SPICE model extraction for signal integrity analysis of unshielded twisted pairs from full wave simulation

2006 ◽  
Author(s):  
R. Araneo ◽  
S. Caniggia ◽  
F. Maradei
Keyword(s):  
Signal Integrity ◽  
Model Extraction ◽  
Spice Model ◽  
Wave Simulation ◽  
Full Wave ◽  
Integrity Analysis

scholarly journals Power Integrity Analysis of Power Distribution Network Segmented Using DGS–Electromagnetic Bandgap Structure in Mixed-Signal PCBs

Electronics ◽  
2020 ◽  
Vol 9 (12) ◽  
pp. 2036
Author(s):  
Myunghoi Kim
Keyword(s):  
Power Distribution ◽  
Domain Decomposition Method ◽  
Distribution Network ◽  
Power Integrity ◽  
Electromagnetic Bandgap ◽  
Power Distribution Network ◽  
Wave Simulation ◽  
Full Wave ◽  
Resonant Modes ◽  
Integrity Analysis

In this paper, we present the power integrity analysis of a power distribution network (PDN) employing a segmentation technique based on the electromagnetic bandgap (EBG) structure with a defected ground structure (DGS). For efficient analysis of power integrity, a domain decomposition method (DDM) with a novel modeling of the DGS–EBG-based PDN is presented. In the DDM, analytical models for the partitioned parts of the PDN are developed, and their impedance parameters are analytically extracted. The resonant modes for the power integrity analysis are rigorously examined using the DDM and electric-field distribution. The effect of the DGS–EBG stopband on the resonant modes are analyzed. The proposed DDM and power integrity analysis are verified using full-wave simulation and measurements. The DDM result shows good agreement with the full-wave simulation and measurements.

Signal Integrity Analysis of High-Speed Differential Vias

2014 ◽  
Vol 548-549 ◽  
pp. 754-759 ◽  
Author(s):  
Ling Bao Zhao ◽  
Qing Hua Chen
Keyword(s):  
High Speed ◽  
Signal Integrity ◽  
Data Rate ◽  
Electronic Systems ◽  
Impedance Mismatch ◽  
Package Design ◽  
Paper Detail ◽  
Full Wave ◽  
Integrity Analysis

In modern electronic systems, data rate is keeping increase, and Gbps becomes common, designing for reliable signal integrity becomes more and more important. In the high speed borad/package design, discontinuities are big concerns of signal integrity. A variety of sources lead to discontinuities and every source ought to be carefully treated. The signal via is one source of discontinuity that should not be overlooked. Vias can add jitter and reduce eye openings that can cause data misinterpretation by the receiver. This paper detail the antipad, pad and excess via stub effect on the vias. In each case, the impedance mismatch at the via transition can be minimized by optimizing a few parameters such as antipad radius, pad radius and excess via stub. The impacts of these parameters are investigated with the help for a full-wave 3D electromagnetic simulator.

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