Recent advances of silicon wafer cutting technology for photovoltaic industry

2021 ◽  
Vol 118 (6) ◽  
pp. 616
Author(s):  
Changyong Chen ◽  
Meng Sun ◽  
Xiaoqing Chen ◽  
Yi Wang ◽  
Zhouhua Jiang ◽  
...  
Keyword(s):  
Service Life ◽  
Silicon Wafer ◽  
Production Efficiency ◽  
Surface Damage ◽  
Minimum Thickness ◽  
Large Size ◽  
Fine Wire ◽  
Wire Saw ◽  
Great Progress ◽  
Diamond Abrasive

Using ultra-fine wire saw to cut solar grade silicon wafer is a very precise technology. In the past 20 years, researchers have done a lot of research and made great progress. The cutting method of silicon rod has developed from single line cutting to multi line simultaneous cutting, which greatly improves the production efficiency and the yield of silicon rod. However, the problems of high cutting loss, low cutting efficiency, and large surface damage of silicon wafer need to be solved; The surface of wire saw line has developed from smooth surface to coated diamond abrasive, which greatly improves the service life of wire saw line; The method of coated diamond abrasive on the surface of wire saw line has developed from resin consolidation to electroplating consolidation, which greatly improves the service life of wire saw line it improves the firmness of the coating; The arrangement of wire saw wire has developed from single wire to multi wire stranding, which makes the wire saw wire can cut large-size silicon rod; The minimum thickness of silicon wafer that can be cut is about 100–140 µm according to the perspective of stress analysis, while the excetive value should be located by more research.

Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer

2009 ◽  
Vol 416 ◽  
pp. 529-534 ◽  
Author(s):  
Ren Ke Kang ◽  
Shang Gao ◽  
Zhu Ji Jin ◽  
Dong Ming Guo
Keyword(s):  
Silicon Wafer ◽  
Chemical Reaction ◽  
Removal Rate ◽  
Surface Damage ◽  
Amorphous Layer ◽  
Diamond Wheel ◽  
Wafer Surface ◽  
Abrasive Wheel ◽  
Grinding Performance ◽  
Diamond Abrasive

With the development of IC manufacturing technology, the machining precision and surface quality of silicon wafer are proposed much higher, but now the planarization techniques of silicon wafer using free abrasive and bonded abrasive have the disadvantage of poor profile accuracy, environmental pollution, deep damage layer, etc. A soft abrasive wheel combining chemical and medical effect was developed in this paper, it could get super smooth, low damage wafer surface by utilizing mechanical friction of abrasives and chemical reaction among abrasives, additives, silicon. A comparison experiment between #3000 soft abrasive wheel and #3000 diamond abrasive wheel was given to study on the grinding performance of soft abrasive wheel. The results showed that: wafer surface roughness ground by soft abrasive wheel was sub-nanometer and its sub-surface damage was only 0.01µm amorphous layer, which were much better than silicon wafer ground by diamond abrasive wheel, but material removal rate and grinding ratio of soft abrasive wheel were lower than diamond wheel. The wafer surface ground by soft abrasive wheel included Ce4+, Ce3+, Si4+, Ca2+ and Si, which indicated that the chemical reaction really occurred during grinding process.

STUDIES ON THE USE OF FABA BEANS IN RATIONS FOR LAYING HENS

1977 ◽  
Vol 57 (3) ◽  
pp. 421-425 ◽  
Author(s):  
A. R. ROBBLEE ◽  
D. R. CLANDININ ◽  
R. T. HARDIN ◽  
G. R. MILNE ◽  
K. DARLINGTON
Keyword(s):  
Egg Production ◽  
Egg Size ◽  
Production Efficiency ◽  
White Leghorn ◽  
Feed Conversion ◽  
Considerable Decrease ◽  
Large Size ◽  
Vicia Faba L ◽  
Faba Beans

In two experiments, White Leghorn pullets kept in batteries were fed rations containing 0, 5, 10, 15, 20 or 30% raw faba beans (Vicia faba L.) for 336 days. The rations were designed to be isocaloric, isonitrogenous and to have equal levels of methionine plus cystine. The results obtained indicated that levels up to and including 20% faba beans in ration ssupplemented with methionine had no adverse effect on mortality, rate of egg production, efficiency of feed conversion or body weight. A level of 30% faba beans resulted in increased mortality, and decreased egg production and feed conversion in one experiment but had no effect in the other. Egg size tended to decrease as the level of faba beans in the ration increased, resulting in a considerable decrease in the percentage of "large size" eggs graded according to Canadian standards. There was an increase in interior quality of the eggs as measured by Haugh units as the level of faba beans used increased. Specific gravity of the eggs was not affected by use of faba beans in the rations.

Development of the Manufacture Equipment for Resin Bonded Diamond Abrasive Wire Saw

2012 ◽  
Vol 588-589 ◽  
pp. 1694-1697 ◽  
Author(s):  
Wen Bo Bi ◽  
Pei Qi Ge ◽  
Yu Fei Gao ◽  
Zhen Jie Zhu
Keyword(s):  
Kdp Crystal ◽  
Wire Saw ◽  
The Wire ◽  
Diamond Abrasive

This paper introduces the structure of the resin bonded abrasive wire saw manufacture equipment. The equipment can complete the process of the wire saw production, including uncoiling wire, cleaning wire, binder coating, Pre-curving and coiling wire. Wire saw are manufactured successfully by this equipment in the manufacture experiment. The quality of the wire saw was examined by SEM. The average slicing ability of the wire saw is 205 mm2 per meter in the experiment of KDP crystal slicing.

scholarly journals Study on the Abrasive Retention Capacity on the Surface of Electroplated Diamond Wire Saw

2021 ◽  
Author(s):  
Jintao Zheng ◽  
Qian Xie ◽  
Peiqi Ge ◽  
Jianfeng Meng ◽  
Wenbo Bi
Keyword(s):  
Finite Element ◽  
Compressive Stress ◽  
Research Work ◽  
Residual Compressive Stress ◽  
Crystal Silicon ◽  
Retention Capacity ◽  
Diamond Wire ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
Diamond Abrasive

Abstract The quality and efficiency of slicing will be reduced if the abrasives on the surface of diamond wire saw shed in sawing. Generally, the diamond abrasives are held on the surface of electroplated diamond wire saw by a nickel-plated layer, and the abrasive retention state, reflecting abrasive shedding, can be characterized by the plastic deformation of the plating layer at the interface between the nickel-plated layer and the abrasive. To gain an in-depth understanding of the abrasive shedding mechanism, a finite element model of the double-cone diamond abrasive embedded in a nickel-plated layer was established in this paper to research the effects of the residual compressive stress and hardness of the nickel-plated layer as well as the protrusion height of the diamond abrasive on the abrasive retention capacity. The results show that the presence of the residual compressive stress in the nickel-plated layer resulted in the decrease of the abrasive retention capacity. And the higher hardness of the nickel-plated layer could enhance its abrasive retention capacity. Furthermore, the depth of the diamond abrasive inside the nickel-plated layer was decreased with the increase of its protrusion height, which would reduce the abrasive retention capacity. Based on the results of the finite element analysis, a calculation procedure of abrasive shedding rate was presented. Subsequently, the slicing experiment of a single crystal silicon rod was carried out by the Meyer Burger RTD6800 multi-wire sawing machine and the electroplated diamond wire saw with a core wire diameter of 65μm. The abrasive shedding rate of the diamond wire saw caused by sawing was analyzed theoretically and experimentally. The research work is of great significance to improve the quality detection and evaluation of electroplated diamond wire saw.

scholarly journals DEVELOPMENT OF LOW-MELTING GLASSCERAMIC BONDS FOR HIGH RESOURCE DIAMOND-ABRASIVE TOOLS

2021 ◽  
pp. 103-112
Author(s):  
Olena Fedorenko ◽  
Larysa Yashchenko ◽  
Dmytro Fedorenko ◽  
Volodymyr Fedorovych ◽  
Oleksandr Koniev
Keyword(s):  
Service Life ◽  
Pore Structure ◽  
Glass Ceramic ◽  
Open Structure ◽  
Working Layer ◽  
High Resource ◽  
Large Pore ◽  
Abrasive Tools ◽  
Bearing Layer ◽  
Diamond Abrasive

Research is aimed at creating high-resource diamond-abrasive tools with a large-pore structure of the working layer, the use of which reduces the occurrence of grinding defects when processing materials sensitive to overheating. The formation of an open structure of the working layer ensures effective chip removal, which excludes a decrease in the сutting ability of the tool due to contamination with grinding sludge and creates favorable conditions for intensifying the processing of materials when using high-speed cutting modes. As part of the research, low-melting glass-ceramic binders for diamond-abrasive tools have been developed, which make it possible to increase the tool service life  due to the prevention of diamond grains premature destruction and the creation of a large-pore open structure of the working layer. Using a set of calculated data about the main characteristics of glass compositions by factor planning means, the dependences «composition - properties» were determined and the area of optimal compositions of glass-ceramic bonds was established, which ensure sintering of a diamond-containing composite at a temperature of 550–650 °C. The efficiency of the use of alumino-silicate microspheres of technogenic origin as a structure-forming filler providing the formation of a large-pore structure is shown. The features of the chemical and phase composition of the technogenic spheres recovered from the fly ash of the Krivoy Rog TPP have been determined. It has been established that when the diamond-bearing layer of the tool is sintered in the shell of the ash spheres, crystalline new formations with high hardness (hercynite, mullite, maghemite, spinel) are formed. Using ash spheres and developed low-melting binders, which include up to 30 mass. % of glass waste, the laboratory samples of diamond-containing composites with open porosity of 45-50% were made. Studies of their microstructure and morphological features made it possible to determine the pore size (130-200 μm) and establish that during grinding, partial destruction of ash spheres occurs with the formation of additional cutting elements, which increases the tool cutting ability. The research results indicate the advisability of using the proposed approach for selection of the diamond-ceramic composite components and the modes of heat treatment of the diamond-bearing layer when creating a tool. This approach will significantly expand the possibilities of manufacturing large-pore diamond-abrasive tools with a high service life at minimal material costs and will improve the processing of parts made of difficult-to-machine materials.

The Research on the Improved CMG Tool for Al2O3 Ceramic

2011 ◽  
Vol 121-126 ◽  
pp. 514-518
Author(s):  
Heng Zhen Dai ◽  
Zhu Ji Jin ◽  
Shang Gao ◽  
Zhan Chun Tao ◽  
Feng Wei Huo
Keyword(s):  
Material Removal ◽  
High Efficiency ◽  
Removal Rate ◽  
Surface Damage ◽  
Ceramic Specimen ◽  
Al2o3 Ceramic ◽  
Mechanical Removal ◽  
Ultra Precision ◽  
Ceramic Process ◽  
Diamond Abrasive

A new D/SiO2 CMG tool for Al2O3 ceramic process was developed by adding some diamond abrasive into SiO2 CMG tool. The solid state reaction between the CMG tool and Al2O3 ceramic played a key role for achieving ultra-precision, high efficiency and low damage.Three kinds of formulations for the D/SiO2 tool were tested and evaluated. The material removal rate(MRR) of Al2O3 ceramic mainly depended on the content of diamond abrasive. In contrast with the corresponding SiO2 tool,the D/ SiO2 tool, which had minimal content of diamond abrasive,could achieve a minimal Ra and better MRR. The enhanced mechanical removal action made the MRR improve nearly twice times, and the process surface roughness of Al2O3 ceramic specimen using the D/ SiO2 tool kept almost same value as using the SiO2 tool without surface damage. Thus the D/ SiO2 tool is more suitable for process of Al2O3 ceramic workpieces.

Effectivity of Total Productive Maintenance (TPM) in Large Size Organizations – A Case Study in Shandong Lingong

2014 ◽  
Vol 701-702 ◽  
pp. 1249-1252
Author(s):  
Xiang Jie Lin ◽  
Qiang Lin ◽  
Guang Na Zhang
Keyword(s):  
Staff Training ◽  
Production Efficiency ◽  
Spare Parts ◽  
Production Plan ◽  
Rate Reduction ◽  
Total Productive Maintenance ◽  
Breakdown Time ◽  
Large Size ◽  
Spare Parts Management

Poor information of TPM case study can be found, which is important for TPM implementation. This paper introduced TPM implementation in Shandong Lingong (SDLG) with two years of data collection and practice. The company conducted equipment classification, production plan improvement, failure rate reduction, spare parts management and staff training practices based on MTTR, MTBF and OEE figures. Results showed that MTTR is complicate while MTBF and OEE showed better fits with the company reality of TPM. Thorough the practice and execution of TPM the company get better OEE and less breakdown time, which increase the production efficiency in the end.

Experimental Study on Temperature during Wire Saw Slicing

2013 ◽  
Vol 481 ◽  
pp. 153-157
Author(s):  
Chun Yan Yao ◽  
Zong Hua Xu ◽  
Wei Zhang ◽  
Qiao Fang Zhang ◽  
Wei Peng
Keyword(s):  
Experimental Study ◽  
Silicon Wafer ◽  
Silicon Wafers ◽  
Silicon Ingot ◽  
Maximum Value ◽  
Wire Saw ◽  
The Wire ◽  
Fixed Abrasive Wire Saw ◽  
Fixed Abrasive

Heat generated during wire saw slicing can cause silicon temperature raise and make silicon wafer warpage, especially for larger silicon wafers. In order to study the wire saw effect on silicon temperature during slicing process, three kinds of wire saw, mainly semi-fixed abrasive wire saw and traditional wire saw, are applied for slicing silicon ingot. In this paper, the thermocouple is used to measure the temperature of the silicon during wire saw slicing. The experiment results show that the temperature of the silicon increases along with the wire saw working direction and reaches maximum value near the outlet position of silicon. The temperature of the silicon sliced by semi-fixed abrasive wire saw is lower than that sliced by traditional wire saw.

Numerical Optimization of the Parison Thickness of Oil Drum in Extrusion Blow Molding

2014 ◽  
Vol 881-883 ◽  
pp. 1455-1459
Author(s):  
Jian Wang ◽  
Jiong Peng ◽  
Jin Nan Chen ◽  
Jing Li
Keyword(s):  
High Density Polyethylene ◽  
Numerical Optimization ◽  
Production Efficiency ◽  
Thickness Distribution ◽  
Uniform Thickness ◽  
Inflation Pressure ◽  
Isothermal Process ◽  
Minimum Thickness ◽  
Blow Molding ◽  
Extrusion Blow Molding

The optimization parison thickness can reduce the oil drum weight and meet the requirement of the minimum thickness. The profile thickness of the extruded parison can be optimized by simulation. Under different blowing pressures, extrusion blow molding non-isothermal process of the high density polyethylene oil drum with a handle was simulated by using Polyflow. The initial parison was respectively divided into 11, 51, 101 and infinite segments. After seven optimizations, the oil drum wall thickness was equal or larger than 2 mm. An appropriate inflation pressure of 0.6 MPa was obtained. The results show that the production efficiency increases with the inflation pressure increasing. With the parison segments increasing, the oil drum thickness distribution inflated from the optimized parison is more uniform and approaches to the required thickness. The oil drum mass is decreased with the segments increasing. It is necessary that the non-uniform thickness parison was produced by injection molding.

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