Bioinspired design and optimization for thin film wearable and building cooling systems

Author(s):  
Jonathan Grinham ◽  
Matthew James Hancock ◽  
Kitty Kumar ◽  
Martin Bechthold ◽  
Donald E. Ingber ◽  
...  
2010 ◽  
Vol 37 (8) ◽  
pp. 3980-3994 ◽  
Author(s):  
E. Ishmael Parsai ◽  
Diana Shvydka ◽  
Jun Kang

2015 ◽  
Vol 35 (9) ◽  
pp. 0931001
Author(s):  
李资政 Li Zizheng ◽  
杨海贵 Yang Haigui ◽  
王笑夷 Wang Xiaoyi ◽  
王彤彤 Wang Tongtong ◽  
申振峰 Shen Zhenfeng ◽  
...  

2013 ◽  
Vol 6 (6) ◽  
pp. 105-114 ◽  
Author(s):  
Chang-Jin Boo ◽  
Jeong-Hyuk Kim ◽  
Ho-Chan Kim ◽  
Min-Jae Kang ◽  
Kwang Lee

Author(s):  
Tunc Icoz ◽  
Yogesh Jaluria

This paper presents a methodology for the design and optimization of the cooling system for electronic equipment. In this approach, inputs from both experimentation and numerical modeling are to be used concurrently to obtain an acceptable or optimal design. The experimental conditions considered are driven by the numerical simulation, and vice versa. Thus, the two approaches are employed in conjunction, rather than separately, as is the case in traditional design methods. Numerical simulation is used to consider different geometries, materials and dimensions, whereas experiments are used for obtaining results for different flow rates and heat inputs, since these can often be varied more easily in experiments than in simulations. Also, transitional and turbulent flows are more accurately and more conveniently investigated experimentally. Thus, by using both the approaches concurrently, the entire design domain is covered, leading to a rapid, convergent, and realistic design process. Two simple configurations of electronic cooling systems are used to demonstrate this approach.


Author(s):  
Masoud Daneshi ◽  
Ebrahim Shirani

In this research, we consider the generation of conductive heat trees at micro and nano scales for cooling electronics which are considered as heat-generating disc-shaped solids. Due to the development of nano technology and its role in the production of small scale electronics in recent decades, the necessity of designing cooling systems for them will be revealed more than any other time. Therefore, tree-shape conduction paths of highly conductive material including radial patterns, structures with one level of branching, tree-with-loop architectures, and combination of structures with branching and structures with loop are generated for cooling such electronic devices. Furthermore, Constructal method which is used to analytically generate heat trees for cooling a disk-shaped body is modified in the present work, that we call it modified analytical method. Moreover, every feature of the tree-shaped architectures is optimized numerically to make a comparison between numerical and analytical results and to generate novel architectures. When the smallest features of the internal structure are so small, the conventional description of conduction breaks down. Hence, the effective thermal conductivity exhibits the “size effect”, and is governed by the smallest structural dimension which is comparable with the mean free path of the energy carriers. Therefore, we consider a model which was proposed for small-scale bodies in order to evaluate conductivity of heat trees.


2013 ◽  
Vol 03 (02) ◽  
pp. 1350008 ◽  
Author(s):  
Mahmoud A. Hamad

In this work, ferroelectric SbSI shows a giant electrocaloric effect at room temperature under very low electric field shift of 0.37 kV cm-1. It is shown that the cooling ΔT per unit field MVm-1 is 2.97. This value is significantly larger, and is comparable with the value of 0.254 for PbZr 0.95 Ti 0.05 O 3 thin film under electric field shift of 30 kV cm-1. Moreover, the reduction in operating temperature opens up many more possibilities and widens the potential for applications in cooling systems.


2016 ◽  
Vol 850 ◽  
pp. 679-686
Author(s):  
He Li ◽  
Yi Mei ◽  
Bo Lin ◽  
Hua Qiang Xiao

Cooling system is important in the quality and the efficiency of forming plastic parts. The heat transfer model for conformal chimney cavity and straight pipe cooling system was developed employing thermal analysis module of UG software. The temperature field distributions of two cavities were analyzed. The differences in chimney forming warping deformations, shrinkage and freeze times for the two types of cooling systems were analyzed quantitatively by Moldflow software. The results showed that the temperature field distribution of the conformal cooling system was more homogeneous and the forming quality and efficiency of molding for the plastic parts was better. Finally, the cooling system parameters were optimized through orthogonal test and range analysis method.


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