High speed SiGe-HBT with very low base sheet resistivity

Author(s):  
E. Kasper ◽  
A. Gruhle ◽  
H. Kibbel
Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.


2002 ◽  
Vol 85 (7) ◽  
pp. 66-76
Author(s):  
Hiromi Shimamoto ◽  
Eiji Ohue ◽  
Katsuya Oda ◽  
Reiko Hayami ◽  
Masamichi Tanabe ◽  
...  
Keyword(s):  
Sige Hbt ◽  

1996 ◽  
Vol 74 (S1) ◽  
pp. 159-166
Author(s):  
D. C. Ahlgren ◽  
S. J. Jeng ◽  
D. Nguyen-Ngoc ◽  
K. Stein ◽  
D. Sunderland ◽  
...  

This review discusses the fundamentals of SiGe epitaxial base heterojunction bipolar transistor (HBT) technology that have been developed for use in analog and mixed-signal applications in the 1–20 GHz range. The basic principles of operation of the graded base SiGe HBT are reviewed. These principles are then used to explore the design optimization for analog applications. Device results are presented that illustrate some important trade-offs in device design. A discussion of the use of UHV/CVD for the deposition of the epitaxial base profile is followed by an overview of the integrated process. This process, which has been installed on 200 mm wafers in IBM's Advanced Semiconductor Technology Center in Hopewell Junction, N.Y., also includes a full range of support devices. The process has demonstrated SiGe HBT performance, reliability, and yield in a CMOS fabrication with the addition of only one tool for UHV/CVD deposition of the epi-base and, with minimal additional process steps, can be used to fabricate full BiCMOS designs. This paper concludes with a discussion of high-performance circuits fabricated to date, including ECL ring'oscillators, power amplifiers, low-noise amplifiers, voltage-controlled oscillators, and finally a 12-bit DAC that features nearly 3000 SiGe HBT devices demonstrating medium-scale integration.


2006 ◽  
Vol 53 (4) ◽  
pp. 857-865 ◽  
Author(s):  
M. Miura ◽  
H. Shimamoto ◽  
R. Hayami ◽  
A. Kodama ◽  
T. Tominari ◽  
...  

2010 ◽  
Vol 46 (24) ◽  
pp. 1634 ◽  
Author(s):  
D. Lin ◽  
A. Trasser ◽  
H. Schumacher

2008 ◽  
Vol 50 (6) ◽  
pp. 1498-1500
Author(s):  
Hung-Ju Wei ◽  
Chinchun Meng ◽  
YuWen Chang ◽  
Yi-Chen Lin ◽  
Guo-Wei Huang
Keyword(s):  

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