An Adaptive Machine Learning Method based on Finite Element Analysis for Ultra Low-k Chip Package Design

Author(s):  
Weishen Chu ◽  
Paul S. Ho ◽  
Wei Li
Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1654
Author(s):  
Poojitha Vurtur Badarinath ◽  
Maria Chierichetti ◽  
Fatemeh Davoudi Kakhki

Current maintenance intervals of mechanical systems are scheduled a priori based on the life of the system, resulting in expensive maintenance scheduling, and often undermining the safety of passengers. Going forward, the actual usage of a vehicle will be used to predict stresses in its structure, and therefore, to define a specific maintenance scheduling. Machine learning (ML) algorithms can be used to map a reduced set of data coming from real-time measurements of a structure into a detailed/high-fidelity finite element analysis (FEA) model of the same system. As a result, the FEA-based ML approach will directly estimate the stress distribution over the entire system during operations, thus improving the ability to define ad-hoc, safe, and efficient maintenance procedures. The paper initially presents a review of the current state-of-the-art of ML methods applied to finite elements. A surrogate finite element approach based on ML algorithms is also proposed to estimate the time-varying response of a one-dimensional beam. Several ML regression models, such as decision trees and artificial neural networks, have been developed, and their performance is compared for direct estimation of the stress distribution over a beam structure. The surrogate finite element models based on ML algorithms are able to estimate the response of the beam accurately, with artificial neural networks providing more accurate results.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000094-000099 ◽  
Author(s):  
Laura Mirkarimi ◽  
Rajesh Katkar ◽  
Ron Zhang ◽  
Rey Co ◽  
Zhijun Zhao

We are developing a new solution for wide I/O package on package applications, which is Bond Via Array (BVA) technology. The prototype vehicle built in this study has 1020 I/O's at a pitch of 0.24 mm with a high aspect ratio of approximately 10:1 and is ≤1.4 mm tall. PoP applications require large bandwidth and thinner packages challenging package developers to address warpage control for high yield processes. The design optimization of this package was established through rigorous finite element analysis of materials selection and structural modifications. The simulation methodology was validated by measuring the warpage as a function of temperature for the experimental prototypes. The details for the simulation and verification processes for the wide I/O process will be discussed. The variation between finite element analysis predictions and the experimental builds was ~10%, which allowed us to complete package design optimization with our simulation tools. The prototype build includes a standard and a low CTE substrate.


2020 ◽  
Vol 39 (15-16) ◽  
pp. 587-598 ◽  
Author(s):  
Vahid Daghigh ◽  
Thomas E Lacy ◽  
Hamid Daghigh ◽  
Grace Gu ◽  
Kourosh T Baghaei ◽  
...  

Tailorability is an important advantage of composites. Incorporating new bio-reinforcements into composites can contribute to using agricultural wastes and creating tougher and more reliable materials. Nevertheless, the huge number of possible natural material combinations works against finding optimal composite designs. Here, machine learning was employed to effectively predict fracture toughness properties of multiscale bio-nano-composites. Charpy impact tests were conducted on composites with various combinations of two new bio fillers, pistachio shell powders, and fractal date seed particles, as well as nano-clays and short latania fibers, all which reinforce a poly(propylene)/ethylene–propylene–diene-monomer matrix. The measured energy absorptions obtained were used to calculate strain energy release rates as a fracture toughness parameter using linear elastic fracture mechanics and finite element analysis approaches. Despite the limited number of training data obtained from these impact tests and finite element analysis, the machine learning results were accurate for prediction and optimal design. This study applied the decision tree regressor and adaptive boosting regressor machine learning methods in contrast to the K-nearest neighbor regressor machine learning approach used in our previous study for heat deflection temperature predictions. Scanning electron microscopy, optical microscopy, and transmission electron microscopy were used to study the nano-clay dispersion and impact fracture morphology.


2004 ◽  
Vol 44 (4) ◽  
pp. 611-619 ◽  
Author(s):  
Xiaowu Zhang ◽  
E.H. Wong ◽  
Charles Lee ◽  
Tai-Chong Chai ◽  
Yiyi Ma ◽  
...  

Author(s):  
Ishita Chakraborty

Abstract Centralizer subs are run in conjunction with the casing strings in the oil/gas wells to ensure that the casing is centralized while it is installed down hole. Centralizer subs are fabricated of stronger material than the casing strings and designed such that it can sustain a higher collapse pressure than the attached tubing string. A typical centralizer sub is a tube with some complex geometrical features, so the collapse pressure of a centralizer sub can only be estimated by conducting a finite element analysis or subjecting it to a collapse pressure test. Both the options are time consuming and expensive. In this work, a machine learning based regression model is used to derive a parametric equation for calculating the collapse pressure of a centralizer sub. The data needed to train and cross validate the regression model is obtained from finite element analysis (FEA). This machine learning based equation provides a closer estimate of the collapse pressure of the centralizer subs to the results obtained from the FEA than the existing collapse prediction equations from API RP 1111. This machine learning based estimation of collapse pressure will help in correctly predicting the collapse rating of the centralizer sub without performing FEA or testing for each individual subs. This approach of building machine learning models from data generated from FEA can be used for analysis of other equipment as well. With the availability of past data collected/generated through years, the recent advances in machine learning can be used to save time and resources.


2001 ◽  
Author(s):  
Tiao Zhou

Abstract Reliability issues are discussed for a plastic laminate-based package with partially exposed die active area. Thermal-mechanical stresses are calculated with finite element analysis to examine the effect of encapsulant in comparison with a similar package with die fully encapsulated. Different material and geometry configurations are studied to assess the optimization of the package design.


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