Ultra-low resistance ohmic contacts to GaN with high Si doping concentrations grown by molecular beam epitaxy

2012 ◽  
Vol 101 (3) ◽  
pp. 032109 ◽  
Author(s):  
Faiza Afroz Faria ◽  
Jia Guo ◽  
Pei Zhao ◽  
Guowang Li ◽  
Prem Kumar Kandaswamy ◽  
...  
1995 ◽  
Vol 66 (11) ◽  
pp. 1412-1414 ◽  
Author(s):  
M. P. Patkar ◽  
T. P. Chin ◽  
J. M. Woodall ◽  
M. S. Lundstrom ◽  
M. R. Melloch

1994 ◽  
Vol 33 (Part 2, No. 3B) ◽  
pp. L413-L416 ◽  
Author(s):  
Yoshiji Horikoshi ◽  
Mike R. Fahy ◽  
Minoru Kawashima ◽  
Kazuaki Furukawa ◽  
Masaie Fujino ◽  
...  

2013 ◽  
Vol 102 (22) ◽  
pp. 223105 ◽  
Author(s):  
Chloé Rolland ◽  
Philippe Caroff ◽  
Christophe Coinon ◽  
Xavier Wallart ◽  
Renaud Leturcq

1981 ◽  
Vol 19 (3) ◽  
pp. 626-627 ◽  
Author(s):  
J. M. Woodall ◽  
J. L. Freeouf ◽  
G. D. Pettit ◽  
T. Jackson ◽  
P. Kirchner

1992 ◽  
Vol 281 ◽  
Author(s):  
C. Piskoti ◽  
B. Mykolajenko ◽  
M. Vaziri

ABSTRACTTo study the formation of ohmic contacts, several metals have been deposited on p-types ZnTe and ZnSe epitaxial layers. The metals were deposited on the layers either by simple evaporation or by electroplating. The current-voltage characteristics associated with each metal contact were measured. The preliminary results of these measurements indicate that electroplating is a better technique for making ohmic contact to these layers.


1978 ◽  
Vol 33 (7) ◽  
pp. 651-653 ◽  
Author(s):  
P. A. Barnes ◽  
A. Y. Cho

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