A novel measurement theory for inventory of working fluid and vacuum pressure of heat pipe

2009 ◽  
Vol 32 (6) ◽  
pp. 765-770
Author(s):  
Chun‐Chang Lu ◽  
Wei‐Keng Lin
2018 ◽  
Vol 49 (17) ◽  
pp. 1721-1744 ◽  
Author(s):  
Adnan Sözen ◽  
Erdem Çiftçi ◽  
Selçuk Keçel ◽  
Metin Gürü ◽  
Halil Ibrahim Variyenli ◽  
...  

2020 ◽  
Vol 38 (1A) ◽  
pp. 88-104
Author(s):  
Anwar S. Barrak ◽  
Ahmed A. M. Saleh ◽  
Zainab H. Naji

This study is investigated the thermal performance of seven turns of the oscillating heat pipe (OHP) by an experimental investigation and CFD simulation. The OHP is designed and made from a copper tube with an inner diameter 3.5 mm and thickness 0.6 mm and the condenser, evaporator, and adiabatic lengths are 300, 300, and 210 mm respectively.  Water is used as a working fluid with a filling ratio of 50% of the total volume. The evaporator part is heated by hot air (35, 40, 45, and 50) oC with various face velocity (0.5, 1, and 1.5) m/s. The condenser section is cold by air at temperature 15 oC. The CFD simulation is done by using the volume of fluid (VOF) method to model two-phase flow by conjugating a user-defined function code (UDF) to the FLUENT code. Results showed that the maximum heat input is 107.75 W while the minimum heat is 13.75 W at air inlet temperature 35 oC with air velocity 0.5m/s. The thermal resistance decreased with increasing of heat input. The results were recorded minimum thermal resistance 0.2312 oC/W at 107.75 W and maximum thermal resistance 1.036 oC/W at 13.75W. In addition, the effective thermal conductivity increased due to increasing heat input.  The numerical results showed a good agreement with experimental results with a maximum deviation of 15%.


Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano

A novel two-port thermal flux method is implemented for degassing a microscale loop heat pipe (mLHP) and charging it with a working fluid. The mLHP is fabricated on a silicon wafer using standard MEMS micro-fabrication techniques, and capped by a Pyrex wafer, using anodic bonding. For these devices, small volumes and large capillary forces render conventional vacuum pump-based methods quite impractical. Instead, we employ thermally generated pressure gradients to purge non-condensible gases from the device, by vapor convection. Three different, high-temperature-compatible, MEMS device packaging techniques have been studied and implemented, in order to evaluate their effectiveness and reliability. The first approach uses O-rings in a mechanically sealed plastic package. The second approach uses an aluminum double compression fitting assembly for alignment, and soldering for establishing the chip-to-tube interconnects. The third approach uses a high temperature epoxy to hermetically embed the device in a machined plastic base package. Using water as the working fluid, degassing and filling experiments are conducted to verify the effectiveness of the thermal flux method.


Author(s):  
D. Sugumar ◽  
Kek Kiong Tio

A micro heat pipe will operate effectively by achieving its maximum possible heat transport capacity only if it is to operate at a specific temperature, i.e., design temperature. In reality, micro heat pipe’s may be required to operate at temperatures different from the design temperature. In this study, the heat transport capacity of an equilateral triangle micro heat pipe is investigated. The micro heat pipe is filled optimally with working fluid for a specific design temperature and operated at different operating temperatures. For this purpose, water, pentane and acetone was selected as the working fluids. From the numerical results obtained, it shows that the optimal charge level of the micro heat pipe is dependent on the operating temperature. Furthermore, the results also shows that if the micro heat pipe is to be operated at temperatures other than its design temperature, its heat transport capacity is limited by the occurrence of flooding at the condenser section or dryout at the evaporator section, depending on the operating temperature and type of working fluid. It is observed that when the micro heat pipe is operated at a higher temperature than its design temperature, the heat transport capacity increases but limited by the onset of dryout at the evaporator section. However, the heat transport capacity decreases if it is to be operated at lower temperatures than its design temperature due to the occurrence of flooding at condenser end. From the results obtained, we can conclude that the performance of a micro heat pipe is decreased if it is to be operated at temperatures other than its design temperature.


2016 ◽  
Vol 114 ◽  
pp. 02081
Author(s):  
Patrik Nemec ◽  
Milan Malcho

In this investigation of multi heat pipe induced in heat exchanger shows the developments in heat transfer is to improve the efficiency of heat exchangers. Water is used as a heat transfer fluid and acetone is used as a working fluid. Rotameter is set to measure the flow rate of cold water and hot water. To maintain the parameter as experimental setup. Then set the mass flow rate of hot water as 40 LPH, 60LPH, 80 LPH, 100LPH, 120 LPH and mass flow rate of cold water as 20 LPH, 30 LPH, 40 LPH, 50 LPH, and 60 LPH. Then 40 C, 45 ºC, 50 ºC, 55 C, 60 ºC are the temperatures of hot water at inlet are maintained. To find some various physical parameters of Qc , hc , Re ,, Pr , Rth. The maximum effectiveness of the investigation obtained from condition of Thi 60 C, Tci 32 C and 100 LPH mhi, 60 LPH mci the maximum effectiveness attained as 57.25. Then the mhi as 100 LPH, mci as 60 LPH and Thi at 40 C as 37.6%. It shows the effectiveness get increased about 34.3 to the maximum conditions.


Energies ◽  
2021 ◽  
Vol 14 (22) ◽  
pp. 7582
Author(s):  
Hongzhe Zhang ◽  
Fang Ye ◽  
Hang Guo ◽  
Xiaoke Yan

In the geyser boiling mode, the working fluid state is divided into a boiling process and a quiet process, and the sodium-potassium (Na-K) alloy heat pipe can discontinuously transfer heat at each boiling. The overheating of the liquid working fluid at the bottom causes short-term boiling and forms slug bubble, the strong condensing ability quickly conducts heat from the evaporator section. And geyser boiling can occur before the working fluid forms continuous flow, so it transfers more heat at lower temperatures than natural convection cooling. In this study, the heat transfer process of a Na-K alloy heat pipe with forced convection cooling under different heating power was experimental studied. The geyser boiling mode can make the Na-K alloy heat pipe work below 650 °C and reduce the start-up time. In the process of geyser boiling, the heat transfer quantity was increased by the boiling frequency and the amount of vapor produced in a single boiling. The boiling temperature had no obvious change with the increased of heating power, and the condenser section temperature increased with the heating power.


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