Understanding and Optimizing Hybrid SSD with High-Density and Low-Cost Flash Memory

Author(s):  
Liang Shi ◽  
Longfei Luo ◽  
Yina Lv ◽  
Shicheng Li ◽  
Changlong Li ◽  
...  
Keyword(s):  
Low Cost ◽  
2019 ◽  
Vol 8 (10) ◽  
pp. P567-P572
Author(s):  
Peizhen Hong ◽  
Zhiliang Xia ◽  
Huaxiang Yin ◽  
Chunlong Li ◽  
Zongliang Huo

2021 ◽  
Author(s):  
Ben Gu ◽  
Longfei Luo ◽  
Yina Lv ◽  
Changlong Li ◽  
Liang Shi

Author(s):  
Yina Lv ◽  
Liang Shi ◽  
Longfei Luo ◽  
Changlong Li ◽  
Chun Jason Xue ◽  
...  

2007 ◽  
Vol 1030 ◽  
Author(s):  
Jeroen van den Brand ◽  
Erik Veninga ◽  
Roel Kusters ◽  
Tomas Podprocky ◽  
Andreas Dietzel

AbstractA novel, cost effective technology to manufacture high density embedded electronic circuitry is demonstrated. The process consists of laser photoablation of the circuitry into a substrate through a mask and subsequent filling using a polymer thick film paste. Because the volume of the substrate is used it is possible to make thick and thereby highly conductive lines using low cost materials and processes. The process is demonstrated for a fan out circuitry in 100 µm thick polyethylene naphthalate (PEN). The fan out circuitry has linewidths of 50 µm and line spacings of 100 µm. The usability of the circuitry is demonstrated by the successful flipchip bonding of a thinned Si daisy chain dummy chip with 176 IO's.


2018 ◽  
Vol 28 (4) ◽  
pp. 984-996 ◽  
Author(s):  
Xuebin Zhang ◽  
Danni Xiong ◽  
Kai Zhao ◽  
Chang Wen Chen ◽  
Tong Zhang

Author(s):  
Young-Tak Seo ◽  
Dongseok Kwon ◽  
Yoohyun Noh ◽  
Soochang Lee ◽  
Min-Kyu Park ◽  
...  

2020 ◽  
pp. 263-285
Author(s):  
Badia Bouhdid ◽  
Wafa Akkari ◽  
Sofien Gannouni

While existing localization approaches mainly focus on enhancing the accuracy, particular attention has recently been given to reducing the localization algorithm implementation costs. To obtain a tradeoff between location accuracy and implementation cost, recursive localization approaches are being pursued as a cost-effective alternative to the more expensive localization approaches. In the recursive approach, localization information increases progressively as new nodes compute their positions and become themselves reference nodes. A strategy is then required to control and maintain the distribution of these new reference nodes. The lack of such a strategy leads, especially in high density networks, to wasted energy, important communication overhead and even impacts the localization accuracy. In this paper, the authors propose an efficient recursive localization approach that reduces the energy consumption, the execution time, and the communication overhead, yet it increases the localization accuracy through an adequate distribution of reference nodes within the network.


2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000398-000424
Author(s):  
Doug Shelton ◽  
Tomii Kume

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.


2015 ◽  
Vol 2015 (1) ◽  
pp. 1-5 ◽  
Author(s):  
Dyi-Chung Hu ◽  
Yu-Min Lin ◽  
Hsiang Hung Chang ◽  
Tao-Chih Chang ◽  
Wei-Chung Lo ◽  
...  

A new concept of packaging platform calls eHDF (embedded high density film), that without any TXVs is been proposed. The eHDF uses the technology from two categories; one utilize the semiconductor fine line technology infrastructure and the other takes the advantage of laminate organic large panel process infrastructure. Hence, the fine line, better electrical performance and low cost requirements can be addressed at the same time by the eHDF packaging platform. In this paper, a test vehicle based on eHDF structure will be built and modules assembly with test chips on eHDF substrate will be performed.


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