scholarly journals UV/Ozone Treatment and Open-Air Copper Plasmonics

2021 ◽  
Vol 2015 (1) ◽  
pp. 012148
Author(s):  
V. R. Solovey ◽  
D. I. Yakubovsky ◽  
G. A. Ermolayev ◽  
Y. Y. Lebedinskij ◽  
A. M. Markeev ◽  
...  

Abstract Thin copper films with thickness ∼28 nm deposited on SiO2 substrate with the vacuum electron beam evaporation method and treated by UV-ozone are studied. It was found that a UV-ozone treatment of the copper film causes rapid formation of the thin ∼3-4 nm oxide film. XPS analysis showed that CuO oxide predominates in this film. The formed oxide film effectively protects the copper against the following oxidation. The presented method of UV-ozone treatment is a simpler and cheaper approach compared to many other ways to form protective coatings of copper to preserve its functional properties. This method can be useful in nanoelectronic, nanooptical, and biosensors applications.

2001 ◽  
Vol 7 (S2) ◽  
pp. 1280-1281
Author(s):  
M.J. Campin ◽  
J.C. Barbour ◽  
J.W. Braithwaite ◽  
Jane G. Zhu

The corrosion of copper is an important area in materials science because of the widespread use of copper in structural devices and electronics. These widespread uses in conjunction with its thermodynamic instability in most atmospheric conditions have prompted numerous atmospheric copper corrosion studies. The goal of these investigations has been to identify the underlying mechanisms by which corrosion proceeds in order to prevent any detrimental corrosion effects. Despite these studies, the microstructure of copper and its oxides remains poorly understood. Therefore, our investigation is concentrated on determining this microstructure.In our investigation, copper films are electron-beam evaporated onto SiO2 coated Si wafers and then exposed to an electron-cyclotron-resonance (ECR) O2 plasma, which simulates an aggressive oxidizing environment. The ECR-grown oxide is fully oxidized to CuO at the surface and changes to CU2O further into the sample. The thickness of the oxide layer is controlled by the sample exposure time to the ECR plasma.


1984 ◽  
Vol 40 ◽  
Author(s):  
J. T. Wetzel ◽  
D. A. Smith ◽  
G. Appleby-Mougham

AbstractCopper was deposited by electron beam evaporation onto both freshly cleaved bare and polyimide-coated (001) NaCl at substrate temperatures of 20°, 100°, 200° and 300°C at rates of 2 and 20,Åsec−1. For all substrate temperatures and deposition rates investigated, the Volmer-Weber mode of film growth was observed for copper both on polyimide and on NaCl. Comparisons of film growth on the two substrates for a constant substrate temperature revealed differences in film thickness at which copper became continuous or formed a completely coalesced film. It was found that copper grown on polyimide formed continuous and completely coalesced films at smaller film thicknesses than on NaCI. However once a completely coalesced film was obtained, grain growth in the copper films proceeded more rapidly on NaC1 substrates than on polyimide substrates.


2020 ◽  
Vol 64 (1-4) ◽  
pp. 1261-1268
Author(s):  
Shu Otani ◽  
Dang-Trang Nguyen ◽  
Kozo Taguchi

In this study, a portable and disposable paper-based microbial fuel cell (MFC) was fabricated. The MFC was powered by Rhodopseudomonas palustris bacteria (R. palustris). An activated carbon sheet-based anode pre-loaded organic matter (starch) and R. palustris was used. By using starch in the anode, R. palustris-loaded on the anode could be preserved for a long time in dry conditions. The MFC could generate electricity on-demand activated by adding water to the anode. The activated carbon sheet anode was treated by UV-ozone treatment to remove impurities and to improve its hydrophilicity before being loaded with R. palustris. The developed MFC could generate the maximum power density of 0.9 μW/cm2 and could be preserved for long-term usage with little performance degradation (10% after four weeks).


1985 ◽  
Vol 131 (3-4) ◽  
pp. 261-266 ◽  
Author(s):  
M. Denhoff ◽  
B. Heinrich ◽  
A.E. Curzon ◽  
S. Gygax

2007 ◽  
Vol 201 (13) ◽  
pp. 6078-6083 ◽  
Author(s):  
C. Rebholz ◽  
M.A. Monclus ◽  
M.A. Baker ◽  
P.H. Mayrhofer ◽  
P.N. Gibson ◽  
...  

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