Finite Element Analysis of a high voltage semiconductor polymeric package design using a Taguchi based experimental design

Author(s):  
N. S. Nobeen ◽  
D. C. Whalley ◽  
D. A. Hutt ◽  
B. Haworth
Energies ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1262
Author(s):  
Alessandro Mingotti ◽  
Federica Costa ◽  
Lorenzo Peretto ◽  
Roberto Tinarelli ◽  
Paolo Mazza

Stray capacitances (SCs) are a serious issue in high-voltage (HV) applications. Their presence can alter the circuit or the operation of a device, resulting in wrong or even disastrous consequences. To this purpose, in this work, we describe the modeling of SCs in HV capacitive dividers. Such modeling does not rely on finite element analysis or complicated geometries; instead, it starts from an equivalent circuit of a conventional measurement setup described by the standard IEC 61869-11. Once the equivalent model including the SCs is found, closed expressions of the SCs are derived starting from the ratio error definition. Afterwards, they are validated in a simulation environment by implementing various circuit configurations. The results demonstrate the expressions applicability and effectiveness; hence, thanks to their simplicity, they can be implemented by system operators, researchers, and manufacturers avoiding the use of complicated methods and technologies.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000094-000099 ◽  
Author(s):  
Laura Mirkarimi ◽  
Rajesh Katkar ◽  
Ron Zhang ◽  
Rey Co ◽  
Zhijun Zhao

We are developing a new solution for wide I/O package on package applications, which is Bond Via Array (BVA) technology. The prototype vehicle built in this study has 1020 I/O's at a pitch of 0.24 mm with a high aspect ratio of approximately 10:1 and is ≤1.4 mm tall. PoP applications require large bandwidth and thinner packages challenging package developers to address warpage control for high yield processes. The design optimization of this package was established through rigorous finite element analysis of materials selection and structural modifications. The simulation methodology was validated by measuring the warpage as a function of temperature for the experimental prototypes. The details for the simulation and verification processes for the wide I/O process will be discussed. The variation between finite element analysis predictions and the experimental builds was ~10%, which allowed us to complete package design optimization with our simulation tools. The prototype build includes a standard and a low CTE substrate.


2018 ◽  
Vol 34 (1) ◽  
pp. 397-421 ◽  
Author(s):  
Guo-Liang Ma ◽  
Qiang Xie ◽  
Andrew Whittaker

High-voltage (HV) bushings are attached to a power transformer tank either directly or indirectly via turrets. Turrets are used to achieve electrical performance requirements, but their potential impact on the seismic performance of the supported bushings has not been considered. Earthquake simulator testing and finite-element analysis were used to quantify the amplification of ground shaking through tanks (220- and 500-kV) and turrets to the points of attachment of roof- and sidewall-supported bushings. Substantial amplification of motion was seen in both physical experiments and numerical simulations. Sample bracing schemes external to the transformer tank were investigated to potentially reduce the motions experienced by the bushings. Bushing tip displacements were reduced in all stiffening cases studied, but the outcomes for bending moment at the bushing-turret connection were mixed, with no change in some cases and significant reductions in others. The physical and numerical studies described in this paper make clear the importance of dynamic interaction of bushings, turrets, and the power transformer tank. The methods currently used to address the amplification of input motion from the base of a tank to the points of attachment of its bushing are inadequate. The seismic design of HV power transformer tanks and turrets should be supported by finite-element analysis of validated models to avoid dynamic interaction in the bushing-turret-tank system, to minimize seismic demand on the transformer bushings, and to minimize the risk of substation damage in earthquakes.


2004 ◽  
Vol 44 (4) ◽  
pp. 611-619 ◽  
Author(s):  
Xiaowu Zhang ◽  
E.H. Wong ◽  
Charles Lee ◽  
Tai-Chong Chai ◽  
Yiyi Ma ◽  
...  

2001 ◽  
Author(s):  
Tiao Zhou

Abstract Reliability issues are discussed for a plastic laminate-based package with partially exposed die active area. Thermal-mechanical stresses are calculated with finite element analysis to examine the effect of encapsulant in comparison with a similar package with die fully encapsulated. Different material and geometry configurations are studied to assess the optimization of the package design.


2012 ◽  
Vol 48 (2) ◽  
pp. 955-958 ◽  
Author(s):  
Jun Zhang ◽  
Shuhong Wang ◽  
Jie Qiu ◽  
Haibo Li ◽  
Qiuhui Zhang ◽  
...  

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