Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

2021 ◽  
pp. 095400832110003
Author(s):  
Ruiyi Li ◽  
Chengcheng Ding ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Reference Value ◽  
Residual Rate ◽  
Practical Applications ◽  
Hybrid Fillers ◽  
The Matrix

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

scholarly journals Mechanically Robust Flexible Multilayer Aramid Nanofibers and MXene Film for High-Performance Electromagnetic Interference Shielding and Thermal Insulation

Nanomaterials ◽  
2021 ◽  
Vol 11 (11) ◽  
pp. 3041
Author(s):  
Jun Zhou ◽  
Junsheng Yu ◽  
Dongyu Bai ◽  
Huili Liu ◽  
Lu Li
Keyword(s):  
Mechanical Properties ◽  
Composite Film ◽  
Electromagnetic Interference ◽  
Multilayer Structure ◽  
High Performance ◽  
Composite Films ◽  
Next Generation ◽  
Shielding Effectiveness ◽  
Breaking Strain ◽  
Practical Applications

In order to overcome the various defects caused by the limitations of solid metal as a shielding material, the development of electromagnetic shielding materials with flexibility and excellent mechanical properties is of great significance for the next generation of intelligent electronic devices. Here, the aramid nanofiber/Ti3C2Tx MXene (ANF/MXene) composite films with multilayer structure were successfully prepared through a simple alternate vacuum-assisted filtration (AVAF) process. With the intervention of the ANF layer, the multilayer-structure film exhibits excellent mechanical properties. The ANF2/MXene1 composite film exhibits a tensile strength of 177.7 MPa and a breaking strain of 12.6%. In addition, the ANF5/MXene4 composite film with a thickness of only 30 μm exhibits an electromagnetic interference (EMI) shielding efficiency of 37.5 dB and a high EMI-specific shielding effectiveness value accounting for thickness (SSE/t) of 4718 dB·cm2 g−1. Moreover, the composite film was excellent in heat-insulation performance and in avoiding light-to-heat conversion. No burning sensation was produced on the surface of the film with a thickness of only 100 μm at a high temperature of 130 °C. Furthermore, the surface of the film was only mild when touched under simulated sunlight. Therefore, our multilayer-structure film has potential significance in practical applications such as next-generation smart electronic equipment, communications, and military applications.

Dielectric behavior of a flexible three-phase polyimide/BaTiO3/multi-walled carbon nanotube composite film

2016 ◽  
Vol 09 (01) ◽  
pp. 1650006 ◽  
Author(s):  
Junli Wang ◽  
Shengli Qi ◽  
Yiyi Sun ◽  
Guofeng Tian ◽  
Dezhen Wu
Keyword(s):  
Composite Film ◽  
Volume Fraction ◽  
In Situ Polymerization ◽  
Composite Films ◽  
Dielectric Behavior ◽  
Low Dielectric ◽  
Three Phase ◽  
The Matrix ◽  
Multi Walled Carbon Nanotubes ◽  
High Dielectric

A three-phase composite film was produced by inserting multi-walled carbon nanotubes (MWCNTs) and BaTiO3 nanoparticles into polyimide (PI). The combination of in-situ polymerization and water-based preparation involved in the experiment ensured fillers’ homogeneous dispersion in the matrix, which led to flexible shape of the composite films. The dielectric properties of composite films as a function of the frequency and the volume fraction of MWCNTs were studied. Such composite film displayed a high dielectric constant (314.07), low dielectric loss and excellent flexibility at 100[Formula: see text]Hz in the neighborhood of percolation threshold (9.02 vol%) owing to the special microcapacitor structure. The experimental results were highly consistent with the power law of percolation theory.

scholarly journals Mechanical Properties of Thermoplastic Starch Biocomposite Films with Hybrid Fillers

2021 ◽  
Vol 2080 (1) ◽  
pp. 012011
Author(s):  
Di Sheng Lai ◽  
Sinar Arzuria Adnan ◽  
Azlin Fazlina Osman ◽  
Ismail Ibrahim ◽  
Hazrul Haq
Keyword(s):  
Mechanical Properties ◽  
Food Packaging ◽  
Corn Starch ◽  
Composite Films ◽  
Thermoplastic Starch ◽  
Elongation At Break ◽  
Biocomposite Films ◽  
Hybrid Fillers ◽  
The Matrix ◽  
Dry Food

Abstract Thermoplastic starch (TPS) was studied extensively to replace conventional plastic in packaging application. In this study, granule corn starch was first plasticized with water and glycerol to form TPS films and two different fillers were incorporated with TPS to form hybrid biocomposite films (TPSB). Two different fillers: Microcrystalline cellulose (MC) and Nano bentonite (NB) fixed at 1: 4 ratios in various loading (1wt%-6wt%) were incorporated in TPS to study effect of hybrid fillers on the mechanical properties of TPSB films. The effect of different loading of MC/NB on TPSB films was investigated through the structural, morphological and mechanical testing. Fourier Transform Infrared Spectroscopy (FTIR) shows TPS matrix and hybrid fillers are highly compatible due to hydroxyl bonding and verified through the shifting of spectra band. Scanning Electron Microscope (SEM) showed even distribution of fillers in the matrix of TPS. The TPSB films exhibited significant improvement 40% in elongation at break compared to pure TPS films. In this study, 5wt% is best loading of the hybrid fillers to incorporated in TPSB films as it achieved the highest value of tensile strength (8.52MPa), Young’s Modulus (42.0 MPa) and elongation at break (116.3%). Generally, previous studies showed flexibility of TPS composite films reduced with incorporating filler, however in this study, the flexibility TPSB show significant improvement compared to previous studies and exhibit promising potential in dry food packaging application.

Flexible electrothermal polymer film based on reduced graphene oxide–water polyurethane

2020 ◽  
Vol 34 (25) ◽  
pp. 2050265 ◽  
Author(s):  
Ke Wang ◽  
Zhimin Zhou ◽  
Yuehui Wang
Keyword(s):  
Thermal Conductivity ◽  
Electrical Conductivity ◽  
Graphene Oxide ◽  
Composite Film ◽  
Reduced Graphene Oxide ◽  
Rapid Heating ◽  
Tape Casting ◽  
Composite Films ◽  
Low Input ◽  
Reduced Graphene

In this paper, waterborne polyurethane (WPU) conductive films incorporated with reduced graphene oxide (RGO) as conductive fillers were prepared by solution blending and tape casting method. The electrical conductivity, thermal conductivity and microstructures of the composite films were systematically investigated. The experimental results demonstrate that the electrical conductivity and thermal conductivity of the RGO–WPU composite films first increased then decreased with the increase of the RGO content. The resistivity of composite film with 7% RGO reaches to the smallest that is about [Formula: see text], and the thermal conductivity of the composite film with 7% graphene was about 0.29 W.m.K[Formula: see text], which an increase of 70% compared with pure WPU. The electrical conductivity of the composite film decreased with the increase of the original concentration of WPU solution and thickness of the composite film. As film heater, the composite film displayed effective and rapid heating at low input voltages owing to the good conductivity. With an input voltage was in the range of 10–24 V, the film took less than 30s to reach a steady-state temperature, demonstrating the fast response of the composite film heater and suitable for applications in the field of the fast temperature switching with low input voltages as flexible electrothermal heater.

scholarly journals Hexagonal Boron Nitride/Microfibril Cellulose/Poly(vinyl alcohol) Ternary Composite Film with Thermal Conductivity and Flexibility

Materials ◽  
2018 ◽  
Vol 12 (1) ◽  
pp. 104 ◽  
Author(s):  
Xin Ge ◽  
Wei-Jie Liang ◽  
Jian-Fang Ge ◽  
Xun-Jun Chen ◽  
Jian-Ye Ji ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Photoelectron Spectroscopy ◽  
Vinyl Alcohol ◽  
Hexagonal Boron Nitride ◽  
Poly Vinyl Alcohol ◽  
Thermal Interface Materials ◽  
Binding Effect ◽  
Ft Ir

Microfibril cellulose (MFC), which is detrimental to soil cultivation and environmental protection, is derived from waste pineapple leaves. Hexagonal boron nitride (h-BN) was modified with polydopamine (PDA)—PDA@h-BN named pBN, and then combined with MFC to prepare a novel hybrid powder. The effect of PDA on h-BN and the binding effect between pBN and MFC were characterized by X-ray photoelectron spectroscopy (XPS), Thermogravimetric (TG), scanning electron microscopy (SEM), and Fourier Transform-Infrared (FT-IR). Poly (vinyl alcohol) (PVA) was used as an eco-friendly polymeric matrix to prepare a pBN-MFC-PVA composite film. The mechanical strength, hydrophobicity, and thermal conductivity of the film were studied and the results confirmed that h-BN was chemically modified with PDA and was uniformly distributed along the MFC. The thermal conductivity of the pBN-MFC-PVA composite film increased with the addition of a pBN-MFC novel powder. MFC acted as “guides” to mitigate the h-BN agglomerate. In addition to the possible usage in the pBN-MFC-PVA composite film itself, the pBN-MFC hybrid powder may be a potential filler candidate for manufacturing thermal interface materials and wearable devices or protective materials.

scholarly journals Incorporating MXene into Boron Nitride/Poly(Vinyl Alcohol) Composite Films to Enhance Thermal and Mechanical Properties

Polymers ◽  
2021 ◽  
Vol 13 (3) ◽  
pp. 379
Author(s):  
Seonmin Lee ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Film ◽  
Vinyl Alcohol ◽  
Composite Films ◽  
Poly Vinyl Alcohol ◽  
Thermal And Mechanical Properties ◽  
Conduction Path ◽  
Thermally Conductive

Aggregated boron nitride (ABN) is advantageous for increasing the packing and thermal conductivity of the matrix in composite materials, but can deteriorate the mechanical properties by breaking during processing. In addition, there are few studies on the use of Ti3C2 MXene as thermally conductive fillers. Herein, the development of a novel composite film is described. It incorporates MXene and ABN into poly(vinyl alcohol) (PVA) to achieve a high thermal conductivity. Polysilazane (PSZ)-coated ABN formed a heat conduction path in the composite film, and MXene supported it to further improve the thermal conductivity. The prepared polymer composite film is shown to provide through-plane and in-plane thermal conductivities of 1.51 and 4.28 W/mK at total filler contents of 44 wt.%. The composite film is also shown to exhibit a tensile strength of 11.96 MPa, which is much greater than that without MXene. Thus, it demonstrates that incorporating MXene as a thermally conductive filler can enhance the thermal and mechanical properties of composite films.

scholarly journals Aerogel Perfusion-Prepared h-BN/CNF Composite Film with Multiple Thermally Conductive Pathways and High Thermal Conductivity

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 1051 ◽  
Author(s):  
Xiu Wang ◽  
Zhihuai Yu ◽  
Liang Jiao ◽  
Huiyang Bian ◽  
Weisheng Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Traditional Approach ◽  
Synthetic Polymer ◽  
Electrical Insulation ◽  
High Thermal Conductivity ◽  
Polymer Materials ◽  
Thermally Conductive ◽  
Electrical Insulation Properties

Hexagonal boron nitride (h-BN)-based heat-spreading materials have drawn considerable attention in electronic diaphragm and packaging fields because of their high thermal conductivity and desired electrical insulation properties. However, the traditional approach to fabricate thermally conductive composites usually suffers from low thermal conductivity, and cannot meet the requirement of thermal management. In this work, novel h-BN/cellulose-nano fiber (CNF) composite films with excellent thermal conductivity in through plane and electrical insulation properties are fabricated via an innovative process, i.e., the perfusion of h-BN into porous three dimensional (3D) CNF aerogel skeleton to form the h-BN thermally conductive pathways by filling the CNF aerogel voids. When at an h-BN loading of 9.51 vol %, the thermal conductivity of h-BN/CNF aerogel perfusion composite film is 1.488 W·m−1·K−1 at through plane, an increase by 260.3%. The volume resistivity is 3.83 × 1014 Ω·cm, superior to that of synthetic polymer materials (about 109~1013 Ω·cm). Therefore, the resulting h-BN/CNF film is very promising to replace the traditional synthetic polymer materials for a broad spectrum of applications, including the field of electronics.

scholarly journals Functionalized Multiwalled Carbon Nanotube-Reinforced Polyimide Composite Films with Enhanced Mechanical and Thermal Properties

2019 ◽  
Vol 2019 ◽  
pp. 1-12 ◽  
Author(s):  
Min Chao ◽  
Yanming Li ◽  
Guanglei Wu ◽  
Zhenjun Zhou ◽  
Luke Yan
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Composite Film ◽  
Composite Films ◽  
Conductive Filler ◽  
Filler Loading ◽  
Multiwalled Carbon Nanotube ◽  
High Thermal Conductivity ◽  
Mechanical And Thermal Properties ◽  
Multiwalled Carbon

Polyimide- (PI-) based nanocomposites containing the 4,4′-diaminodiphenyl ether- (ODA-) modified multiwalled carbon nanotube (MWCNT) filler were successfully prepared. The PI/MWCNTs-ODA composite films exhibit high thermal conductivity and excellent mechanical property. The optimal value of thermal conductivity of the PI/MWCNTs-ODA composite film is 0.4397 W/mK with 3 wt.% filler loading, increased by 221.89% in comparison with that of the pure PI film. In addition, the tensile strength of the PI/MWCNTs-ODA composite film is 141.48 MPa with 3 wt.% filler loading, increased by 20.74% in comparison with that of the pure PI film. This work develops a new strategy to achieve a good balance between the high thermal conductivity and excellent mechanical properties of polyimide composite films by using functionalized carbon nanotubes as an effective thermal conductive filler.

scholarly journals Vanadium oxide-based photochromic composite film

RSC Advances ◽  
2017 ◽  
Vol 7 (5) ◽  
pp. 2388-2391 ◽  
Author(s):  
Hidetoshi Miyazaki ◽  
Takahiro Matsuura ◽  
Toshitaka Ota
Keyword(s):  
Vanadium Oxide ◽  
Composite Film ◽  
Uv Light ◽  
Composite Films ◽  
Photochromic Property ◽  
The Matrix ◽  
Vanadic Acid

V2O5-based composite films were fabricated using peroxo-iso-poly vanadic acid as the filler and transparent urethane resin as the matrix, and the resulting composite films exhibited photochromic property when irradiated with ultraviolet (UV) light.

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