Nonalloyed Ohmic contacts ton‐GaAs by molecular beam epitaxy

1978 ◽  
Vol 33 (7) ◽  
pp. 651-653 ◽  
Author(s):  
P. A. Barnes ◽  
A. Y. Cho
1995 ◽  
Vol 66 (11) ◽  
pp. 1412-1414 ◽  
Author(s):  
M. P. Patkar ◽  
T. P. Chin ◽  
J. M. Woodall ◽  
M. S. Lundstrom ◽  
M. R. Melloch

1981 ◽  
Vol 19 (3) ◽  
pp. 626-627 ◽  
Author(s):  
J. M. Woodall ◽  
J. L. Freeouf ◽  
G. D. Pettit ◽  
T. Jackson ◽  
P. Kirchner

1992 ◽  
Vol 281 ◽  
Author(s):  
C. Piskoti ◽  
B. Mykolajenko ◽  
M. Vaziri

ABSTRACTTo study the formation of ohmic contacts, several metals have been deposited on p-types ZnTe and ZnSe epitaxial layers. The metals were deposited on the layers either by simple evaporation or by electroplating. The current-voltage characteristics associated with each metal contact were measured. The preliminary results of these measurements indicate that electroplating is a better technique for making ohmic contact to these layers.


2012 ◽  
Vol 101 (3) ◽  
pp. 032109 ◽  
Author(s):  
Faiza Afroz Faria ◽  
Jia Guo ◽  
Pei Zhao ◽  
Guowang Li ◽  
Prem Kumar Kandaswamy ◽  
...  

1994 ◽  
Vol 337 ◽  
Author(s):  
M. Hong ◽  
D. Vakhshoori ◽  
J. P. Mannaerts ◽  
J. Kwo

ABSTRACTVery low-resistivity non-alloyed ohmic contacts (Rc) to both p- and n-GaAs were realized using molecular beam epitaxy (MBE) in a vacuum integrated system. Three different metals of Au, Ag, and Nb were in-situ deposited on (1) p+-GaAs which was heavily Be-doped either in a uniform doping or with a 5-doping scheme; and (2) n+-GaAs which was doped in a 5-pair Si δ-doping with a spacer GaAs-Si 2.5 nm thick. In both cases, low Rc values of ≤ (1-5) x 10-7 Ω-cm2 were achieved.


1988 ◽  
Vol 38 (2) ◽  
pp. 224-230 ◽  
Author(s):  
M. Láznička ◽  
P. Trung Dung ◽  
J. Oswald ◽  
V. Vorlíček ◽  
I. Gregora ◽  
...  

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