Temperature-dependent failure mechanism of SnAg solder joints with Cu metallization after current stressing: Experimentation and analysis
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2010 ◽
Vol 26
(8)
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pp. 737-742
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Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling
2019 ◽
Vol 7
(1)
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pp. 99-107
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2012 ◽
pp. 273-295
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2006 ◽
Vol 35
(10)
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pp. 1781-1786
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