Green flame retardance of epoxy molding compound for large-scale integrated circuit packaging

Author(s):  
Ming-shan Yang ◽  
Jian-wei Liu ◽  
Lin-kai Li
2011 ◽  
Vol 239-242 ◽  
pp. 1386-1390
Author(s):  
Ming Shan Yang ◽  
Lin Kai Li

The hexaphenylamine cyclotriphosphazene (HPACTPZ) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of HPACTPZ was analyzed by FTIR and NMR in this paper. Using HPACTPZ synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by HPACTPZ was up to UL 94 V0 rating(3.2mm) and the oxygen index of the EMC was up to 35.8%, which indicates that HPACTPZ has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, HPACTPZ accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.


2011 ◽  
Vol 216 ◽  
pp. 474-478 ◽  
Author(s):  
Ming Shan Yang ◽  
Jian Wei Liu ◽  
Lin Kai Li

The tri(o-phenylenediamine) cyclotriphosphazene (TPCTP) was synthesized using titrating technology of hexachlorocyclotriphosphazene solution and the synthesis parameters were investigated, and the structure of TPCTP was analyzed by FTIR in this paper. Using TPCTP synthesized in the work as flame retardant, the epoxy molding compound(EMC) for packaging of large-scale integrated circuits with halogen-free flame retardance was prepared. The results have shown that the flame retardance of EMC flame-retardanced by TPCTP was up to UL 94 V0 rating(1.6mm) and the oxygen index of the EMC was up to 34.5%, which indicates that TPCTP has much better flame retardance for EMC than traditional halogen flame-retardants. Meanwhile, TPCTP accelerated the curing reaction rate of EMC, which can be used for manufacturing the quick-curing EMCs or afterward-curing-free EMCs.


2017 ◽  
Vol 901 ◽  
pp. 012090 ◽  
Author(s):  
Jirayu Tachapitunsuk ◽  
Kessararat Ugsornrat ◽  
Warayoot Srisuwitthanon ◽  
Panakamon Thonglor

Author(s):  
Anan Sukantharat ◽  
Kessararat Ugsornrat ◽  
Chalermsak Sumithpibul

This research studied about an effect of epoxy molding compound material and roughness leadframe of integrated circuit package for automotive device. In manufacturing process, the epoxy molding compound material and leadframe roughness are main factors that effect to coefficient of thermal expansion (CTE) and reliability for automotive device package with no delamination in high temperature application. In experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for quad flat non lead (QFN) package. For reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside packages. The results showed that CTE of epoxy molding compound material type A is less CTE mismatch than that of epoxy molding compound material type B with both standard and roughness leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.


Author(s):  
Wei Tan ◽  
Cheng Cheng ◽  
Hongjie Liu ◽  
Yangyang Duan ◽  
Linlin Liu ◽  
...  

Nanomaterials ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 1646
Author(s):  
Jingya Xie ◽  
Wangcheng Ye ◽  
Linjie Zhou ◽  
Xuguang Guo ◽  
Xiaofei Zang ◽  
...  

In the last couple of decades, terahertz (THz) technologies, which lie in the frequency gap between the infrared and microwaves, have been greatly enhanced and investigated due to possible opportunities in a plethora of THz applications, such as imaging, security, and wireless communications. Photonics has led the way to the generation, modulation, and detection of THz waves such as the photomixing technique. In tandem with these investigations, researchers have been exploring ways to use silicon photonics technologies for THz applications to leverage the cost-effective large-scale fabrication and integration opportunities that it would enable. Although silicon photonics has enabled the implementation of a large number of optical components for practical use, for THz integrated systems, we still face several challenges associated with high-quality hybrid silicon lasers, conversion efficiency, device integration, and fabrication. This paper provides an overview of recent progress in THz technologies based on silicon photonics or hybrid silicon photonics, including THz generation, detection, phase modulation, intensity modulation, and passive components. As silicon-based electronic and photonic circuits are further approaching THz frequencies, one single chip with electronics, photonics, and THz functions seems inevitable, resulting in the ultimate dream of a THz electronic–photonic integrated circuit.


Sign in / Sign up

Export Citation Format

Share Document