A Non-Through Silicon Via 1000+ IO Package On Package Solution For Wide IO Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000094-000099 ◽  
Author(s):  
Laura Mirkarimi ◽  
Rajesh Katkar ◽  
Ron Zhang ◽  
Rey Co ◽  
Zhijun Zhao
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
High Yield ◽  
Element Analysis ◽  
Package Design ◽  
Simulation Methodology ◽  
Structural Modifications ◽  
Simulation Tools ◽  
Large Bandwidth

We are developing a new solution for wide I/O package on package applications, which is Bond Via Array (BVA) technology. The prototype vehicle built in this study has 1020 I/O's at a pitch of 0.24 mm with a high aspect ratio of approximately 10:1 and is ≤1.4 mm tall. PoP applications require large bandwidth and thinner packages challenging package developers to address warpage control for high yield processes. The design optimization of this package was established through rigorous finite element analysis of materials selection and structural modifications. The simulation methodology was validated by measuring the warpage as a function of temperature for the experimental prototypes. The details for the simulation and verification processes for the wide I/O process will be discussed. The variation between finite element analysis predictions and the experimental builds was ~10%, which allowed us to complete package design optimization with our simulation tools. The prototype build includes a standard and a low CTE substrate.

Design Optimization of the Aerial Lift Boom through the Finite-Element Analysis (FEA)

2011 ◽  
Vol 295-297 ◽  
pp. 1564-1567
Author(s):  
Yong Hong ◽  
Seokjun Yu ◽  
Jaejung Lee ◽  
Hyeonsu Ha ◽  
Dong Pyo Hong
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Design Optimization ◽  
Experimental Method ◽  
General Purpose ◽  
Element Analysis ◽  
Actual Experiment ◽  
Multi Stage ◽  
The Finite Element Analysis ◽  
Aerial Platform

The multi-stage boom consisting of several booms is used in order to develop the aerial platform truck that can be used in a working radius that is higher and safe. Because the length increases compared with the width or the height of the structure, the intensity and rigidity are lowered along with the safety. Accordingly, a countermeasure is needed. Therefore, in this research, when designing of the high ground work difference Boom System, the safety the stress of the considered boom the analyze method and experimental method tries to be evaluated through the comparison. The finite-element analysis(FEA) compared the Strain value which is obtained through the resolution value and actual experiment by using the Ansys,that is the general purpose program, and proved this safety.

Thermo-mechanical finite element analysis in a multichip build up substrate based package design

2004 ◽  
Vol 44 (4) ◽  
pp. 611-619 ◽  
Author(s):  
Xiaowu Zhang ◽  
E.H. Wong ◽  
Charles Lee ◽  
Tai-Chong Chai ◽  
Yiyi Ma ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Element Analysis ◽  
Package Design

scholarly journals Finite Element Analysis of Springback of High-Strength Metal SCGA1180DUB While U-Channeling, According to Wall Angle and Die Radius

2021 ◽  
Author(s):  
Samet Karabulut ◽  
İsmail Esen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Sheet Thickness ◽  
High Strength ◽  
Sheet Forming ◽  
High Yield ◽  
Process Conditions ◽  
Wall Angle ◽  
Element Analysis ◽  
Multi Phase

Abstract Springback is a problem as important as tearing or thinning, while forming high-strength sheets. Springback is an undesirable situation and it is the form difference between the desired form of a part in theory and the form obtained due to mechanical characteristics and process inputs of the material after die forming. It affects operations in shearing, punching or bending dies in subsequent operations in forming die sets. If the part is not within the desired tolerance range, it creates problems during assembly. In order for cost effective production plans for automotive parts to be made, suitable sheet forming simulations are needed. Waste of time and failures during die construction are minimized by defining accurate parameters by finite element analyses and minimizing periods of trial-and-error. In this study, the material SCGA1180DUB in sheet thickness of 0.8 mm from multi-phase steel sheet group was U-channeled, using Autoform sheet forming analysis program, according to appropriate process conditions having wall angles of 7°,10°,12° and die radius values of R3, R5, R8 and the springback values were estimated. The results obtained were compared through the finite element program and suitable wall angle and die radius values for the material SCGA1180DUB for forming advanced high-strength sheets were determined. As the die radii increased at the same wall angles, the amount of spring back increased significantly. In particular, due to high yield and tensile strength of multi-phase high strength sheet, springback values were observed to be high. Negative springbacks were observed in the roof of the part. In the same die radii, under the same process conditions, as wall angles increase, springback values decreased. In the literature, it is interesting that there are few studies regarding forming, springback of high-strength sheets SCGA1180DUB. This study will contribute to the literature. Autoform program was used for Finite Element Analysis.

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