Active thermal control for improved reliability of power electronics systems

2016 ◽  
pp. 195-222
Author(s):  
Ke Ma ◽  
Zian Qin ◽  
Dao Zhou
Keyword(s):  
Power Electronics ◽  
Thermal Control

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

2017 ◽  
Author(s):  
Michal Talmor ◽  
Jamal Yagoobi
Keyword(s):  
Power Electronics ◽  
High Power ◽  
Cooling System ◽  
Thermal Control ◽  
Small Scale ◽  
Dielectric Fluid ◽  
Performance Characterization ◽  
Micro Scale ◽  
Coupled Equations ◽  
Moving Parts

As technological advances lead to miniaturization of high power electronics, the concentration of heat generating components per area increases to the point of requiring innovative, integrated cooling solutions to maintain operational temperatures. Traditional coolant pumps have many moving parts, making them susceptible to mechanical failure and requiring periodic maintenance. Such devices are too complex to be miniaturized and embedded in small scale systems. Electrohydrodynamic (EHD) conduction pumps offer an alternative way of generating fluid flow in small scales for use in modern thermal control systems for high power electronics, both for terrestrial and aerospace applications. In EHD conduction, the interaction between an applied electrical field and the dissociation of electrolyte species in a dielectric fluid generates an accumulation of space charge near the electrodes, known as heterocharge layers. These layers apply electric body forces in the fluid, resulting in a flow in the desired direction based on the pump characteristics. EHD conduction pumps work with dielectric fluids and have simple, flexible designs with no moving parts. These pumps have very low power consumption, operate reliably for longer periods than mechanical pumps, and have the ability to operate in microgravity. EHD conduction pumps have been previously proven effective for heat transfer enhancement in multiple size scales, but were only studied in a flush ring or flush flat electrode configurations at the micro-scale. This study provides the pressure and flow rate generation performance characterization for a micro-scale pump with perforated electrodes, designed to be manufactured and assembled using innovative techniques, and incorporated into an evaporator embedded in an electronic cooling system. The performance of the pump is numerically simulated based on the fully coupled equations of the EHD conduction model, showcasing the distinctive heterocharge layer structure and subsequent force generation unique to this innovative design.

Fundamental frequency region-based thermal control of power electronics modules in high power motor drive

2018 ◽  
Vol 88-90 ◽  
pp. 1242-1246
Author(s):  
Peng Fan ◽  
Shoudao Huang ◽  
Huai Wang ◽  
Derong Luo ◽  
Huimin Li ◽  
...  
Keyword(s):  
Power Electronics ◽  
Fundamental Frequency ◽  
High Power ◽  
Thermal Control ◽  
Frequency Region ◽  
Motor Drive

Novel, Matched CTE Integrated Substrates for Power Electronics

1998 ◽  
Vol 515 ◽  
Author(s):  
W. Kowbel ◽  
X. Xia ◽  
C. Bruce ◽  
J. C. Withers
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
Electronic Packaging ◽  
Process Integration ◽  
Electronic Devices ◽  
Carbon Matrix ◽  
Thermal Control ◽  
Dielectric Coating ◽  
Silicon Chips ◽  
Low Dielectric

ABSTRACTRapid advances in high power electronic packaging require the development of new heat-sink/substrate materials. Advanced composites designed to provide thermal control as well as improved thermal conductivity have the potential to provide benefits in the removal of excess heat from electronic devices. Carbon-carbon (C-C)composites are under consideration for numerous electronic packaging applications. A new manufacturing process has been developed to produce high thermal conductivity (400 W/mK) C-C composites at greatly reduced cost (less than $50/lb). However, low CTE (0.25 × 10−6cm/cm °C) of C-C composites results in reduced fatigue life in chipon- board (COB) applications with silicon chips (CTE ≈ 2.6 × 10−6 cm/cm °C). A novel process was developed to convert the carbon matrix into the SiC matrix which retains the overall high composite thermal conductivity. This novel technology is well-suited for COB applications. Several types of coatings, such as CVD AIN, CVD Si and a polymer slurry-based low dielectric coating were applied to the C-SiC composite. Processing schemes were developed to produce crack-free coatings. Metallization of the dielectric coating was performed for the process integration with electronic devices. Thus, integrated substrates for power electronics were fabricated without the need of conventional metal/ceramic joining and associated high stresses. The properties of this new composite material for power electronics substrates are presented.

Scanning-probe microscope analysis of optical thin films: A new analytical tool in a manufacturing environment

1994 ◽  
Vol 52 ◽  
pp. 1068-1069
Author(s):  
S. P. Sapers ◽  
R. Clark ◽  
P. Somerville
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Control ◽  
Scanning Probe Microscope ◽  
Scanning Probe ◽  
List Type ◽  
Manufacturing Environment ◽  
Physical Measurements ◽  
Probe Microscope

OCLI is a leading manufacturer of thin films for optical and thermal control applications. The determination of thin film and substrate topography can be a powerful way to obtain information for deposition process design and control, and about the final thin film device properties. At OCLI we use a scanning probe microscope (SPM) in the analytical lab to obtain qualitative and quantitative data about thin film and substrate surfaces for applications in production and research and development. This manufacturing environment requires a rapid response, and a large degree of flexibility, which poses special challenges for this emerging technology. The types of information the SPM provides can be broken into three categories:(1)Imaging of surface topography for visualization purposes, especially for samples that are not SEM compatible due to size or material constraints;(2)Examination of sample surface features to make physical measurements such as surface roughness, lateral feature spacing, grain size, and surface area;(3)Determination of physical properties such as surface compliance, i.e. “hardness”, surface frictional forces, surface electrical properties.

Miniature Heat Pipes for Thermal Control of Radio-Electronic Equipment

2007 ◽  
Vol 38 (3) ◽  
pp. 245-258 ◽  
Author(s):  
Leonid L. Vasiliev ◽  
Andrei G. Kulakov ◽  
L. L. Vasiliev, Jr ◽  
Mikhail I. Rabetskii ◽  
A. A. Antukh
Keyword(s):  
Heat Pipes ◽  
Thermal Control ◽  
Electronic Equipment ◽  
Radio Electronic
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