Mechanical and Heat Transfer Performance Investigation of High Thermal Conductivity, Commercially Available Polymer Composite Materials for Heat Exchange in Electronic Systems

2017 ◽  
Vol 9 (3) ◽  
Author(s):  
Peter Rodgers ◽  
Valerie Eveloy ◽  
Antoine Diana ◽  
Ismail Darawsheh ◽  
Fahad Almaskari
Keyword(s):  
Heat Transfer ◽  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Mechanical Property ◽  
Heat Exchange ◽  
Polymer Composite ◽  
Flexural Modulus ◽  
Morphological Characteristics ◽  
Composite Fiber ◽  
High Thermal Conductivity

The thermal, mechanical, and morphological characteristics of three selected commercially available, injection-moldable, high thermal conductivity (20–32 W/m K), polyimide 66 (PA66) polymer composites from two vendors are characterized for possible heat exchange applications in electronic equipment. The fillers are found to consist of 10 μm diameter, 120–350 μm long fibers, made of carbon in two composites, and a hybrid combination of essentially carbon, oxygen, and silicon in the third composite. Fiber weight loading ranges from 63% to 69%. The hybrid, high-length fiber-reinforced material overall displays superior mechanical properties (i.e., ultimate tensile, flexural and impact strengths, and flexural modulus) compared with the other two carbon-filled composites. For the hybrid-filled and one carbon-filled material (both having a thermal conductivity of 20 W/m K), good agreement between mechanical property measurements and corresponding vendor data is obtained. For the material having the highest vendor-specified thermal conductivity (i.e., 32 W/m K) and weight filler fraction (i.e., 69%), mechanical properties are up to 37% lower than corresponding vendor data. The heat transfer rates of parallel plate, cross-flow air–water heat exchanger prototypes made of the three PA66 materials are comparable to that of an aluminum prototype having the same geometry. Based on the combined heat transfer and mechanical property characterization results, the hybrid, long fiber-filled PA66 polymer composite appears to have the best combination of mechanical and heat transfer characteristics, for potential use in electronics heat exchange applications.

Highly Thermoconductive Yet Ultraflexible Polymer Composite with Superior Mechanical Properties and Autonomous Self-Healing Functionality via Binary Fillers Strategy

2022 ◽  
Author(s):  
Dong Wang ◽  
Dingyao Liu ◽  
JianHua Xu ◽  
JiaJun Fu ◽  
Kai Wu
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Polymer Composite ◽  
High Thermal Conductivity ◽  
Thermal Dissipation ◽  
Self Healing ◽  
Formidable Challenge ◽  
Superior Mechanical Properties

It is still a formidable challenge to develop ideal thermal dissipation materials with simultaneous high thermal conductivity, excellent mechanical softness and toughness, and spontaneous self-healing. Herein, we report the introduction...

scholarly journals DETERMINING OF PARAMETERS OF HEAT EXCHANGE FOR VAPORIZATION OF THE MIXED REFRIGERANT ON THE HIGH THERMAL CONDUCTIVITY SINTERED POWDER CAPILLARY-POROUS COATINGS

2018 ◽  
Vol 61 (1) ◽  
pp. 70-79 ◽  
Author(s):  
A. V. Ovsyannik ◽  
E. N. Makeeva
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchange ◽  
Experimental Studies ◽  
Nucleate Boiling ◽  
High Thermal Conductivity ◽  
Porous Coating ◽  
Transfer Coefficients ◽  
Porous Coatings ◽  
Wide Range

The results of experimental research of heat exchange under the nucleate boiling of refrigerants R404a, R407c and R410a on the tubes with capillary-porous coating are presented. Experimental studies were carried out with the aid of an experimental installation in conditions of a large volume at pressures of saturation pн = 0.9–1.4 MPa and densities of the heat flux q = 5–35 kW/m2. For the first time the criterion equation for the calculation of the intensity of heat transfer during evaporation of ozone safe refrigerants on surfaces with high thermal conductivity sintered capillary-porous coating was obtained. Experimental data are summarized satisfactorily in a wide range of parameters of the porous layer, i.e. the pressure (pн = 0.9–1.4 MPa) and heat loads (q = 5–35 kW/m2). The ratio makes us possible to calculate the heat transfer coefficients within ±20 %. The dependence can be used in engineering calculations of the characteristics of the heat exchangers of the evaporative type. The coefficient of heat transfer during boiling of refrigerants on the investigated surfaces with the sintered capillary-porous coating, 4 times higher than on a smooth one and 1.5 times higher than on the finned surface, that allows us to come to a conclusion about the advantage of porous coatings. Boiling in capillary-porous coating leads to a decrease in weight and size of the installations due to the heat exchange intensification and the size of the tubes smaller as compared to the size of the finned ones.

Improved Thermal Conductivity and Mechanical Property of PTFE Reinforced with Al2O3

NANO ◽  
2019 ◽  
Vol 14 (05) ◽  
pp. 1950064 ◽  
Author(s):  
Min Chao ◽  
Changjuan Guo ◽  
Ailing Feng ◽  
Zhengyong Huang ◽  
Qingli Yang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Mechanical Property ◽  
Dielectric Properties ◽  
Thermal Conductance ◽  
High Thermal Conductivity ◽  
Mass Content ◽  
Thermal Stabilities ◽  
Cold Pressing ◽  
Sintering Method

To achieve polymer-based composites for electronic packaging with high thermal conductivity, Al2O3 nanoplatelets were introduced into polytetrafluoroethylene (PTFE) matrix via a cold pressing and sintering method. The effect of mass content of the Al2O3 platelets on the morphology, mechanical properties, thermal conductivity and dielectric properties of the composites was investigated. The results revealed that the Al2O3/PTFE nanocomposites exhibited higher thermal conductivities, better thermal stabilities, enhanced mechanical properties with considerable dielectric properties. The largest thermal conductivity of the Al2O3/PTFE nanocomposites filled with 25[Formula: see text]wt.% Al2O3 platelets was 0.461[Formula: see text]W[Formula: see text]m[Formula: see text][Formula: see text]K[Formula: see text], increased by 85% compared with that of pure PTFE. The improved thermal conductivity of Al2O3/PTFE can be attributed to the formation of effective thermal conductance network within the PTFE matrix due to the interconnectivity of Al2O3 platelets.

scholarly journals Enhancement of thermal conductivity in polyamide-6/graphene composites via a “bridge effect” of silicon carbide whiskers

RSC Advances ◽  
2017 ◽  
Vol 7 (73) ◽  
pp. 46306-46312 ◽  
Author(s):  
Na Song ◽  
Haidong Pan ◽  
Xingshuang Hou ◽  
Siqi Cui ◽  
Liyi Shi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Polymer Composite ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Polyamide 6 ◽  
High Thermal Conductivity ◽  
Silicon Carbide Whiskers ◽  
Plane Direction

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.

Preparation and characterization of surface modified boron nitride epoxy composites with enhanced thermal conductivity

RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Surface Modified ◽  
Enhanced Thermal Conductivity ◽  
Electrical Insulation Properties

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.

Thermal Conductivity Testing Apparatus for 3D Printed Materials

2017 ◽  
Author(s):  
Tiffaney Flaata ◽  
Gregory J. Michna ◽  
Todd Letcher
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Additive Manufacturing ◽  
3D Printing ◽  
Polymer Composite ◽  
Heat Exchangers ◽  
Fused Deposition ◽  
3D Printed ◽  
Printed Materials ◽  
Metal Polymer

Additive manufacturing, the layer-by-layer creation of parts, was initially used for rapid prototyping of new designs. Recently, due to the decrease in the cost and increase in the resolution and strength of additively manufactured parts, additive manufacturing is increasingly being used for production of parts for end-use applications. Fused Deposition Modeling (FDM), a type of 3d printing, is a process of additive manufacturing in which a molten thermoplastic material is extruded to create the desired geometry. Many potential heat transfer applications of 3d printed parts, including the development of additively manufactured heat exchangers, exist. In addition, the availability of metal/polymer composite filaments, first used for applications such as tooling for injection molding applications and to improve wear resistance, could lead to increased performance 3d printed heat exchangers because of the higher thermal conductivity of the material. However, the exploitation of 3d printing for heat transfer applications is hindered by a lack of reliable thermal conductivity data for as-printed materials, which typically include significant void fractions. In this experimental study, an apparatus to measure the effective thermal conductivity of 3d printed composite materials was designed and fabricated. Its ability to accurately measure the thermal conductivity of polymers was validated using a sample of acrylic, whose conductivity is well understood. Finally, the thermal conductivities of various 3d printed polymer, metal/polymer composite, and carbon/polymer composite filaments were measured and are reported in this paper. The materials used are acrylonitrile butadiene styrene (ABS), polylactic acid (PLA), stainless steel/PLA, Brass/PLA, and Bronze/PLA.

scholarly journals Surface modification of a BN/ETDS composite with aniline trimer for high thermal conductivity and excellent mechanical properties

RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Surface Modification ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Conductive Polymer ◽  
High Thermal Conductivity ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).

scholarly journals Utilization of SiC and Cu Particles to Enhance Thermal and Mechanical Properties of Al Matrix Composites

Materials ◽  
2019 ◽  
Vol 12 (17) ◽  
pp. 2770 ◽  
Author(s):  
Dongxu Wu ◽  
Congliang Huang ◽  
Yukai Wang ◽  
Yi An ◽  
Chuwen Guo
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Low Density ◽  
Matrix Composites ◽  
Thermal And Mechanical Properties ◽  
Cu Content ◽  
Sic Particles ◽  
Al Matrix Composites ◽  
Al Matrix

In this work, SiC and Cu particles were utilized to enhance the thermal and mechanical properties of Al matrix composites. The ball-milling and cold-compact methods were applied to prepare Al matrix composites, and the uniform distribution of SiC and Cu particles in the composite confirms the validity of our preparation method. After characterizing the thermal conductivity and the compressibility of the prepared composites, results show that small particles have a higher potential to improve compressibility than large particles, which is attributed to the size effect of elastic modulus. The addition of SiC to the Al matrix will improve the compressibility behavior of Al matrix composites, and the compressibility can be enhanced by 100% when SiC content is increased from 0 to 30%. However, the addition of SiC particles has a negative effect on thermal conductivity because of the low thermal conductivity of SiC particles. The addition of Cu particles to Al-SiC MMCs could further slightly improve the compressibility behavior of Al-SiC/Cu MMCs, while the thermal conductivity could be enhanced by about 100% when the Cu content was increased from 0 to 30%. To meet the need for low density and high thermal conductivity in applications, it is more desirable to enhance the specific thermal conductivity by enlarging the preparation pressure and/or sintering temperature. This work is expected to supply some information for preparing Al matrix composites with low density but high thermal conductivity and high compressibility.

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