Grain growth kinetics during ion beam irradiation of chemical vapor deposited amorphous silicon

1990 ◽  
Vol 57 (6) ◽  
pp. 554-556 ◽  
Author(s):  
C. Spinella ◽  
S. Lombardo ◽  
S. U. Campisano
1997 ◽  
Vol 82 (11) ◽  
pp. 5480-5483 ◽  
Author(s):  
A. Baba ◽  
H. Aramaki ◽  
T. Sadoh ◽  
T. Tsurushima

2007 ◽  
Vol 106 (1) ◽  
pp. 54-57 ◽  
Author(s):  
Kyung Chan Kim ◽  
Han Jin Ahn ◽  
Jong Bok Kim ◽  
Byoung Har Hwang ◽  
Jong Tae Kim ◽  
...  

1989 ◽  
Vol 157 ◽  
Author(s):  
C. Spinella ◽  
S. Lombardo ◽  
S. U. Campisano

ABSTRACTThe ion beam induced growth of isolated silicon grains has been studied in chemical vapor deposited amorphous layers. The crystal radius increases linearly with the 1on dose and the growth rate depends in a complex way on the irradiation temperature in the 320 - 480 °C investigated temperature range. The grain density does not depend on the ion dose but it increases exponentially with increasing irradiation temperature. The grain density obtained after a pure thermal process on similar samples is In any case larger than the density appearing after ion irradiation. These facts may be explained by assuming that during ion irradiation only pre-existing seeds whose size is larger than a critical value can grow. This critical cluster size is larger than the critical cluster size for a pure thermal process.


2007 ◽  
Vol 4 (8) ◽  
pp. 100743 ◽  
Author(s):  
D. Kaoumi ◽  
A. T. Motta ◽  
R. C. Birtcher ◽  
R. Lott ◽  
S. W. Dean

1990 ◽  
Vol 41-42 ◽  
pp. 619-626 ◽  
Author(s):  
F. Priolo ◽  
A. La Ferla ◽  
C. Spinella ◽  
E. Rimini ◽  
S.U. Campisano ◽  
...  

Author(s):  
L. J. Chen ◽  
L. S. Hung ◽  
J. W. Mayer

When an energetic ion penetrates through an interface between a thin film (of species A) and a substrate (of species B), ion induced atomic mixing may result in an intermixed region (which contains A and B) near the interface. Most ion beam mixing experiments have been directed toward metal-silicon systems, silicide phases are generally obtained, and they are the same as those formed by thermal treatment.Recent emergence of silicide compound as contact material in silicon microelectronic devices is mainly due to the superiority of the silicide-silicon interface in terms of uniformity and thermal stability. It is of great interest to understand the kinetics of the interfacial reactions to provide insights into the nature of ion beam-solid interactions as well as to explore its practical applications in device technology.About 500 Å thick molybdenum was chemical vapor deposited in hydrogen ambient on (001) n-type silicon wafer with substrate temperature maintained at 650-700°C. Samples were supplied by D. M. Brown of General Electric Research & Development Laboratory, Schenectady, NY.


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