LSCO) ferroelectric capacitors were fabricated on (110) SrTiO3 substrate. Both NBT and LSCO films were epitaxially grown on the (110) SrTiO3 substrate. It was found that the leakage current density of the Pt/NBT/LSCO capacitor is favorable to ohmic conduction behavior when the applied electric fields are lower than 60 kV/cm, and bulk-limited space charge-limited conduction takes place when the applied electric fields are higher than 60 kV/cm. The Pt/NBT/LSCO capacitor possesses good fatigue resistance and retention, as well as ferroelectric properties with Pr = 35 μC/cm2. The ferroelectric properties of the Pt/NBT/LSCO capacitor can be modulated by ultraviolet light. The effective polarization, ΔP, was reduced and the maximum polarization Pmax was increased for the Pt/NBT/LSCO capacitor when under ultraviolet light, which can be attributed to the increased leakage current density and non-reversible polarization P^ caused by the photo-generated carriers.

Ultrahigh conductivity of large area suspended few layer graphene films

2012 ◽  
Vol 101 (26) ◽  
pp. 263101 ◽  
Author(s):  
Nima Rouhi ◽  
Yung Yu Wang ◽  
Peter J. Burke
Keyword(s):  
Large Area ◽  
Layer Graphene ◽  
Graphene Films ◽  
Few Layer Graphene

Low Temperature Preparation of High-Quality Pb(Zr,Ti)O3 Films by Metal Organic Chemical Vapor Deposition with High Reproducibility

2001 ◽  
Vol 688 ◽  
Author(s):  
Hiroshi Funakubo ◽  
Kuniharu Nagashima ◽  
Masanori Aratani ◽  
Kouji Tokita ◽  
Takahiro Oikawa ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Leakage Current ◽  
Leakage Current Density ◽  
Current Density ◽  
Vapor Deposition ◽  
Deposition Temperature ◽  
Chemical Vapor ◽  
Process Window ◽  
High Quality ◽  
Low Temperature Preparation

AbstractPb(Zr,Ti)O3 (PZT) is one of the most promising materials for ferroelectric random access memory (FeRAM) application. Among the various preparation methods, metalorganic chemical vapor deposition (MOCVD) has been recognized as a most important one to realize high density FeRAM because of its potential of high-step-coverage and large-area-uniformity of the film quality.In the present study, pulsed-MOCVD was developed in which a mixture of the source gases was pulsed introduced into reaction chamber with interval. By using this deposition technique, simultaneous improvements of the crystallinity, surface smoothness, and electrical property of the film have been reached by comparing to the conventional continuous gas-supplied MOCVD. Moreover, this film had larger remanent polarization (Pr) and lower leakage current density. This is owing to reevaporation of excess Pb element from the film and increase of migration on the surface of substrate during the interval time.This process is also very effective to decrease the deposition temperature of the film having high quality. In fact, the Pr and the leakage current density of polycrystalline Pb(Zr0.35Ti0.65)O3 film deposited at 415 °C were 41.4 μC/cm2 and on the order of 10−7 A/cm2 at 200 kV/cm. This Pr value was almost the same as that of the epitaxially grown film deposited at 415 °C with the same composition corrected for the orientation difference. This suggests that the polycrystalline PZT film prepared by pulsed-MOCVD had the epitaxial-grade ferroelectric properties even through the deposition temperature was as low as 415 °C. Moreover, large “process window” comparable to the process window at 580 °C, above 150 °C higher temperature and was widely used condition, was achieved even at 395°C by the optimization of the deposition condition.

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