High thermal conductivity property of polyamide-imide/boron nitride composite films by doping boron nitride quantum dots

2019 ◽  
Vol 7 (44) ◽  
pp. 13896-13903 ◽  
Author(s):  
Shuaishuai Zhou ◽  
Tongle Xu ◽  
Fang Jiang ◽  
Na Song ◽  
Liyi Shi ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Quantum Dots ◽  
Boron Nitride ◽  
Composite Film ◽  
Self Assembly ◽  
Composite Films ◽  
Conductivity Property ◽  
Assembly Method ◽  
Boron Nitride Nanosheet ◽  
Evaporation Induced Self Assembly

In this study, we report a flexible polyamide-imide (PAI)/boron nitride nanosheet (BNNS) composite film with improved thermal conductivity by doping boron nitride quantum dots (BNQDs) using an evaporation-induced self-assembly method.

scholarly journals Robust Biomimetic Nacreous Aramid Nanofiber Composite Films with Ultrahigh Thermal Conductivity by Introducing Graphene Oxide and Edge-Hydroxylated Boron Nitride Nanosheet

Nanomaterials ◽  
2021 ◽  
Vol 11 (10) ◽  
pp. 2544
Author(s):  
Cenkai Xu ◽  
Chengmei Wei ◽  
Qihan Li ◽  
Zihan Li ◽  
Zongxi Zhang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Boron Nitride ◽  
Composite Film ◽  
Performance Enhancement ◽  
Composite Films ◽  
Dielectric Materials ◽  
Boron Nitride Nanosheet ◽  
Brick And Mortar ◽  
Thermally Conductive

Dielectric materials with excellent thermally conductive and mechanical properties can enable disruptive performance enhancement in the areas of advanced electronics and high-power devices. However, simultaneously achieving high thermal conductivity and mechanical strength for a single material remains a challenge. Herein, we report a new strategy for preparing mechanically strong and thermally conductive composite films by combining aramid nanofibers (ANFs) with graphene oxide (GO) and edge-hydroxylated boron nitride nanosheet (BNNS-OH) via a vacuum-assisted filtration and hot-pressing technique. The obtained ANF/GO/BNNS film exhibits an ultrahigh in-plane thermal conductivity of 33.4 Wm−1K−1 at the loading of 10 wt.% GO and 50 wt.% BNNS-OH, which is 2080% higher than that of pure ANF film. The exceptional thermal conductivity results from the biomimetic nacreous “brick-and-mortar” layered structure of the composite film, in which favorable contacting and overlapping between the BNNS-OH and GO is generated, resulting in tightly packed thermal conduction networks. In addition, an outstanding tensile strength of 93.3 MPa is achieved for the composite film, owing to the special biomimetic nacreous structure as well as the strong π−π interactions and extensive hydrogen bonding between the GO and ANFs framework. Meanwhile, the obtained composite film displays excellent thermostability (Td = 555 °C, Tg > 400 °C) and electrical insulation (4.2 × 1014 Ω·cm). We believe that these findings shed some light on the design and fabrication of multifunctional materials for thermal management applications.

scholarly journals Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 379
Author(s):  
Seonmin Lee ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Vinyl Alcohol ◽  
Composite Films ◽  
Poly Vinyl Alcohol ◽  
Thermal And Mechanical Properties ◽  
Conduction Path ◽  
Thermally Conductive

Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

Graphene–CdS quantum dots–polyoxometalate composite films for efficient photoelectrochemical water splitting and pollutant degradation

2014 ◽  
Vol 16 (47) ◽  
pp. 26016-26023 ◽  
Author(s):  
Meng Wang ◽  
Xinke Shang ◽  
Xuelian Yu ◽  
Rongji Liu ◽  
Yongbing Xie ◽  
...  
Keyword(s):  
Quantum Dots ◽  
Water Splitting ◽  
Self Assembly ◽  
Nanocomposite Film ◽  
Electrical Response ◽  
Composite Films ◽  
Layer By Layer ◽  
Cds Quantum Dots ◽  
Pollutant Degradation ◽  
Assembly Method

rGO–CdS–H2W12 nanocomposite film was successfully fabricated by a layer-by-layer self-assembly method. The film showed good photo-electrical response under irradiation of solar light.

Aluminum Borate/Boron Nitride Nanosheet Fibers for Enhancing the Thermal Conductivity of Polymer Composites

2021 ◽  
Vol 4 (2) ◽  
pp. 2136-2142
Author(s):  
Xiao Hou ◽  
Zhenbang Zhang ◽  
Xianzhe Wei ◽  
Yue Qin ◽  
Guichen Song ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Aluminum Borate ◽  
Boron Nitride Nanosheet

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

2021 ◽  
pp. 095400832110003
Author(s):  
Ruiyi Li ◽  
Chengcheng Ding ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Reference Value ◽  
Residual Rate ◽  
Practical Applications ◽  
Hybrid Fillers ◽  
The Matrix

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

Evaporation-induced self-assembly of quantum dots-based concentric rings on polymer-based nanocomposite films

Soft Matter ◽  
2016 ◽  
Vol 12 (40) ◽  
pp. 8285-8296 ◽  
Author(s):  
Shaofu Zhang ◽  
Weiling Luan ◽  
Qixin Zhong ◽  
Shaofeng Yin ◽  
Fuqian Yang
Keyword(s):  
Quantum Dots ◽  
Self Assembly ◽  
Nanocomposite Films ◽  
Evaporation Induced Self Assembly

Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement

2010 ◽  
Vol 114 (10) ◽  
pp. 4340-4344 ◽  
Author(s):  
Takeshi Terao ◽  
Chunyi Zhi ◽  
Yoshio Bando ◽  
Masanori Mitome ◽  
Chengchun Tang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Films ◽  
Polymeric Composite ◽  
Boron Nitride Nanotubes
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