Flexural properties of three-dimensional printed continuous wire polymer composites

2019 ◽  
Vol 35 (12) ◽  
pp. 1471-1482
Author(s):  
Yehia Ibrahim ◽  
Garrett W. Melenka ◽  
Roger Kempers
Nanoscale ◽  
2021 ◽  
Author(s):  
Shaoyang Xiong ◽  
Yue Qin ◽  
Linhong Li ◽  
Guoyong Yang ◽  
Maohua Li ◽  
...  

In order to meet the requirement of thermal performance with the rapid development of high-performance electronic devices, constructing a three-dimensional thermal transport skeleton is an effective method for enhancing thermal...


RSC Advances ◽  
2016 ◽  
Vol 6 (27) ◽  
pp. 22364-22369 ◽  
Author(s):  
Zhiduo Liu ◽  
Dianyu Shen ◽  
Jinhong Yu ◽  
Wen Dai ◽  
Chaoyang Li ◽  
...  

Three dimensional graphene foam incorporated into epoxy matrix greatly enhance its thermal conductivity (up to 1.52 W mK−1) at low graphene foam loading (5.0 wt%), over an eight-fold enhancement in comparison with that of neat epoxy.


Author(s):  
S. Xu ◽  
O. Rezvanian ◽  
M. A. Zikry

A new finite element (FE) modeling method has been developed to investigate how the electrical-mechanical-thermal behavior of carbon nanotube (CNT)–reinforced polymer composites is affected by electron tunneling distances, volume fraction, and physically realistic tube aspect ratios. A representative CNT polymer composite conductive path was chosen from a percolation analysis to establish the three-dimensional (3D) computational finite-element (FE) approach. A specialized Maxwell FE formulation with a Fermi-based tunneling resistance was then used to obtain current density evolution for different CNT/polymer dispersions and tunneling distances. Analyses based on thermoelectrical and electrothermomechanical FE approaches were used to understand how CNT-epoxy composites behave under electrothermomechanical loading conditions.


1972 ◽  
Vol 45 (6) ◽  
pp. 1604-1622 ◽  
Author(s):  
D. H. Kaelble

Abstract This discussion has outlined a series of considerations which begin with engineering definitions of system response of adhesive joints and end with propositions involving molecular interactions at interfaces. Connecting these extreme aspects of the argument is the central subject of the micromechanics of bonding and fracture. Cavitation theory, as simply described by Equations (6a) and (7), illustrates the scale of microresponse in which both the thermodynamic and rheological aspects of adhesion phenomena achieve a parity when applied to cavities of radius r=0.1 to 10 μ. The discussion of the micromechanics of polymer fracture provides ample evidence that pure materials, polymer composites, and adhesive joints, need to be described in terms of their microdefects. The several mathematical models for crack propagation which are imposed upon fracture mechanics data tend to oversimplify the visualization of the true micromechanisms of fracture. The fuller development of micromechanics theory and experimental analysis promises to be an important area of current developments in the better understanding of macroscopic response of filled systems, fiber reinforced composites, and adhesively bonded structures. Recent developments in the several theories of intermolecular forces and the physical chemistry of bonding provide new impetus to the chemist to design optimized polymeric materials with finely adjusted balances of surface and bulk properties. The fuller visualization of adsorption-interdiffusion bonding as a process involving both the two-dimensional interface and the three-dimensional interphase defines bonding as both a thermodynamical and a rheological process. The microstages of bond formation are somewhat the reverse of the stages of microfracture listed earlier. The microdefects that commonly exist in polymeric materials and polymer composites tend to indicate that the viscoelastic constraints typical of polymer chains and networks play an important role in preventing equilibrium bonding in the simple thermodynamic sense as expressed by idealized liquid—liquid or liquid—solid interactions. The current development and application of a refined thermodynamical and rheological argument to both bonding and fracture processes stands as a central issue in directly correlating the molecular criteria of adhesion and performance of bonded systems. Any of the simple mathematical relations introduced in this discussion may be expressed with greater detail and precision by incorporating detailed statements concerning chemical composition, macromolecular structure, and free volume state of the polymeric adhesive.


2013 ◽  
Vol 25 (13) ◽  
pp. 7221-7224 ◽  
Author(s):  
Binbin Li ◽  
Jianxun Zhu ◽  
Zhaofeng Chen ◽  
Yun Jiang ◽  
Fangtian Hu

Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.


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