Microstructure evolution, mechanical behavior, and fracture analysis of ultrasonic-assisted stir-squeeze cast high strength AA7068/ZrO2p/Grp composite under thermal aging

2021 ◽  
pp. 1-20
Author(s):  
Ashish Kumar Singh ◽  
Sanjay Soni ◽  
Ravindra Singh Rana
Keyword(s):  
Mechanical Behavior ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
High Strength ◽  
Fracture Analysis ◽  
Squeeze Cast ◽  
Ultrasonic Assisted

scholarly journals Mechanical Behavior and Microstructure Evolution of a Ti-15Mo/TiB Titanium–Matrix Composite during Hot Deformation

Metals ◽  
2019 ◽  
Vol 9 (11) ◽  
pp. 1175 ◽  
Author(s):  
Sergey Zherebtsov ◽  
Maxim Ozerov ◽  
Margarita Klimova ◽  
Dmitry Moskovskikh ◽  
Nikita Stepanov ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Matrix Composite ◽  
Microstructure Evolution ◽  
Room Temperature ◽  
Processing Map ◽  
High Strength ◽  
Titanium Matrix ◽  
Titanium Matrix Composite ◽  
Plasma Sintering ◽  
Spark Plasma

A Ti-15Mo/TiB titanium–matrix composite (TMC) was produced by spark plasma sintering at 1400 °C under a load of 40 MPa for 15 min using a Ti-14.25(wt.)%Mo-5(wt.)%TiB2 powder mixture. Microstructure evolution and mechanical behavior of the composite were studied during uniaxial compression at room temperature and in a temperature range of 500–1000 °C. At room temperature, the composite showed a combination of high strength (the yield strength was ~1500 MPa) and good ductility (~22%). The microstructure evolution of the Ti-15Mo matrix was associated with the development of dynamic recovery at 500–700 °C and dynamic recrystallization at higher temperatures (≥800 °C). The apparent activation energy of the plastic deformation was calculated and a processing map for the TMC was constructed using the obtained results.

scholarly journals Influence of carbon on the mechanical behavior and microstructure evolution of CoCrFeMnNi processed by high pressure torsion

Materialia ◽  
2021 ◽  
Vol 16 ◽  
pp. 101059
Author(s):  
Yemao Lu ◽  
Andrey Mazilkin ◽  
Torben Boll ◽  
Nikita Stepanov ◽  
Sergei Zherebtzov ◽  
...  
Keyword(s):  
High Pressure ◽  
Mechanical Behavior ◽  
Microstructure Evolution ◽  
High Pressure Torsion

scholarly journals Mechanical behavior and microstructure evolution during deformation of AA7075-T651

2021 ◽  
pp. 141615
Author(s):  
Biswajit Dalai ◽  
Marie Anna Moretti ◽  
Paul Åkerström ◽  
Corinne Arvieu ◽  
Dimitri Jacquin ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Microstructure Evolution

Microstructures and Mechanical Behavior of Bulk Nanocrystalline γ–Ni–Fe Produced by a Mechanochemical Method

2002 ◽  
Vol 17 (5) ◽  
pp. 991-1001 ◽  
Author(s):  
X. Y. Qin ◽  
J. S. Lee ◽  
C. S. Lee
Keyword(s):  
Yield Strength ◽  
Mechanical Behavior ◽  
Light Emission ◽  
Hot Isostatic Pressing ◽  
Microstructural Analysis ◽  
High Strength ◽  
Compression Tests ◽  
Mechanochemical Method ◽  
Force Microscopy ◽  
Bulk Nanocrystalline

The microstructures and mechanical behavior of bulk nanocrystalline γ–Ni–xFe (n-Ni–Fe) with x = ∼19–21 wt%, synthesized by a mechanochemical method plus hot-isostatic pressing, were investigated using microstructural analysis [x-ray diffraction, energy-dispersive spectroscopy, light emission spectrum, atomic force microscopy (AFM), and optical microscopy (OM)], and mechanical (indentation and compression) tests, respectively. The results indicated that the yield strength (σ0.2) of n-Ni–Fe (d ∼ 33 nm) is about 13 times greater than that of conventional counterpart. The change of yield strength with grain size was basically in agreement with Hall–Petch relation in the size range (33–100 nm) investigated. OM observations demonstrated the existence of two sets of macroscopic bandlike deformation traces mostly orienting at 45–55° to the compression axis, while AFM observations revealed that these bandlike traces consist of ultrafine lines. The cause for high strength and the possible deformation mechanisms were discussed based on the characteristics of microstructures and deformation morphology of n-Ni–Fe.

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

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