Characterization of on-die power supply noise in FCBGA (Flip-chip ball grid array) packages

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897339 ◽

2014 ◽

Author(s):

Hyunho Baek ◽

William R. Eisenstadt

Keyword(s):

Power Supply ◽

Flip Chip ◽

Ball Grid Array ◽

Power Supply Noise ◽

Supply Noise ◽

Ball Grid Array Packages

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Characterization of molded underfill material for flip chip ball grid array packages

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.927737 ◽

2002 ◽

Author(s):

F. Liu ◽

Y.P. Wang ◽

K. Chai ◽

T.D. Her

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Ball Grid Array Packages ◽

Underfill Material

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Distributed On-chip Power Supply Noise Characterization of the Cell Broadband Engine

2007 IEEE Electrical Performance of Electronic Packaging ◽

10.1109/epep.2007.4387134 ◽

2007 ◽

Author(s):

Yaping Zhou ◽

Paul M. Harvey ◽

Brian Flachs ◽

John Liberty ◽

Gilles Gervais ◽

...

Keyword(s):

Power Supply ◽

Power Supply Noise ◽

Cell Broadband Engine ◽

Supply Noise ◽

On Chip ◽

Noise Characterization

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The Characterization of Power Supply Noise for Optical Mouse Sensor

2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium ◽

10.1109/iemt.2006.4456504 ◽

2006 ◽

Author(s):

M.K. Md Arshad ◽

U. Hashim ◽

Chew Ming Choo

Keyword(s):

Power Supply ◽

Power Supply Noise ◽

Supply Noise ◽

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AC Power Supply Noise Simulation of CMOS Microprocessor with LSI Chip-Package-Board Integrated Model

IEICE Transactions on Electronics ◽

10.1587/transele.e97.c.264 ◽

2014 ◽

Vol E97.C (4) ◽

pp. 264-271 ◽

Author(s):

Kumpei YOSHIKAWA ◽

Kouji ICHIKAWA ◽

Makoto NAGATA

Keyword(s):

Power Supply ◽

Integrated Model ◽

Power Supply Noise ◽

Supply Noise ◽

Noise Simulation ◽

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Power-Supply-Noise-Aware Timing Analysis and Test Pattern Regeneration

IEICE Transactions on Fundamentals of Electronics Communications and Computer Sciences ◽

10.1587/transfun.e99.a.2320 ◽

2016 ◽

Vol E99.A (12) ◽

pp. 2320-2327

Author(s):

Cheng-Yu HAN ◽

Yu-Ching LI ◽

Hao-Tien KAN ◽

James Chien-Mo LI

Keyword(s):

Power Supply ◽

Test Pattern ◽

Timing Analysis ◽

Power Supply Noise ◽

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Power Supply Noise-Aware Scan Test Pattern Reshaping for At-Speed Delay Fault Testing of Monolithic 3D ICs *

2020 IEEE 29th Asian Test Symposium (ATS) ◽

10.1109/ats49688.2020.9301568 ◽

2020 ◽

Author(s):

Shao-Chun Hung ◽

Yi-Chen Lu ◽

Sung Kyu Lim ◽

Krishnendu Chakrabarty

Keyword(s):

Power Supply ◽

Test Pattern ◽

Power Supply Noise ◽

Fault Testing ◽

Delay Fault ◽

Delay Fault Testing ◽

3D Ics ◽

Scan Test ◽

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Thermal characterization of plastic ball grid array packages via infrared thermography

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) ◽

10.1109/ectc.2001.928010 ◽

2002 ◽

Author(s):

L. Sweatlock ◽

D. Lischner ◽

J. Weiss

Keyword(s):

Infrared Thermography ◽

Ball Grid Array ◽

Thermal Characterization ◽

Plastic Ball ◽

Plastic Ball Grid Array ◽

Ball Grid Array Packages

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A GALS Design with Opposite-Phase Local Clock Assignment for Power Supply Noise Reduction

2018 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) ◽

10.1109/apccas.2018.8605670 ◽

2018 ◽

Author(s):

Nguyen Van Toan ◽

Dam Minh Tung ◽

Jeong-Gun Lee

Keyword(s):

Noise Reduction ◽

Power Supply ◽

Power Supply Noise ◽

Local Clock ◽

Opposite Phase ◽

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Single-chip multi-processor integrating quadruple 8-way vliw processors with interface timing analysis considering power supply noise

Asia and South Pacific Conference on Design Automation, 2006. ◽

10.1109/aspdac.2006.1594741 ◽

2006 ◽

Author(s):

S. Imai ◽

A. Inoue ◽

M. Matsumura ◽

K. Kawasaki ◽

A. Suga

Keyword(s):

Power Supply ◽

Timing Analysis ◽

Power Supply Noise ◽

Single Chip ◽

Vliw Processors ◽

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Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) ◽

10.1109/iemt.2008.5507785 ◽

2008 ◽

Author(s):

Victor Lim ◽

Ibrahim Ahmad ◽

Foong Chee Seng ◽

Nowshad Amin ◽

Rozaidi Rasid

Keyword(s):

Flip Chip ◽

Ball Grid Array ◽

Catalytic Activation ◽

Heat Spreaders ◽

Ball Grid Array Package

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