sign and Characterization of an SCR with separate bipolar transistors for ESD Protection

Author(s):  
Ming Wu ◽  
Zhuojun Chen
1996 ◽  
Vol 17 (1) ◽  
pp. 19-21 ◽  
Author(s):  
J. Sewell ◽  
L.L. Liou ◽  
D. Barlage ◽  
J. Barrette ◽  
C. Bozada ◽  
...  

1992 ◽  
Vol 280 ◽  
Author(s):  
N. David Theodore ◽  
Gordon Tam

ABSTRACTSiGe alloys have recently been of interest for fabrication of heterojunction bipolar transistors using pre-existing or modified silicon-processing technology. These devices are faster than devices using pure silicon. Because of the interest in developing SiGe device structures, various elements of processing relevant to fabrication of the devices are being investigated. One such element has been the use of thermal oxidation for isolation of SiGe devices. Utilization of the technique requires an understanding of oxidation behavior of SiGe layers under a variety of oxidation conditions. Past studies in the literature have investigated the oxidation of SiGe at atmospheric pressure or at very high pressures (∼650–1300 atmospheres). The present study investigates the wet-oxidation of SiGe structures at intermediate pressures (∼25 atmospheres) and temperatures (∼750°C). Unlike atmospheric oxidation, most of the Ge (from SiGe) remains in the oxidized silicon (SiO2) in the form of GeO2. Occasional segregation of Ge to the oxidizing interface is noted. The microstructural behavior of partially and entirely oxidized structures is presented.


2016 ◽  
Vol 63 (8) ◽  
pp. 3205-3212 ◽  
Author(s):  
Qi Chen ◽  
Rui Ma ◽  
Wei Zhang ◽  
Fei Lu ◽  
Chenkun Wang ◽  
...  
Keyword(s):  

1999 ◽  
Vol 38 (Part 1, No. 2B) ◽  
pp. 1200-1203 ◽  
Author(s):  
Noureddine Matine ◽  
Martin W. Dvorak ◽  
Jean-Luc Pelouard ◽  
Fabrice Pardo ◽  
Colombo R. Bolognesi

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