Design and technology of low-cost printed antennas

2011 ◽  
pp. 579-692 ◽  
Author(s):  
J. Daniel ◽  
E. Penard ◽  
C. Terret
Keyword(s):  
Low Cost ◽  
Design And Technology ◽  
Printed Antennas

scholarly journals Compact and Low-Cost 3-D Printed Antennas Metalized Using Spray-Coating Technology for 5G mm-Wave Communication Systems

2018 ◽  
Vol 17 (11) ◽  
pp. 2051-2055 ◽  
Author(s):  
Shaker Alkaraki ◽  
Andre Sarker Andy ◽  
Yue Gao ◽  
Kin-Fai Tong ◽  
Zhinong Ying ◽  
...  
Keyword(s):  
Communication Systems ◽  
Low Cost ◽  
Spray Coating ◽  
Printed Antennas ◽  
Coating Technology

Advanced SiP Packaging Technologies of IPD for Mobile Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 1-20
Author(s):  
Geun Sik Kim ◽  
Kai Liu ◽  
Flynn Carson ◽  
Seung Wook Yoon ◽  
Meenakshi Padmanathan
Keyword(s):  
High Performance ◽  
Low Cost ◽  
Autonomous Systems ◽  
System Level ◽  
Design And Technology ◽  
Wafer Level ◽  
Future Technology ◽  
Rf Transceivers ◽  
And Performance ◽  
3D Stacking

IPD technology was originally developed as a way to replace bulky discrete passive components, but it¡¯s now gaining popularity in ESD/EMI protection applications, as well as in RF, high-brightness LED silicon sub-mounts, and digital and mixed-signal devices. Already well known as a key enabler of system-in-packages (SiPs), IPDs enable the assembly of increasingly complete and autonomous systems with the integration of diverse electronic functions such as sensors, RF transceivers, MEMS, power amplifiers, power management units, and digital processors. The application area for IPD will continue to evolve, especially as new packaging technology, such as flipchip, 3D stacking, wafer level packaging become available to provide vertical interconnections within the IPD. New applications like silicon interposers will become increasingly significant to the market. Currently the IPD market is being driven primarily by RF or wireless packages and applications including, but not limited to, cell phones, WiFi, GPS, WiMAX, and WiBro. In particular, applications and products in the emerging RF CMOS market that require a low cost, smaller size, and high performance are driving demand. In order to get right products in size and performance, packaging design and technology should be considered in device integration and implemented together in IPD designs. In addition, a comprehensive understanding of electrical and mechanical properties in component and system level design is important. This paper will highlight some of the recent advancements in SiP technology for IPD and integration as well as what is developed to address future technology requirements in IPD SiP solutions. The advantage and applications of SiP solution for IPD will be presented with several examples of IPD products. The design, assembly and packaging challenges and performance characteristics will be also discussed.

Design considerations for the hot embossing of microstrip antennas on plastic foils

2009 ◽  
Vol 1 (4) ◽  
pp. 249-254
Author(s):  
Andreas Kilian ◽  
Michael Fuchs ◽  
Lorenz-Peter Schmidt
Keyword(s):  
Millimeter Wave ◽  
Low Cost ◽  
Three Dimensional ◽  
Hot Embossing ◽  
Microstrip Antennas ◽  
Design Guidelines ◽  
Printed Antennas ◽  
Design Considerations ◽  
Radar Applications ◽  
Plastic Parts

In this contribution, fundamental design considerations for a novel metallization technique to realize millimeter-wave microstrip structures are presented. This hot embossing technology is a fast and economic process originating from the production of three-dimensional molded interconnect devices. Conductive structures are coated onto plastic parts or plastic foils using a heated stamp. This approach shows high potential and therefore will be investigated for the fabrication of low-cost printed antennas at millimeter-wave frequencies. The focus of this contribution is on design guidelines considering process parameters and interactions with substrate and copper foil characteristics derived from the fabrication and measurement of single microstrip patch antenna prototypes for radar applications in the industrial, scientific and medical (ISM) band at 24 GHz. Far-reaching potential lies in the utilization of the three-dimensional manufacturing technology for the construction of conformal integrated antenna systems based on the thermoforming capabilities of polymer substrates.

Inductance Investigation of Screen-Printed Radio Frequency Identification Antennas

2015 ◽  
Vol 748 ◽  
pp. 81-84 ◽  
Author(s):  
Ya Ling Li ◽  
Fu Yan Zhao ◽  
Lu Hai Li
Keyword(s):  
Radio Frequency Identification ◽  
Low Cost ◽  
Flexible Substrate ◽  
Core Layer ◽  
Magnetic Core ◽  
Printed Antenna ◽  
Printed Antennas ◽  
Testing Frequency ◽  
Frequency Identification ◽  
Rfid Antennas

Printed antennas fabricated using conductive ink printed on flexible substrate is low-cost and environmental friendly. The inductance and the quality factor are two important parameters for designing RFID antenna and were studied for the printed RFID antennas. The results show that the inductance is not only determined by the size of the designed RFID antenna but also related to the resistance of the printed antenna coils. The inductance increases with the increasing testing frequency, while the Q value decreases with the increasing testing frequency. The soft magnetic ink prepared with γ-Fe2O3 was used to enhance the inductance of the printed antennas with printing technology. The inductance of the printed antenna with the magnetic core layer is increased by 5.7% at 13.56 MHz.

scholarly journals Directive Microstrip Antennas for Specific Below −2.45 GHz Applications

2012 ◽  
Vol 2012 ◽  
pp. 1-6 ◽  
Author(s):  
E. Ávila-Navarro ◽  
C. Reig
Keyword(s):  
Low Cost ◽  
Microstrip Antennas ◽  
Experimental Characterization ◽  
Radiation Patterns ◽  
Printed Antennas ◽  
High Data ◽  
Full Wave ◽  
Log Periodic Antenna

Microstrip printed antennas are the preferred choice in high data ratio modern communications, mainly at 2.45 GHz and above. In this paper, we propose two different approaches of microstrip printed antennas for lower frequency usage. In this sense, we present a printed microstrip Yagi-like antenna at 868 MHz and a printed dipole log-periodic antenna for wider band applications. We focus on the use of low-cost substrates, with a good performance at these frequencies, and giving antennas with useful sizes for such applications. For the analysis, we make use of standard experimental characterization combined with full-wave 3D-FDTD specifically developed simulations. In this way, the S11, radiation patterns, and gain/efficiency figures are given.

scholarly journals Identification of Schedule-Performance Indicators and Delay-Recovery Strategies for Low-Cost Housing Projects

2019 ◽  
Vol 11 (21) ◽  
pp. 6005 ◽  
Author(s):  
Elnaz Safapour ◽  
Sharareh Kermanshachi ◽  
Bahaa Alfasi ◽  
Reza Akhavian
Keyword(s):  
Low Income ◽  
Construction Projects ◽  
Low Cost ◽  
Design And Technology ◽  
Resource Location ◽  
Cost Overruns ◽  
Housing Projects ◽  
Schedule Delay ◽  
Low Cost Housing ◽  
Schedule Performance

Many construction projects suffer from schedule delays that ultimately lead to considerable cost overruns and defeat the purpose of low-cost housing (LCH), which is to support low-income earners. It is, therefore, vital that the schedule delays and cost overruns be minimized. The objectives of this research were to investigate, identify, and classify the schedule-delay indicators (SDIs), prioritize them based on their level of impact, and formulate constructive strategies to improve the schedule performance. To achieve the objectives set forth, 68 interviews were conducted with professionals who are active in LCH projects, and a structured survey was developed and distributed to other experts involved in LCH projects to validate the result of the interviews and collect additional data. Survey responses were collected from 101 individuals and were analyzed. The significant SDIs were identified and classified by the research team and were ranked and prioritized, using the Relative Importance Index (RII) method. The results demonstrated that the identified SDIs could be classified into the following eight main categories: legal, design and technology, project characteristic, project management, material resource, human resource, location, and finance. The outcomes of this study will help project managers and stakeholders identify the causes of schedule delays early in the project and implement effective strategies for improving project performance in low-cost housing projects.

Design of Robotic Arm Using Delay Based Operation of DC Geared Motors With a Microcontroller

2008 ◽  
Author(s):  
Dilshad A. Sulaiman ◽  
Akash B. Pandey
Keyword(s):  
Degrees Of Freedom ◽  
Material Handling ◽  
Pulse Width Modulation ◽  
Mechanical Design ◽  
Low Cost ◽  
Open Loop ◽  
Infrared Light ◽  
Robotic Arm ◽  
Design And Technology ◽  
Stepper Motors

This paper provides the design of a simple robotic arm for pick and place operations as well as other material handling operations. The movements of the arm are anthropometric i.e. resembling the human arm with respect to degrees of freedom so as to provide a human touch in industrial and space operations. This system operates using controlled motion of DC geared motors along with a microcontroller based system (8051 or PIC based). Use of PWM (Pulse Width Modulation) can be used to control the RPM of DC geared motors. This system has the advantage of being simple and low cost with a varied flexibility of operation. A collective array of sensors viz. voice sensor, infrared light sensors, proximity sensors etc. can be incorporated to form a feedback induced closed loop system. Whereas for tasks of picking and placing at a fixed location from another location the system can be operational at open-loop. The material for the robotic arm can be polypropylene or acrylic or aluminium to reduce weight without compromising on the strength and lifting capacity of the robotic arm, such that the torque of the DC geared motors (actuators) at each joint are sufficient to lift the arm along with the weight at the end effector. Clutch and gear shifting mechanism can be used to increase the degrees of freedom per actuator. The driving circuit mainly consists of the microcontroller and H-bridge drivers using an 8-bit port to control 4 DC geared motors per port simultaneously or one at a time using delay commands. DC geared motors are quite cheaper than stepper motors and RC Servos thus reducing the total cost of the system drastically. Plus being light weight, DC geared motors reduce the total weight of the system. This paper will also throw light on the programming aspects for the microcontroller (8051 or PIC based) along with the compatible flash programmers and HEX code generators. This project will further explain on the approach followed in the mechanical design of the robotic arm (motion, work volume etc.) as well as the possible future applications of the robotic arm. Also the design of the robotic arm on CAD tools like Solidworks will be discussed in brief along with the modeling and simulation of the various links of the arm as well as the whole assembly of the system. With increasing popularity of Automation, robotic arms are the present and future of all industrial operations. Finally the paper concludes on the further improvements in design and technology.

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