Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards
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2011 ◽
Vol 19
(9)
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pp. 2154-2162
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2001 ◽
Vol I.01.1
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pp. 333-334
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2002 ◽
Vol 25
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pp. 51-58
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2008 ◽
Vol 31
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pp. 185-191
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1994 ◽
Vol 116
(3)
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pp. 184-190
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