The paper presents the main provisions of the new method of growing bulk, with a thickness of 100 μm or more, single-crystal AlN, AlGaN and GaN films on silicon poles with a silicon carbide buffer layer with their subsequent separation from the Si substrate. The main essence of this method is the combination of the method of chloride-hydride epitaxy, which ensures high growth rates of III-nitride layers using as substrate for growth, Si substrate with a buffer layer of a nanoscale atomic SiC film. The Si substrate with a SiC layer grown by the substitution method has a number of structural, physical, and chemical features as compared to SiC layers grown on Si by standard methods. It is shown that it is this feature that makes it possible to grow on its surface thick, uncracked layers of AlN, AlGaN and GaN, followed by their simple separation from the substrate. In this work, single-crystal uncracked layers were grown: AlN up to 300 microns thick; AlGaN thickness up to 400 microns; GaN thickness up to 200 microns; GaN semipolar (112 ̅4) orientation up to 35 microns.
Influence of etching AlN buffer layer on the surface roughening of N-polar n-GaN grown on Si substrate
