scholarly journals Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs

2011 ◽  
Author(s):  
Yi Zhao ◽  
Saqib Khursheed ◽  
Bashir M. Al-Hashimi
Keyword(s):  
Cost Effective ◽  
Yield Improvement ◽  
3D Ics

Cost Effective Production of Glass Interposers for 3D ICs Using APEX(TM) Glass Ceramic

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001269-001290
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; electrical leakage and lack of improved electrical performance beyond 16nm. As a result, industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this talk, we will present on our efforts in glass interposers fabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. Life MicroFab's APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitchs, in 125 micron thick APEX™ Glass ceramic. We will present (1) on our efforts producing high aspect ratio TGVs in thin (500-250 micron) and ultra thin (250-75 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

Cost-effective yield improvement in fault-tolerant VLSI memory

1981 ◽  
Author(s):  
J. Bindels ◽  
J. Chlipala ◽  
F. Fischer ◽  
T. Mantz ◽  
R. Nelson ◽  
...  
Keyword(s):  
Fault Tolerant ◽  
Cost Effective ◽  
Yield Improvement ◽  
Effective Yield

CC-RTSV: Cross-Cellular Based Redundant TSV Design for 3D ICs

2019 ◽  
Vol 29 (11) ◽  
pp. 2050144
Author(s):  
Tianming Ni ◽  
Yue Shu ◽  
Hao Chang ◽  
Lin Lu ◽  
Guangzhen Dai ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Three Dimensional ◽  
Cost Effective ◽  
Bonding Process ◽  
High Yield ◽  
Repair Rate ◽  
3D Ics ◽  
Simulation Results ◽  
Silicon Vias

Due to the winding level of the thinned wafers and the surface roughness of silicon dies, the quality of through-silicon vias (TSVs) varies during the fabrication and bonding process. If one TSV exhibits a defect during its manufacturing process, the probability of multiple defects occurring in the TSVs neighboring increases the faulty TSVs (FTSV), i.e., the TSV defects tend to be clustered which significantly reduces the yield of three-dimensional integrated circuits (3D-ICs). To resolve the clustered TSV faults, router-based and ring-based redundant TSV (RTSV) architecture were proposed. However, the repair rate is low and the hardware overhead is high. In this paper, we propose a novel cross-cellular based RTSV architecture to utilize the area more efficiently as well as to maintain high yield. The simulation results show that the proposed architecture has higher repair rate as well as more cost-effective overhead, compared with router-based and ring-based methods.

scholarly journals The Application of Ribosome Engineering to Natural Product Discovery and Yield Improvement in Streptomyces

Antibiotics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 133 ◽  
Author(s):  
Saibin Zhu ◽  
Yanwen Duan ◽  
Yong Huang
Keyword(s):  
Natural Product ◽  
Ribosomal Proteins ◽  
Cost Effective ◽  
Gene Clusters ◽  
Product Formation ◽  
Biosynthetic Gene ◽  
Biosynthetic Gene Clusters ◽  
Yield Improvement ◽  
Ribosome Engineering ◽  
Natural Product Discovery

Microbial natural product drug discovery and development has entered a new era, driven by microbial genomics and synthetic biology. Genome sequencing has revealed the vast potential to produce valuable secondary metabolites in bacteria and fungi. However, many of the biosynthetic gene clusters are silent under standard fermentation conditions. By rational screening for mutations in bacterial ribosomal proteins or RNA polymerases, ribosome engineering is a versatile approach to obtain mutants with improved titers for microbial product formation or new natural products through activating silent biosynthetic gene clusters. In this review, we discuss the mechanism of ribosome engineering and its application to natural product discovery and yield improvement in Streptomyces. Our analysis suggests that ribosome engineering is a rapid and cost-effective approach and could be adapted to speed up the discovery and development of natural product drug leads in the post-genomic era.

A cost-effective repair scheme for clustered TSV defects in 3D ICs

2022 ◽  
Vol 129 ◽  
pp. 114460
Author(s):  
Dilip Kumar Maity ◽  
Surajit Kumar Roy ◽  
Chandan Giri
Keyword(s):  
Cost Effective ◽  
3D Ics

Cost effective Precision 3D Glass Microfabrication for Electronic Packaging

2011 ◽  
Vol 2011 (1) ◽  
pp. 000199-000201
Author(s):  
Jeb H. Flemming ◽  
Kevin Dunn ◽  
James Gouker ◽  
Carrie Schmidt ◽  
Colin Buckley
Keyword(s):  
Glass Ceramic ◽  
Cost Effective ◽  
Electrical Performance ◽  
Sensitive Material ◽  
Aspect Ratios ◽  
3D Ics ◽  
Simple Processing ◽  
Micron Diameter ◽  
On Chip ◽  
Processing Steps

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.

The application of electron microscopy to diagnosis in gynecologic neoplasms and tumor-like conditions

1984 ◽  
Vol 42 ◽  
pp. 102-105
Author(s):  
Lawrence M. Roth
Keyword(s):  
Electron Microscopy ◽  
Reproductive Tract ◽  
Malignant Tumors ◽  
Frozen Section ◽  
Cost Effective ◽  
Female Reproductive Tract ◽  
Ultrastructural Examination ◽  
Specific Diagnosis ◽  
Potential Value ◽  
Gynecologic Neoplasms

The female reproductive tract may be the site of a wide variety of benign and malignant tumors, as well as non-neoplastic tumor-like conditions, most of which can be diagnosed by light microscopic examination including special stains and more recently immunoperoxidase techniques. Nevertheless there are situations where ultrastructural examination can contribute substantially to an accurate and specific diagnosis. It is my opinion that electron microscopy can be of greatest benefit and is most cost effective when applied in conjunction with other methodologies. Thus, I have developed an approach which has proved useful for me and may have benefit for others. In cases where it is deemed of potential value, glutaraldehyde-fixed material is obtained at the time of frozen section or otherwise at operation. Coordination with the gynecologic oncologist is required in the latter situation. This material is processed and blocked and is available if a future need arises.

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