Warpage Analysis with Newly Molding Material of Fan-Out Panel Level Packaging and the Board Level Reliability Test Results

2018 ◽  
Author(s):  
Kazuhiro Kikuchi ◽  
Yuusuke Nedzu ◽  
Takashi Sugino
Keyword(s):  
Reliability Test ◽  
Test Results ◽  
Molding Material ◽  
Board Level ◽  
Board Level Reliability

A study of board level reliability test with bump structure of WLCSP lead-free solder joints

2007 ◽  
Author(s):  
Frank Kao ◽  
Zhi Hao Tseng ◽  
Chun Sheng Ho ◽  
Stan Chen ◽  
Chang-Yi Lan ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Reliability Test ◽  
Lead Free Solder ◽  
Free Solder ◽  
Board Level ◽  
Board Level Reliability

Board level reliability test of MPBGA assembly

2003 ◽  
Author(s):  
Chi-Sheng Chung ◽  
P.J. Zheng ◽  
S.C. Lee ◽  
J.D. Wu
Keyword(s):  
Reliability Test ◽  
Board Level ◽  
Board Level Reliability

Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill

2007 ◽  
Author(s):  
Joon-Yeob Lee ◽  
Tae-Kyung Hwang ◽  
Jin-Young Kim ◽  
Min Yoo ◽  
Eun-Sook Sohn ◽  
...  
Keyword(s):  
Reliability Test ◽  
Board Level ◽  
Board Level Reliability

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

Use-Conditions-Based Board Level Shock Test Development for Handheld Components

2004 ◽  
Author(s):  
Shubhada Sahasrabudhe ◽  
Vinayak Pandey ◽  
Betty Phillips ◽  
Kang Joon Lee ◽  
Lei Mercado
Keyword(s):  
Solder Joint ◽  
Cell Phone ◽  
Standardized Test ◽  
Test Development ◽  
Failure Mechanisms ◽  
Reliability Test ◽  
Shock Test ◽  
Board Level ◽  
Test Repeatability

For handheld electronic applications such as cell phones and Personal Digital Assistants (PDAs), drop/impact could result in considerable flexure of the printed circuit board (PCB) mounted inside the cell phone housing. The mechanical stresses may cause electrical failure of the components, with typical failure mechanisms of board trace cracking, solder joint fatigue, and solder pad cracking. A standardized test needs to be developed to assess reliability of handheld components subjected to impacts. The test should facilitate high volume testing, maximize margin for safety factors, and capture the failure mechanisms in the field environment. To develop the reliability test using use conditions based reliability methodology, comprehensive characterization of the mechanical field stresses during end use conditions is particularly essential. This paper discusses complete cell phone drop characterization along with the shock test developed to test the components subjected to such drops. Novel fixtures have been designed to simulate free fall of the cell phone in specific orientations. After the complete characterization of cell phone use conditions, board level shock test has been selected to assess component reliability. Test repeatability, number of components on the test board, and layout of the components are some of the factors considered during the board level shock test development. Several parameters like screw and washer designs, torque have been studied to yield excellent test repeatability. Nonlinear Dynamic Finite Element Simulation has been performed to provide more insight into the interaction of the bending modes and its impact on the solder joint failures. This paper demonstrates the process of understanding use conditions, developing reliability tests, validating test results and driving industry standards.

The Influence of Understanding Accounting Information Systems, Leadership Style, Employee Motivation, and Work Discipline in Employees Performance KC BRI Sidoarjo

Academia Open ◽  
2021 ◽  
Vol 5 ◽  
Author(s):  
Shafrino Wahyu ◽  
Herman Ernandi
Keyword(s):  
Information Systems ◽  
Leadership Style ◽  
Hypothesis Test ◽  
Accounting Information ◽  
Research Data ◽  
Reliability Test ◽  
Test Results ◽  
Accounting Information Systems ◽  
Validity Test ◽  
Systems Leadership

This research aims to know the influence of understanding Accounting Information Systems, Leadership Style, Employees Motivation, and Work Discipline in Employees Performance at KC BRI Sidoarjo. The instrument is in the form of google forms to get research data. This research data collection is validity test and reliability test. The hypothesis is that there is an the influence of understanding accounting information systems, leadership style, employees motivation, and work discipline in employees performance. The analytical tool used to test the hypothesis is SPSS version 18. The test results based on the validity test show that all questions on Google Forms are declared valid. While the test results based on the reliability test of all variables, the value of cronbach's alpha > 0,6 means that it is declared reliable and for the results of the Hypothesis Test in the form of T-Statistic and R-Square, it states that there is an influence between understanding accounting information systems, leadership style, employees motivation, and work discipline in employees performance. This is shown from the results of tcount for the variable understanding of the accounting information system (X1) of 2.113, the variable of leadership style (X2) of 2.101, the variable of employees motivation (X3) of 2.114, and the variable of work discipline (X4) of 2.189.

Experimental location of damage in microelectronic solder joints after a board level reliability evaluation

2018 ◽  
Vol 83 ◽  
pp. 131-140 ◽  
Author(s):  
I-Chih Wu ◽  
Min-Haw Wang ◽  
Ling-Sheng Jang
Keyword(s):  
Solder Joints ◽  
Reliability Evaluation ◽  
Board Level ◽  
Board Level Reliability
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