Bottom-up nanoscale patterning and selective deposition on silicon nanowires

2021 ◽  
Author(s):  
Amar Mohabir ◽  
Daniel Aziz ◽  
Amy Brummer ◽  
Kathleen Taylor ◽  
Eric Vogel ◽  
...  

Abstract We demonstrate a bottom-up process for programming the deposition of coaxial thin films aligned to the underlying dopant profile of semiconductor nanowires. Our process synergistically combines three distinct methods – vapor-liquid-solid (VLS) nanowire growth, selective coaxial lithography via etching of surfaces (SCALES), and area-selective atomic layer deposition (AS-ALD) – into a cohesive whole. Here, we study ZrO2 on Si nanowires as a model system. Si nanowires are first grown with an axially modulated n-Si/i-Si dopant profile. SCALES then yields coaxial poly(methyl methacrylate) (PMMA) masks on the n-Si regions. Subsequent AS-ALD of ZrO2 occurs on the exposed i-Si regions and not on those masked by PMMA. We show the spatial relationship between nanowire dopant profile, PMMA masks, and ZrO2 films, confirming the programmability of the process. The nanoscale resolution of our process coupled with the plethora of available AS-ALD chemistries promises a range of future opportunities to generate structurally complex nanoscale materials and electronic devices using entirely bottom-up methods.

2021 ◽  
Vol 2 (1) ◽  
pp. 100297
Author(s):  
Samuel M. Dull ◽  
Shicheng Xu ◽  
Timothy Goh ◽  
Dong Un Lee ◽  
Drew Higgins ◽  
...  

2013 ◽  
Vol 125 (42) ◽  
pp. 11325-11329 ◽  
Author(s):  
Pengcheng Dai ◽  
Jin Xie ◽  
Matthew T. Mayer ◽  
Xiaogang Yang ◽  
Jinhua Zhan ◽  
...  

2011 ◽  
Vol 11 (05) ◽  
pp. 959-966 ◽  
Author(s):  
YI-TING LIN ◽  
YU-HONG YU ◽  
YU CHEN ◽  
GUO-JUN ZHANG ◽  
SHI-YANG ZHU ◽  
...  

Vertical silicon nanowire (SiNW) platforms are candidates for use in ultrasensitive biosensors, with surface-to-volume ratio higher than one-dimensional SiNW . In this paper, a vertical SiNW electrolyte–insulator–semiconductor (EIS) structure with an ALD-HfO2 sensing membrane is proposed for use in a hydrogen ion sensor. Hafnium dioxide is used as the sensing membrane, which was deposited on the surface of the vertical SiNW structure by atomic layer deposition. The sensing properties were examined using a HP4284A high-precision LCR analyzer. A linear relationship was found between the flatband voltage shift and the hydrogen ion concentration. Comparing with different diameters of SiNW , the sensitivity with diameter of 200 nm was slightly higher than 100 nm. A post-deposition rapid thermal annealing (RTA) was utilized to optimize the sensing properties, and the sensitivity was increased to 51.07 mV/pH.


Nano Letters ◽  
2014 ◽  
Vol 14 (3) ◽  
pp. 1559-1566 ◽  
Author(s):  
Soong Ju Oh ◽  
Nathaniel E. Berry ◽  
Ji-Hyuk Choi ◽  
E. Ashley Gaulding ◽  
Hangfei Lin ◽  
...  

ChemPhysChem ◽  
2010 ◽  
pp. n/a-n/a ◽  
Author(s):  
Vladimir A. Sivakov ◽  
Katja Höflich ◽  
Michael Becker ◽  
Andreas Berger ◽  
Thomas Stelzner ◽  
...  

2020 ◽  
Author(s):  
Polla Rouf ◽  
Rouzbeh Samii ◽  
Karl Rönnby ◽  
Babak Bakhit ◽  
Sydney Buttera ◽  
...  

Gallium nitride (GaN) is the main component of modern-day high electron mobility transistor electronic devices due to its favorable electronic properties. As electronic devices become smaller with more complex architecture, the ability to deposit high-quality GaN films at low temperature is required. Herein, we report a new highly volatile Ga(III) triazenide precursor and demonstrate its ability to deposit high-quality epitaxial GaN by atomic layer deposition (ALD). This new Ga(III) triazenide precursor, the first hexacoordinated M–N bonded Ga(III) precursor used in a vapor deposition process, was easily synthesized and purified by sublimation. Thermogravimetric analysis showed single step volatilization with an onset temperature of 150 °C and negligible residual mass. Three temperature intervals with self-limiting growth were observed when depositing GaN films. In the second growth interval, the films were found to be near stoichiometric with very low levels of impurities and epitaxial orientation on 4H-SiC without an AlN seed layer. The films grown at 350 °C were found to be smooth with a sharp interface between the substrate and film. The bandgap of these films was 3.41 eV with the Fermi level at 1.90 eV, showing that the GaN films were unintentionally <i>n</i>-type doped. This new triazenide precursor enables ALD of GaN for semiconductor applications and provides a new Ga(III) precursor for future deposition processes.


2018 ◽  
Vol 236-237 ◽  
pp. 139-146 ◽  
Author(s):  
Octavio Graniel ◽  
Viktoriia Fedorenko ◽  
Roman Viter ◽  
Igor Iatsunskyi ◽  
Grzegorz Nowaczyk ◽  
...  

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