High-frequency modeling and signal integrity analysis of high-density silicone rubber socket

Author(s):  
Hyesoo Kim ◽  
Junyong Park ◽  
Shinyoung Park ◽  
Jonghoon J. Kim ◽  
Joungho Kim ◽  
...  
Author(s):  
Hyesoo Kim ◽  
Jonghoon J. Kim ◽  
Junyong Park ◽  
Shinyoung Park ◽  
Sumin Choi ◽  
...  

ETRI Journal ◽  
2019 ◽  
Vol 41 (5) ◽  
pp. 670-683 ◽  
Author(s):  
Hyukje Kwon ◽  
Wonok Kwon ◽  
Myeong‐Hoon Oh ◽  
Hagyoung Kim

2003 ◽  
Vol 783 ◽  
Author(s):  
Paul Franzon ◽  
Angus Kingon ◽  
Stephen Mick ◽  
John Wilson ◽  
Lei Luo ◽  
...  

ABSTRACTAC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 75 μm and signaling rates greater than 5 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches, status, and discusses material issues important to performance.


2004 ◽  
Vol 27 (4) ◽  
pp. 611-629 ◽  
Author(s):  
E. Matoglu ◽  
N. Pham ◽  
D.N. deAraujo ◽  
M. Cases ◽  
M. Swaminathan

Author(s):  
Abhijit Dharchoudhury ◽  
David Blaauw ◽  
Shantanu Ganguly

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