Millimeter-wave absorption properties of BaTiO3/Co3O4 composite powders controlled by high-frequency resonances of permittivity and permeability

2018 ◽  
Vol 6 (47) ◽  
pp. 12965-12975 ◽  
Author(s):  
Wei Tian ◽  
Ruoyang Ma ◽  
Jian Gu ◽  
Zongrong Wang ◽  
Ning Ma ◽  
...  

Millimeter-wave resonance of permittivity–permeability-contributed double absorption peaks in BaTiO3/Co3O4, exhibiting RL of ∼−40 dB and a bandwidth of 5 GHz around 35 GHz.

RSC Advances ◽  
2019 ◽  
Vol 9 (10) ◽  
pp. 5570-5581 ◽  
Author(s):  
Shuo Zhao ◽  
Chunyu Wang ◽  
Ting Su ◽  
Bo Zhong

Ni–Fe–P nanoparticle/graphene nanosheet composites synthesized by a one-step hydrothermal method have excellent performance in the field of electromagnetic wave absorption, with a minimum reflection loss of −50.5 dB and a maximum effective absorption bandwidth of 5 GHz.


2014 ◽  
Vol 61 (S1) ◽  
pp. S280-S284
Author(s):  
M. Yoshikiyo ◽  
A. Namai ◽  
S. Ohkoshi

2019 ◽  
Vol 244 ◽  
pp. 147-150 ◽  
Author(s):  
Chuyang Liu ◽  
Gang Fang ◽  
Zhe Li ◽  
Yujing Zhang ◽  
Xinrui Zhao ◽  
...  

Author(s):  
Weiming Zhang ◽  
Biao Zhao ◽  
Huimin Xiang ◽  
Fu-Zhi Dai ◽  
Shijiang Wu ◽  
...  

Abstract Considering the emergence of severe electromagnetic interference problems, it is vital to develop electromagnetic (EM) wave absorbing materials with high dielectric, magnetic loss and optimized impedance matching. However, realizing the synergistic dielectric and magnetic losses in a single phase material is still a challenge. Herein, high entropy (HE) rare earth hexaborides (REB6) powders with coupling of dielectric and magnetic losses were designed and successfully synthesized through a facial one-step boron carbide reduction method, and the effects of high entropy borates intermedia phases on the EM wave absorption properties were investigated. Five HE REB6 ceramics including (Ce0.2Y0.2Sm0.2Er0.2Yb0.2)B6, (Ce0.2Eu0.2Sm0.2Er0.2Yb0.2)B6, (Ce0.2Y0.2Eu0.2Er0.2Yb0.2)B6, (Ce0.2Y0.2Sm0.2 Eu0.2Yb0.2)B6, and (Nd0.2Y0.2Sm0.2Eu0.2 Yb0.2)B6 possess CsCl-type cubic crystal structure, and their theoretical densities range from 4.84 to 5.25 g/cm3. (Ce0.2Y0.2Sm0.2Er0.2 Yb0.2)B6 powders with the average particle size of 1.86 µm were found to possess the best EM wave absorption properties among these hexaborides. The RLmin value of (Ce0.2Y0.2Sm0.2Er0.2Yb0.2)B6 reaches −33.4 dB at 11.5 GHz at thickness of 2 mm; meanwhile, the optimized effective absorption bandwidth (EAB) is 3.9 GHz from 13.6 to 17.5 GHz with a thickness of 1.5 mm. The introduction of HE REBO3 (RE = Ce, Y, Sm, Eu, Er, Yb) as intermediate phase will give rise to the mismatching impedance, which will further lead to the reduction of reflection loss. Intriguingly, the HEREB6/HEREBO3 still possess wide effective absorption bandwidth of 4.1 GHz with the relative low thickness of 1.7 mm. Considering the better stability, low density, and good EM wave absorption properties, HE REB6 ceramics are promising as a new type of EM wave absorbing materials.


2017 ◽  
Vol 08 (03) ◽  
pp. 51-58 ◽  
Author(s):  
Toshihisa Kamei ◽  
Hiromi Shima ◽  
Takashi Yamamoto ◽  
Satoshi Ogino ◽  
Seishiro Ishii

2014 ◽  
Vol 115 (17) ◽  
pp. 172613 ◽  
Author(s):  
Marie Yoshikiyo ◽  
Asuka Namai ◽  
Makoto Nakajima ◽  
Keita Yamaguchi ◽  
Tohru Suemoto ◽  
...  

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 169
Author(s):  
Mengcheng Wang ◽  
Shenglin Ma ◽  
Yufeng Jin ◽  
Wei Wang ◽  
Jing Chen ◽  
...  

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio frequency system-in-package (RF SIP) substrates. This paper presents a redundant TSV interconnect design for high resistivity Si interposers for millimeter-wave applications. To verify its feasibility, a set of test structures capable of working at millimeter waves are designed, which are composed of three pieces of CPW (coplanar waveguide) lines connected by single TSV, dual redundant TSV, and quad redundant TSV interconnects. First, HFSS software is used for modeling and simulation, then, a modified equivalent circuit model is established to analysis the effect of the redundant TSVs on the high-frequency transmission performance to solidify the HFSS based simulation. At the same time, a failure simulation was carried out and results prove that redundant TSV can still work normally at 44 GHz frequency when failure occurs. Using the developed TSV process, the sample is then fabricated and tested. Using L-2L de-embedding method to extract S-parameters of the TSV interconnection. The insertion loss of dual and quad redundant TSVs are 0.19 dB and 0.46 dB at 40 GHz, respectively.


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