Many mobile applications strive for the thinnest package possible, and therefore benefit from the high density of basic Fan Out technology. At the same time, Fan Out has evolved from a simple, single die packaging solution into a high-density solution enabling more complex 2D and 3D connectivity.
Fan Out first went into volume manufacturing in 2009 with a simple, single die package using eWLB. For the next few years, it was only thought of in this context. Then in 2016, two packages came into production that broke this stereotype. The first was a hybrid, very high-density Fan Out combined with a BGA package called FOCoS for server applications. The second was a 3D PoP structure for mobile cellular phone applications called InFO. With these structures, Fan Out became a more versatile tool, capable of wider applicability. And since then, multiple manufacturers have continued the evolution of Fan Out's capabilities into more and more packaging opportunities.
This presentation will illustrate how the integration of a wide variety of packaging technologies, wafer level processing, substrate evolution and Flip Chip packaging have all come together into both simple and complex packages structures. We will further explore the higher levels of integration and sophistication available using Fan Out as a basic manufacturing technology, describing the evolving functionality and complexity achieved by combining low cost materials and innovative process flows. By using such combinations of tools and processes, the resulting packages are only limited by our imagination and creativity.
Non-destructive Evaluation of Solder Ball Joints in BGA Package by Infrared Thermography