3D Characterization of super-smooth surfaces of diamond turned OFHC copper mirrors

2002 ◽  
Vol 17 (2) ◽  
pp. 269-280 ◽  
Author(s):  
Z. W. Zhong ◽  
Y. G. Lu
Keyword(s):  
Ofhc Copper ◽  
Smooth Surfaces

Novel Noncontact Thickness Metrology for Partially Transparent and Nontransparent Wafers for Backend Semiconductor Manufacturing

2004 ◽  
Vol 829 ◽  
Author(s):  
Wojciech J. Walecki ◽  
Vitali Souchkov ◽  
Kevin Lai ◽  
Phuc Van ◽  
Manuel Santos ◽  
...  
Keyword(s):  
Semiconductor Manufacturing ◽  
Rough Surfaces ◽  
Optical Interferometry ◽  
Smooth Surfaces ◽  
Low Coherence ◽  
Low Coherence Interferometry ◽  
Single Probe ◽  
Thin Semiconductor ◽  
Compound Materials

ABSTRACTSingle probe infrared low coherence optical interferometry has been proven to be an effective tool for characterization of thin and ultra-thin semiconductor Si and compound materials wafers. Its application was however limited to wafers transparent at probing wavelength, and having relatively smooth surfaces. Purpose of this paper is to present an extension of low coherence interferometry to characterization of non-transparent wafers, and wafers with rough surfaces.

scholarly journals Laser Optical Characterization of Smooth Surfaces with Respect to Roughness and Defects in the Micrometer Range

2011 ◽  
Vol 19 ◽  
pp. 235-240 ◽  
Author(s):  
D. Kruse ◽  
S. Patzelt ◽  
C. Dollinger ◽  
A. Tausendfreund ◽  
G. Goch
Keyword(s):  
Optical Characterization ◽  
Smooth Surfaces

A note on special cubic fourfolds of small discriminants

2021 ◽  
Vol 33 (5) ◽  
pp. 1137-1155
Author(s):  
Hoang Le Truong ◽  
Hoang Ngoc Yen
Keyword(s):  
Complete Intersection ◽  
Rational Surface ◽  
Explicit Construction ◽  
Smooth Surfaces ◽  
Liaison Class ◽  
Cubic Fourfold

Abstract In this paper, our purpose is to give a characterization of the generic special cubic fourfold which contains a smooth rational surface of degree 9 not homologous to a complete intersection. As corollaries, we will give an explicit construction of families of smooth surfaces in generic special cubic fourfolds X ∈ 𝒞 δ {X\in\mathcal{C}_{\delta}} for 6 < δ ≤ 30 {6<\delta\leq 30} and δ ≡ 0 ( mod 6 ) {\delta\equiv 0~{}(\bmod~{}6)} . This applies in particular to give an explicit construction of two different liaison class of smooth surfaces in all such special cubic fourfolds with the prescribed invariants.

Linear Defects Generated by Inclusion of Hydrogen in Nickel Electrodeposit

1976 ◽  
Vol 34 ◽  
pp. 642-643
Author(s):  
S. Nakahara
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Structural Characterization ◽  
Nickel Film ◽  
Ofhc Copper ◽  
Linear Defects ◽  
Transmission Electron ◽  
A Current ◽  
Nickel Electrodeposit

During the course of structural characterization of nickel electrodeposit, we have found that there are a large number of linear defects which are different from dislocations. This communication reports a detailed analysis of these defects using transmission electron microscopy.Nickel film was prepared by electrodeposition from a bath containing 0.43 M NiSO4-6H2O and 0.5 M H3BO3. The pH of the bath was adjusted to 1.5. A sheet of annealed OFHC copper was used as the substrate. All the platings were carried out at 30°C.Nickel film plated at a current density of 5 MA/cm2 contained these linear Refects. Figures l(a), (b), and (c) show micrographs of the film taken with g = 200, 220, and 131, respectively. The images of the defects are indicated by four fine arrows in Fig. 1(c). They were not easily discernible with low-order g's such as 111, 200, and 220 (see Figs. 1(a) and (b)).

Roughness characterization of EUV multilayer coatings and ultra-smooth surfaces by light scattering

2012 ◽  
Author(s):  
M. Trost ◽  
S. Schröder ◽  
C. C. Lin ◽  
A. Duparré ◽  
A. Tünnermann
Keyword(s):  
Light Scattering ◽  
Multilayer Coatings ◽  
Smooth Surfaces

scholarly journals The Development, Evaluation, and Antioxidant Activity Analysis of Chitosan Microcapsules Containing Red Ginger Oleoresin with Sodium Tripolyphosphate Prepared by Emulsion Cross-linking Technique

2021 ◽  
Vol 15 (1) ◽  
pp. 40-46
Author(s):  
Jayanudin Jayanudin ◽  
◽  
Mohammad Fahrurrozi ◽  
Sang Kompiang Wirawan ◽  
Rochmadi Rochmadi ◽  
...  
Keyword(s):  
Antioxidant Activity ◽  
Particle Size ◽  
Encapsulation Efficiency ◽  
Sodium Tripolyphosphate ◽  
Activity Analysis ◽  
Cross Linking ◽  
Smooth Surfaces ◽  
Development Evaluation ◽  
Red Ginger

In this study, chitosan-based carrier of red ginger oleoresin was prepared using the emulsion cross-linking technique with sodium tripolyphosphate (TPP) as a cross-linking agent. The effect of chitosan and TPP concentration, as well as pH on the encapsulation efficiency, particle size and characterization of chitosan microcapsule was determined. The antioxidant activity of microcapsules was analyzed. Chitosan microcapsules containing red ginger oleoresin were produced although with non-smooth surfaces.

Characterization of Hardening Behavior at Ultra-High Strain Rate, Large Strain, and High Temperature

2016 ◽  
Vol 725 ◽  
pp. 138-142
Author(s):  
Ming Jun Piao ◽  
Hoon Huh ◽  
Ik Jin Lee
Keyword(s):  
High Temperature ◽  
High Strain ◽  
Large Strain ◽  
Thermal Softening ◽  
Ofhc Copper ◽  
Strain Rates ◽  
High Strain Rates ◽  
Softening Effect ◽  
Wide Range

This paper is concerned with the characterization of the OFHC copper flow stress at strain rates ranging from 10−3 s−1 to 106 s−1 considering the large strain and high temperature effects. Several uniaxial material tests with OFHC copper are performed at a wide range of strain rates from 10−3 s−1 to 103 s−1 by using a INSTRON 5583, a High Speed Material Testing Machine (HSMTM), and a tension split Hopkinson pressure bar. In order to consider the thermal softening effect, tensile tests at 25°C and 200°C are performed at strain rates of 10−3 s−1,101 s−1, and 102 s−1. A modified thermal softening model is considered for the accurate application of the thermal softening effect at high strain rates. The large strain behavior is challenged by using the swift power law model. The high strain rates behavior is fitted with the Lim–Huh model. The hardening curves are evaluated by comparing the final shape of the projectile from numerical simulation results with the Taylor impact tests.

Sign in / Sign up

Export Citation Format

Share Document