Integrated cross-layer solutions for enabling silicon photonics into future chip multiprocessors

2014 ◽  
Author(s):  
Paolo Grani ◽  
Sandro Bartolini ◽  
Emanuele Furdiani ◽  
Luca Ramini ◽  
Davide Bertozzi
Keyword(s):  
Silicon Photonics ◽  
Chip Multiprocessors ◽  
Cross Layer

WSN-HaDaS: A Cross-Layer Handoff Management Protocol for Wireless Sensor Networks, a Practical Approach to Mobility

2015 ◽  
Vol E98.B (7) ◽  
pp. 1333-1344
Author(s):  
Raymundo BUENROSTRO-MARISCAL ◽  
Maria COSIO-LEON ◽  
Juan-Ivan NIETO-HIPOLITO ◽  
Juan-Antonio GUERRERO-IBANEZ ◽  
Mabel VAZQUEZ-BRISENO ◽  
...  
Keyword(s):  
Wireless Sensor Networks ◽  
Sensor Networks ◽  
Practical Approach ◽  
Wireless Sensor ◽  
Cross Layer ◽  
Handoff Management ◽  
Management Protocol

Prediction-Based Cross-Layer Resource Allocation for Wireless Multi-Hop Networks with Outdated CSI

2014 ◽  
Vol E97.B (4) ◽  
pp. 746-754 ◽  
Author(s):  
Wei FENG ◽  
Suili FENG ◽  
Yuehua DING ◽  
Yongzhong ZHANG
Keyword(s):  
Resource Allocation ◽  
Cross Layer ◽  
Outdated Csi

CROSS LAYER OPTIMIZATION WITH QOS FOR HETEROGENOUS AD-HOC NETWORK

2019 ◽  
Vol 7 (4) ◽  
pp. 1 ◽  
Author(s):  
SETHI ANITA ◽  
VIJAY SANDIP ◽  
KUMAR RAKESH ◽  
◽  
◽  
...  
Keyword(s):  
Ad Hoc Network ◽  
Ad Hoc ◽  
Cross Layer ◽  
Cross Layer Optimization

Introduction of a Novel Sample Preparation Technique for the Failure Analysis of Silicon Integrated Photonics Modules

2019 ◽  
Author(s):  
Pradip Sairam Pichumani ◽  
Fauzia Khatkhatay
Keyword(s):  
Sample Preparation ◽  
Failure Analysis ◽  
Silicon Photonics ◽  
Cmos Technology ◽  
Single Step ◽  
Oxide Semiconductor ◽  
Disruptive Technology ◽  
Preparation Technique ◽  
Test Vehicle ◽  
Sample Preparation Technique

Abstract Silicon photonics is a disruptive technology that aims for monolithic integration of photonic devices onto the complementary metal-oxide-semiconductor (CMOS) technology platform to enable low-cost high-volume manufacturing. Since the technology is still in the research and development phase, failure analysis plays an important role in determining the root cause of failures seen in test vehicle silicon photonics modules. The fragile nature of the test vehicle modules warrants the development of new sample preparation methods to facilitate subsequent non-destructive and destructive analysis methods. This work provides an example of a single step sample preparation technique that will reduce the turnaround time while simultaneously increasing the scope of analysis techniques.

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