scholarly journals The heat‐of‐mixing effect on ion‐induced grain growth

1991 ◽  
Vol 70 (3) ◽  
pp. 1252-1260 ◽  
Author(s):  
Dale E. Alexander ◽  
Gary S. Was ◽  
L. E. Rehn
1989 ◽  
Vol 157 ◽  
Author(s):  
Dale E. Alexander ◽  
Gary S. Was ◽  
Lynn E. Rehn

ABSTRACTIon irradiation and annealing studies were performed on Ni, Ni-20 at.%Al multilayers and Ni-20 at.%Al co-evaporated thin films. Xe+ ions were used to irradiate the films and homogenize the multilayers at room temperature. Irradiation of alloy films formed a metastable, supersaturated solid solution of γ phase and an HCP phase. Ion induced grain growth occurred in all films. A factor of 2 greater growth was observed in Ni-Al multilayers compared with coevaporated films irradiated to the same dose. The enhancement is attributed to a heat of mixing effect. Post irradiation annealing of the mixed multilayers formed γ*, the morphology of which was dependent upon the presence of Cu in the films due to substrate mixing from the support grid.


1997 ◽  
Vol 45 (7) ◽  
pp. 2921-2930 ◽  
Author(s):  
T. KLASSEN ◽  
U. HERR ◽  
R.S. AVERBACK

1991 ◽  
Vol 235 ◽  
Author(s):  
K. H. Chae ◽  
J. H. Song ◽  
J. H. Joo ◽  
J. J. Woo ◽  
C. N. Whang ◽  
...  

ABSTRACTThe relation between the ion irradiation induced grain growth in bilayer system and the basic parameters involved in ion beam mixing process was studied. TEM micrographs showed that a significant grain growth has been induced by Ar+ irradiation at room temperature. The grain size increases rapidly in low dose region, while it approaches a saturated value in high dose region, and it has close relationship with thermodynamic properties such as cohesive energy ( ΔHc ) and heat of mixing( ΔHm ). The experimental results are in good agreement with the model for the grain growth based on the thermal spike induced atomic migration.


Author(s):  
B. B. Rath ◽  
J. E. O'Neal ◽  
R. J. Lederich

Addition of small amounts of erbium has a profound effect on recrystallization and grain growth in titanium. Erbium, because of its negligible solubility in titanium, precipitates in the titanium matrix as a finely dispersed second phase. The presence of this phase, depending on its average size, distribution, and volume fraction in titanium, strongly inhibits the migration of grain boundaries during recrystallization and grain growth, and thus produces ultimate grains of sub-micrometer dimensions. A systematic investigation has been conducted to study the isothermal grain growth in electrolytically pure titanium and titanium-erbium alloys (Er concentration ranging from 0-0.3 at.%) over the temperature range of 450 to 850°C by electron microscopy.


Author(s):  
R. E. Franck ◽  
J. A. Hawk ◽  
G. J. Shiflet

Rapid solidification processing (RSP) is one method of producing high strength aluminum alloys for elevated temperature applications. Allied-Signal, Inc. has produced an Al-12.4 Fe-1.2 V-2.3 Si (composition in wt pct) alloy which possesses good microstructural stability up to 425°C. This alloy contains a high volume fraction (37 v/o) of fine nearly spherical, α-Al12(Fe, V)3Si dispersoids. The improved elevated temperature strength and stability of this alloy is due to the slower dispersoid coarsening rate of the silicide particles. Additionally, the high v/o of second phase particles should inhibit recrystallization and grain growth, and thus reduce any loss in strength due to long term, high temperature annealing.The focus of this research is to investigate microstructural changes induced by long term, high temperature static annealing heat-treatments. Annealing treatments for up to 1000 hours were carried out on this alloy at 500°C, 550°C and 600°C. Particle coarsening and/or recrystallization and grain growth would be accelerated in these temperature regimes.


Author(s):  
Zhiheng Huang ◽  
Zhiyong Wu ◽  
Hua Xiong ◽  
Yucheng Ma

Abstract Microstructure and its effect on mechanical behavior of ultrafine interconnects have been studied in this paper using a modeling approach. The microstructure from the processes of solidification, spinodal decomposition, and grain growth in ultrafine interconnects has highlighted its importance. The size, geometry and composition of interconnects as well as the elastic energy can influence microstructure and thus the mechanical behavior. Quantification of microstructure in ultrafine interconnects is a necessary step to establish the linkage between microstructure and reliability.


2013 ◽  
Vol 48 (2) ◽  
pp. 199-204 ◽  
Author(s):  
Zhuanzhuan ZHANG ◽  
Chuansong WU ◽  
Jinqiang Gao

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