Board Level Thermal Cycle Reliability of BGA for a New Type of Pad Structure with OSP Surface Finish

2007 ◽  
Author(s):  
Hai Liu ◽  
Jing Zhang ◽  
Song Chen ◽  
Maohua Du ◽  
Nufeng Feng ◽  
...  
Keyword(s):  
Surface Finish ◽  
Thermal Cycle ◽  
Osp Surface Finish ◽  
New Type ◽  
Board Level

Mechanical and Thermal Board Level Reliability Comparison Between Electroless Ni Im. Au and Solder on Pad Surface Finishes for Large Flip Chip BGA Packages

2006 ◽  
Author(s):  
Gnyaneshwar Ramakrishna ◽  
Donghyun Kim ◽  
Mudasir Ahamad ◽  
Lavanya Gopalakrishnan ◽  
Mason Hu ◽  
...  
Keyword(s):  
Surface Finish ◽  
Flip Chip ◽  
High Reliability ◽  
Electroless Nickel ◽  
Temperature Cycling ◽  
Design Parameters ◽  
Temperature Cycle ◽  
Bga Packages ◽  
Reliability And Robustness ◽  
Board Level

Large Flip Chip BGA (FCBGA) packages are needed in high pin out applications (>1800), e.g., ASIC's and are typically used in high reliability and robustness applications. Hence understanding the package reliability and robustness becomes one of paramount importance for efficient product design. There are various aspects to the package that need to be understood, to ensure an effective design. The focus of this paper is to understand the BGA reliability of the package with particular reference to comparison of the surface finish, vis-a`-vis, between Electroless Nickel Immersion Gold (ENIG) and Solder On Pad (SOP) on the substrate side of the package, which are the typical solutions for large plastic FC-BGA packages. Tests, which include board level temperature cycling, monotonic bend and shock testing have been conducted to compare the two surface finish options. The results of these tests demonstrate that the mechanical strength of the interface exceeds by a factor of two for the SOP surface finish, while BGA design parameters play a key role in ensuring comparative temperature cycle reliability in comparison with ENIG packages.

Investigation on the reliability of board-level interconnection under the thermal cycle loading

2014 ◽  
Author(s):  
Liqiang Zhang ◽  
Zhaohua Wu ◽  
Dongjing Liu ◽  
Xiaoming Yuan ◽  
Zhibao Li
Keyword(s):  
Thermal Cycle ◽  
Cycle Loading ◽  
Board Level

Heat Pipe Thermodynamic Cycle and its Applications

1985 ◽  
Vol 107 (2) ◽  
pp. 153-159 ◽  
Author(s):  
Y. Kobayashi
Keyword(s):  
Heat Pipe ◽  
Thermal Cycle ◽  
Thermodynamic Cycle ◽  
Basic Function ◽  
Coefficient Of Performance ◽  
Energy Sources ◽  
Thermal Systems ◽  
Industrial Sites ◽  
Extended Application ◽  
New Type

A new type of thermodynamic cycle originating from extended application of the heat pipe principle is proposed and its thermal cycle is discussed from the viewpoint of theoretical thermal efficiency and Coefficient of Performance (COP). An idealized structure that will meet the basic function for thermal systems is also suggested. A significant advantage of these systems is their use with low-temperature energy sources found in nature or heat rejected from industrial sites.

scholarly journals Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substrates

2020 ◽  
Vol 49 (12) ◽  
pp. 3201-3205
Author(s):  
Mohd Izrul Izwan Ramli ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Siti Farahnabilah Muhd Amli ◽  
Nurul Razliana Abdul Razak
Keyword(s):  
Intermetallic Compound ◽  
Solder Alloy ◽  
Surface Finish ◽  
Casting Process ◽  
Organic Solderability Preservative ◽  
Different Types ◽  
Osp Surface Finish ◽  
Interfacial Intermetallic Compound ◽  
Immersion Tin

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

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