High-frequency short-pulsed metal plasma-immersion ion implantation using filtered DC vacuum-arc plasma (part two)

2012 ◽  
Author(s):  
A. I. Ryabchikov ◽  
I. B. Stepanov ◽  
D. O. Sivin ◽  
S. V. Dektyarev ◽  
K. Yu. Dodorin
Keyword(s):  
Ion Implantation ◽  
High Frequency ◽  
Vacuum Arc ◽  
Arc Plasma ◽  
Metal Plasma ◽  
Plasma Immersion Ion Implantation

Unfiltered Aluminium Vacuum Arc Plasma Application for High-Frequency Short-Pulse Plasma Immersion Ion Implantation

2014 ◽  
Vol 880 ◽  
pp. 155-160 ◽  
Author(s):  
Alexander Ryabchikov ◽  
Denis Sivin ◽  
Anna Ivanova (Bumagina) ◽  
Evgeniy Bolbasov ◽  
Natalya Daneikina
Keyword(s):  
Ion Implantation ◽  
High Frequency ◽  
Treatment Time ◽  
Short Pulse ◽  
Substrate Surface ◽  
Pulse Plasma ◽  
Vacuum Arc ◽  
Arc Plasma ◽  
Bias Potential ◽  
Plasma Immersion Ion Implantation

This paper is devoted to the studying of the dynamical changes in the density of aluminium microparticles (MPs) on the substrate surface made of stainless steel, immersed in vacuum arc plasma, at high-frequency short-pulse negative bias potential. It is shown experimentally that the density of aluminium MPs on the substrate surface is decreased dynamically by 3 orders when the treatment time is increased from 15 s to 3 min at the bias potential –2 kV. A possibility of the application of MPs unfiltered vacuum arc plasma for high-frequency short-pulse plasma immersion ion implantation to form the intermetallic layers is discussed.

scholarly journals EFFECT OF PULSED SUBSTRATE BIASING ON MACROPARTICLE IN VACUUM ARC

2019 ◽  
pp. 120-123
Author(s):  
E.V. Romashchenko ◽  
A.A. Bizyukov ◽  
I.О. Girka
Keyword(s):  
Ion Implantation ◽  
Pulse Duration ◽  
Analytical Model ◽  
Duty Cycle ◽  
Voltage Pulse ◽  
Vacuum Arc ◽  
Arc Plasma ◽  
Charge Dynamics ◽  
Proposed Model ◽  
Plasma Immersion Ion Implantation

An analytical model of the interaction of macroparticle (MP) with vacuum arc plasma in plasma immersion ion implantation (PIII) is presented. The proposed model is based on combination of the theory of charge dynamics of MP and sheath model for PIII. In the framework of this model, the MP charge dynamics during voltage pulse as well as during interval between pulses is investigated. It is obtained that MP charge and MP behavior depend on pulsed bias parameters such as pulse duration, duty cycle and bias amplitude. It is shown that pulsed substrate biasing is effective method to control of the MPs in plasma processing.

Joining of Metal Films to Carbon-Carbon Composite Material by Metal Plasma Immersion Ion Implantation

1993 ◽  
Vol 314 ◽  
Author(s):  
André Anders ◽  
Simone Anders ◽  
Ian G. Brown ◽  
Peter Chow
Keyword(s):  
Composite Materials ◽  
Ion Implantation ◽  
Plasma Deposition ◽  
Carbon Composite ◽  
Metal Films ◽  
Vacuum Arc ◽  
Metal Plasma ◽  
Carbon Composite Material ◽  
Carbon Composite Materials ◽  
Plasma Immersion Ion Implantation

AbstractAdhesion of metal films to carbon-carbon composite materials is a problem when using conventional techniques such as sputter deposition. Metal plasma immersion ion implantation is a novel technique which in combination with metal plasma deposition can produce metal-tocomposite bonding with very good adhesion characteristics. The substrate is immersed in a metal plasma which is produced by a pulsed vacuum arc. When the substrate is biased to high negative voltage the metal ions are accelerated toward and implanted into the substrate. A repetitively pulsed bias (Its pulses) is used to avoid arcing and other deleterious effects. Between high voltage pulses, metal plasma is deposited onto the surface with an energy typical of vacuum arcs, about 50–100 eV. The underlying idea of this mixed implantation-deposition technique is the formation of an extended substrate-film intermixed layer. We have demonstrated the technique for nickel films on carbon-carbon composite materials.

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