Negative transconductance effect in p-GaN gate AlGaN/GaN HEMTs by traps in unintentionally doped GaN buffer layer

2019 ◽  
Vol 28 (10) ◽  
pp. 107301 ◽  
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Mei Ge ◽  
Qing Cai ◽  
Bao-Hua Zhang ◽  
Dun-Jun Chen ◽  
Li-Qun Hu ◽  
...  
2013 ◽  
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H.S. Kang ◽  
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S.M. Jeon ◽  
Y.J. Kim ◽  
...  

2017 ◽  
Vol 215 (2) ◽  
pp. 1700368 ◽  
Author(s):  
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Qing Cai ◽  
Baohua Zhang ◽  
Dunjun Chen ◽  
Liqun Hu ◽  
...  

2015 ◽  
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Máire Power ◽  
James W. Pomeroy ◽  
Yohei Otoki ◽  
Takeshi Tanaka ◽  
Jiro Wada ◽  
...  

2010 ◽  
Vol 53 (9) ◽  
pp. 1578-1581 ◽  
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Yong Wang ◽  
NaiSen Yu ◽  
DongMei Deng ◽  
Ming Li ◽  
Fei Sun ◽  
...  

2008 ◽  
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pp. 7238
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Ren Fan ◽  
Hao Zhi-Biao ◽  
Wang Lai ◽  
Li Hong-Tao ◽  
...  

2019 ◽  
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Jinseok Choi ◽  
Youngmin Hwang ◽  
Sung Jin An ◽  
Jea-Seung Roh ◽  
...  

2008 ◽  
Vol 1068 ◽  
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Ewa Dumiszewska ◽  
Wlodek Strupinski ◽  
Piotr Caban ◽  
Marek Wesolowski ◽  
Dariusz Lenkiewicz ◽  
...  

ABSTRACTThe influence of growth temperature on oxygen incorporation into GaN epitaxial layers was studied. GaN layers deposited at low temperatures were characterized by much higher oxygen concentration than those deposited at high temperature typically used for epitaxial growth. GaN buffer layers (HT GaN) about 1 μm thick were deposited on GaN nucleation layers (NL) with various thicknesses. The influence of NL thickness on crystalline quality and oxygen concentration of HT GaN layers were studied using RBS and SIMS. With increasing thickness of NL the crystalline quality of GaN buffer layers deteriorates and the oxygen concentration increases. It was observed that oxygen atoms incorporated at low temperature in NL diffuse into GaN buffer layer during high temperature growth as a consequence GaN NL is the source for unintentional oxygen doping.


1999 ◽  
Vol 572 ◽  
Author(s):  
S. Ruvimov ◽  
Z. Liliental-Weber ◽  
J. Washburn ◽  
Y. Kim ◽  
G. S. Sudhir ◽  
...  

ABSTRACTTransmission electron microscopy was employed to study the effect of N/Ga flux ratio in the growth of GaN buffer layers on the structure of GaN epitaxial layers grown by molecular-beamepitaxy (MBE) on sapphire. The dislocation density in GaN layers was found to increase from 1×1010 to 6×1010 cm−2 with increase of the nitrogen flux from 5 to 35 sccm during the growth of the GaN buffer layer with otherwise the same growth conditions. All GaN layers were found to contain inversion domain boundaries (IDBs) originated at the interface with sapphire and propagated up to the layer surface. Formation of IDBs was often associated with specific defects at the interface with the substrate. Dislocation generation and annihilation were shown to be mainly growth-related processes and, hence, can be controlled by the growth conditions, especially during the first growth stages. The decrease of electron Hall mobility and the simultaneous increase of the intensity of “green” luminescence with increasing dislocation density suggest that dislocation-related deep levels are created in the bandgap.


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