Localized substrate removal technique enabling strong-confinement microphotonics in bulk Si CMOS processes

2008 ◽  
Author(s):  
Charles W. Holzwarth ◽  
Jason S. Orcutt ◽  
Hanqing Li ◽  
Milos A. Popovic ◽  
Vladimir Stojanovic ◽  
...  
Keyword(s):  
Substrate Removal ◽  
Removal Technique ◽  
Strong Confinement ◽  
Cmos Processes

Characterization of Dislocations in HgCdTe Heteroepitaxial Layers Using a New Substrate Removal Technique

2009 ◽  
Vol 38 (8) ◽  
pp. 1746-1754 ◽  
Author(s):  
P. Lamarre ◽  
C. Fulk ◽  
D. D’Orsogna ◽  
E. Bellotti ◽  
F. Smith ◽  
...  
Keyword(s):  
Substrate Removal ◽  
Removal Technique ◽  
Heteroepitaxial Layers

A Study of Pad Contamination Defect and Removal

2008 ◽  
Author(s):  
K.A. Mohammad ◽  
L.J. Liu ◽  
S.F. Liew ◽  
S.F. Chong ◽  
D.G. Lee ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Gate Oxide ◽  
Action Plans ◽  
Preventive Action ◽  
Oxide Breakdown ◽  
Reliability Level ◽  
The Future ◽  
Dry Etch ◽  
Removal Technique

Abstract The paper focuses on the pad contamination defect removal technique. The defect is detected at the outgoing inspection step. The failure analysis results showed that the defect is Fluorine type contamination. The failure analysis indicated many source contributors mainly from Fluorine based processes. The focus is in the present work is in the rework method for the removal of this defect. The combination of wet and dry etch processing in the rework routine is utilized for the removal of the defect and preventive action plans for in-line were introduced and implemented to avoid this event in the future. The reliability of the wafer is verified using various tests including full map electrical, electrical sort, gate oxide breakdown (GOI) and wafer reliability level, passivation quick kill to ensure the integrity of the wafer after undergoing the rework routine. The wafer is monitored closely over a period of time to ensure it has no mushroom defect.

Combine Micro-Probing and OBIRCH to Catch Non-Recognizable Fault in RF and Mixed-Mode Integrated Circuits

2007 ◽  
Author(s):  
Cha-Ming Shen ◽  
Yen-Long Chang ◽  
Lian-Fon Wen ◽  
Tan-Chen Chuang ◽  
Shi-Chen Lin ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Radio Frequency ◽  
Failure Analysis ◽  
Case Studies ◽  
Mixed Mode ◽  
Failure Mechanisms ◽  
Deep Submicron ◽  
Digital Logic ◽  
Successful Approach ◽  
Cmos Processes

Abstract Highly-integrated radio frequency and mixed-mode devices that are manufactured in deep-submicron or more advanced CMOS processes are becoming more complex to analyze. The increased complexity presents us with many eccentric failure mechanisms that are uniquely different from traditional failure mechanisms found during failure analysis on digital logic applications. This paper presents a novel methodology to overcome the difficulties and discusses two case studies which demonstrate the application of the methodology. Through the case studies, the methodology was proven to be a successful approach. It is also proved how this methodology would work for such non-recognizable failures.

Biofilm Structure – An Important and Neglected Parameter in Waste Water Treatment

1989 ◽  
Vol 21 (8-9) ◽  
pp. 805-814 ◽  
Author(s):  
F. R. Christensen ◽  
G. Holm Kristensen ◽  
J. la Cour Jansen
Keyword(s):  
Wastewater Treatment ◽  
Structural Changes ◽  
Waste Water Treatment ◽  
Experimental Investigations ◽  
Biofilm Reactors ◽  
Substrate Removal ◽  
Treatment Processes ◽  
Laboratory Reactor ◽  
Biofilm Structure ◽  
Kinetics Of

Experimental investigations on the kinetics of wastewater treatment processes in biofilms were performed in a laboratory reactor. Parallel with the kinetic experiments, the influence of the biofilm kinetics on the biofilm structure was studied at macroscopic and microscopic levels. The close interrelationship between biofilm kinetics and structural changes caused by the kinetics is illustrated by several examples. From the study, it is evident that the traditional modelling of wastewater treatment processes in biofilm reactors based on substrate removal kinetics alone will fail in many cases, due to the inevitable changes in the biofilm structure not taken into consideration. Therefore design rules for substrate removal in biofilms used for wastewater treatment must include correlations between the removal kinetics and the structure and development of the biological film.

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